JPS57157553A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57157553A
JPS57157553A JP56042961A JP4296181A JPS57157553A JP S57157553 A JPS57157553 A JP S57157553A JP 56042961 A JP56042961 A JP 56042961A JP 4296181 A JP4296181 A JP 4296181A JP S57157553 A JPS57157553 A JP S57157553A
Authority
JP
Japan
Prior art keywords
silver
terminal
layer
electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56042961A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347149B2 (enExample
Inventor
Keiichi Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56042961A priority Critical patent/JPS57157553A/ja
Publication of JPS57157553A publication Critical patent/JPS57157553A/ja
Publication of JPS6347149B2 publication Critical patent/JPS6347149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/093—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56042961A 1981-03-24 1981-03-24 Semiconductor device Granted JPS57157553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042961A JPS57157553A (en) 1981-03-24 1981-03-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042961A JPS57157553A (en) 1981-03-24 1981-03-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57157553A true JPS57157553A (en) 1982-09-29
JPS6347149B2 JPS6347149B2 (enExample) 1988-09-20

Family

ID=12650622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042961A Granted JPS57157553A (en) 1981-03-24 1981-03-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57157553A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126644A (ja) * 1974-08-29 1976-03-05 Nippon Electric Co Metsukihoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126644A (ja) * 1974-08-29 1976-03-05 Nippon Electric Co Metsukihoho

Also Published As

Publication number Publication date
JPS6347149B2 (enExample) 1988-09-20

Similar Documents

Publication Publication Date Title
US5596231A (en) High power dissipation plastic encapsulated package for integrated circuit die
US6201707B1 (en) Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate
US7285866B2 (en) Surface mounted package with die bottom spaced from support board
GB1198257A (en) Improvements in Methods of Bonding Electrical Conductors
US20010040239A1 (en) Chip-type semiconductor light-emitting device
US4538143A (en) Light-emitting diode displayer
JP2794972B2 (ja) リードレスチップキャリア
JPS6432664A (en) Chip carrier and resistance element
JPS6486543A (en) Semiconductor mounting cooling structure
JPS57157553A (en) Semiconductor device
JP3420469B2 (ja) 配線基板
JP2805563B2 (ja) 反射型光結合装置およびその製造方法
JP4174407B2 (ja) 電子部品収納用パッケージ
JPS56142659A (en) Semiconductor device
JPS6311744Y2 (enExample)
JP2640009B2 (ja) 金属基板の層間接続方法
JPS5851543A (ja) 半導体装置
JP2830221B2 (ja) ハイブリッド集積回路のマウント構造
JPS5642362A (en) Package for integrated circuit
JPS5758341A (en) Electronic parts with multiple metallayers
JPH1050915A (ja) 半導体装置及びその製造方法
JPS647630A (en) Bonding structure of semiconductor device
JPS6117138B2 (enExample)
JPS5848441A (ja) 電子回路装置
JPS56161664A (en) Manufacture of lead for connecting semiconductor device