JPS5714618A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS5714618A
JPS5714618A JP8892780A JP8892780A JPS5714618A JP S5714618 A JPS5714618 A JP S5714618A JP 8892780 A JP8892780 A JP 8892780A JP 8892780 A JP8892780 A JP 8892780A JP S5714618 A JPS5714618 A JP S5714618A
Authority
JP
Japan
Prior art keywords
resin
epoxy
epoxy ester
polymerization initiator
amino compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8892780A
Other languages
Japanese (ja)
Other versions
JPS634563B2 (en
Inventor
Senzo Shimizu
Hiroka Tanizake
Keizo Masawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP8892780A priority Critical patent/JPS5714618A/en
Publication of JPS5714618A publication Critical patent/JPS5714618A/en
Publication of JPS634563B2 publication Critical patent/JPS634563B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE: A resin composition that is composed of an unsaturated epoxy ester resin containing a specific amount of free epoxy groups, an amino compound bearing active hyrogens and a polymerization initiator, thus being suitably used as a structural resin for automobile parts, because of its high moldability with heat and pressure and of high corrosion resistance.
CONSTITUTION: For example, an epoxy resin from epichlorohydrin and bisphenol- A is made to reast with acrylic acid or methacrylic acid to give an unsaturated epoxy ester resin containing 1×10-5W2.4×10-3 equiv./g. of epoxy group. The resultant resin is combined with an amino compound having 2 or more active hydrogens in the molecule such as diethylenetriamine, xylylenediamine by 2W6 molar times the total oxyrane oxygen atoms in the resin and a polymerization initiator such as cumene hydroperoxide by 0.1W5pts.wt./100pts.of the unsaturated epoxy ester resin to produce the objective resin.
COPYRIGHT: (C)1982,JPO&Japio
JP8892780A 1980-06-30 1980-06-30 Resin composition Granted JPS5714618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8892780A JPS5714618A (en) 1980-06-30 1980-06-30 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8892780A JPS5714618A (en) 1980-06-30 1980-06-30 Resin composition

Publications (2)

Publication Number Publication Date
JPS5714618A true JPS5714618A (en) 1982-01-25
JPS634563B2 JPS634563B2 (en) 1988-01-29

Family

ID=13956533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8892780A Granted JPS5714618A (en) 1980-06-30 1980-06-30 Resin composition

Country Status (1)

Country Link
JP (1) JPS5714618A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149264U (en) * 1984-03-12 1985-10-03 沖電気工業株式会社 Received pulse signal inspection circuit
JPS6317938A (en) * 1986-07-10 1988-01-25 Ibiden Co Ltd Prepreg for adhesion
FR2716202A1 (en) * 1994-02-17 1995-08-18 Sandoz Sa Partially acrylated epoxy compositions curable under the action of an amine.

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0538863A (en) * 1991-08-05 1993-02-19 Fuji Photo Film Co Ltd Optical fixing device for thermal printer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149264U (en) * 1984-03-12 1985-10-03 沖電気工業株式会社 Received pulse signal inspection circuit
JPH055708Y2 (en) * 1984-03-12 1993-02-15
JPS6317938A (en) * 1986-07-10 1988-01-25 Ibiden Co Ltd Prepreg for adhesion
JPH0371460B2 (en) * 1986-07-10 1991-11-13 Ibiden Co Ltd
FR2716202A1 (en) * 1994-02-17 1995-08-18 Sandoz Sa Partially acrylated epoxy compositions curable under the action of an amine.

Also Published As

Publication number Publication date
JPS634563B2 (en) 1988-01-29

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