JPS5714618A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS5714618A JPS5714618A JP8892780A JP8892780A JPS5714618A JP S5714618 A JPS5714618 A JP S5714618A JP 8892780 A JP8892780 A JP 8892780A JP 8892780 A JP8892780 A JP 8892780A JP S5714618 A JPS5714618 A JP S5714618A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy
- epoxy ester
- polymerization initiator
- amino compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
PURPOSE: A resin composition that is composed of an unsaturated epoxy ester resin containing a specific amount of free epoxy groups, an amino compound bearing active hyrogens and a polymerization initiator, thus being suitably used as a structural resin for automobile parts, because of its high moldability with heat and pressure and of high corrosion resistance.
CONSTITUTION: For example, an epoxy resin from epichlorohydrin and bisphenol- A is made to reast with acrylic acid or methacrylic acid to give an unsaturated epoxy ester resin containing 1×10-5W2.4×10-3 equiv./g. of epoxy group. The resultant resin is combined with an amino compound having 2 or more active hydrogens in the molecule such as diethylenetriamine, xylylenediamine by 2W6 molar times the total oxyrane oxygen atoms in the resin and a polymerization initiator such as cumene hydroperoxide by 0.1W5pts.wt./100pts.of the unsaturated epoxy ester resin to produce the objective resin.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8892780A JPS5714618A (en) | 1980-06-30 | 1980-06-30 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8892780A JPS5714618A (en) | 1980-06-30 | 1980-06-30 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5714618A true JPS5714618A (en) | 1982-01-25 |
JPS634563B2 JPS634563B2 (en) | 1988-01-29 |
Family
ID=13956533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8892780A Granted JPS5714618A (en) | 1980-06-30 | 1980-06-30 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5714618A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60149264U (en) * | 1984-03-12 | 1985-10-03 | 沖電気工業株式会社 | Received pulse signal inspection circuit |
JPS6317938A (en) * | 1986-07-10 | 1988-01-25 | Ibiden Co Ltd | Prepreg for adhesion |
FR2716202A1 (en) * | 1994-02-17 | 1995-08-18 | Sandoz Sa | Partially acrylated epoxy compositions curable under the action of an amine. |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0538863A (en) * | 1991-08-05 | 1993-02-19 | Fuji Photo Film Co Ltd | Optical fixing device for thermal printer |
-
1980
- 1980-06-30 JP JP8892780A patent/JPS5714618A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60149264U (en) * | 1984-03-12 | 1985-10-03 | 沖電気工業株式会社 | Received pulse signal inspection circuit |
JPH055708Y2 (en) * | 1984-03-12 | 1993-02-15 | ||
JPS6317938A (en) * | 1986-07-10 | 1988-01-25 | Ibiden Co Ltd | Prepreg for adhesion |
JPH0371460B2 (en) * | 1986-07-10 | 1991-11-13 | Ibiden Co Ltd | |
FR2716202A1 (en) * | 1994-02-17 | 1995-08-18 | Sandoz Sa | Partially acrylated epoxy compositions curable under the action of an amine. |
Also Published As
Publication number | Publication date |
---|---|
JPS634563B2 (en) | 1988-01-29 |
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