JPS57149463A - Metal-plating method of polyamide resin - Google Patents

Metal-plating method of polyamide resin

Info

Publication number
JPS57149463A
JPS57149463A JP3489781A JP3489781A JPS57149463A JP S57149463 A JPS57149463 A JP S57149463A JP 3489781 A JP3489781 A JP 3489781A JP 3489781 A JP3489781 A JP 3489781A JP S57149463 A JPS57149463 A JP S57149463A
Authority
JP
Japan
Prior art keywords
resin
solution containing
water solution
treated
polyamide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3489781A
Other languages
English (en)
Other versions
JPS6037874B2 (ja
Inventor
Shigemitsu Kawagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP3489781A priority Critical patent/JPS6037874B2/ja
Publication of JPS57149463A publication Critical patent/JPS57149463A/ja
Publication of JPS6037874B2 publication Critical patent/JPS6037874B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP3489781A 1981-03-10 1981-03-10 ポリアミド系樹脂のめつき方法 Expired JPS6037874B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3489781A JPS6037874B2 (ja) 1981-03-10 1981-03-10 ポリアミド系樹脂のめつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3489781A JPS6037874B2 (ja) 1981-03-10 1981-03-10 ポリアミド系樹脂のめつき方法

Publications (2)

Publication Number Publication Date
JPS57149463A true JPS57149463A (en) 1982-09-16
JPS6037874B2 JPS6037874B2 (ja) 1985-08-28

Family

ID=12426964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3489781A Expired JPS6037874B2 (ja) 1981-03-10 1981-03-10 ポリアミド系樹脂のめつき方法

Country Status (1)

Country Link
JP (1) JPS6037874B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106245105A (zh) * 2016-08-05 2016-12-21 广州三孚新材料科技股份有限公司 Pa10t工程塑料的无铬表面微蚀方法
WO2017203767A1 (ja) * 2016-05-26 2017-11-30 Ykk株式会社 皮膜付き樹脂基材及びその製造方法、並びに皮膜形成方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017203767A1 (ja) * 2016-05-26 2017-11-30 Ykk株式会社 皮膜付き樹脂基材及びその製造方法、並びに皮膜形成方法
WO2017203668A1 (ja) * 2016-05-26 2017-11-30 Ykk株式会社 めっき皮膜付き樹脂基材及びその製造方法、並びにめっき方法
CN109072439A (zh) * 2016-05-26 2018-12-21 Ykk株式会社 带皮膜树脂基材、其制造方法以及皮膜形成方法
US11174362B2 (en) 2016-05-26 2021-11-16 Ykk Corporation Method of producing a film-attached resin base
CN106245105A (zh) * 2016-08-05 2016-12-21 广州三孚新材料科技股份有限公司 Pa10t工程塑料的无铬表面微蚀方法

Also Published As

Publication number Publication date
JPS6037874B2 (ja) 1985-08-28

Similar Documents

Publication Publication Date Title
US4897118A (en) Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein
US4919768A (en) Electroplating process
US3930963A (en) Method for the production of radiant energy imaged printed circuit boards
US4424241A (en) Electroless palladium process
US3269861A (en) Method for electroless copper plating
CA1191745A (en) Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US3562038A (en) Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
JPH05263258A (ja) 置換すずめっき用錯化剤
KR100188481B1 (ko) 유전기질과 도금기질을 직접 전기도금 하는 방법
GB1143899A (en) Improvements relating to the manufacture of printed circuits
EP0538006A1 (en) Direct metallization process
WO1988008337A1 (en) Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
JP3337802B2 (ja) 酸化銅(i)コロイドの金属化によるダイレクトプレーティング方法
EP0007577B1 (en) Method of improving the adhesion of electroless metal deposits
US4537799A (en) Selective metallization process
US5238550A (en) Electroplating process
JPS57149463A (en) Metal-plating method of polyamide resin
EP0163089B1 (en) Process for activating a substrate for electroless deposition of a conductive metal
EP0098472B1 (en) Method for decreasing plated metal defects by treating a metallic surface
JPS56271A (en) Non-electrolytic copper plating solution
JPS57140891A (en) Pretreating solution for silver plating
US4322451A (en) Method of forming a colloidal wetting sensitizer
JPS56123363A (en) Pretreating liquid for chemical plating
JPS575856A (en) Plating method
JPS575857A (en) Electroless indium-plating solution