JPS57145984A - High-speed dc sputtering device of ferromagnetic matter - Google Patents

High-speed dc sputtering device of ferromagnetic matter

Info

Publication number
JPS57145984A
JPS57145984A JP3121481A JP3121481A JPS57145984A JP S57145984 A JPS57145984 A JP S57145984A JP 3121481 A JP3121481 A JP 3121481A JP 3121481 A JP3121481 A JP 3121481A JP S57145984 A JPS57145984 A JP S57145984A
Authority
JP
Japan
Prior art keywords
target
hollow groove
increased
increase
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3121481A
Other languages
Japanese (ja)
Other versions
JPS6328986B2 (en
Inventor
Hirooki Yamada
Kyuzo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP3121481A priority Critical patent/JPS57145984A/en
Publication of JPS57145984A publication Critical patent/JPS57145984A/en
Publication of JPS6328986B2 publication Critical patent/JPS6328986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Thin Magnetic Films (AREA)

Abstract

PURPOSE:To increase the sputtering speed as well as the lifetime of the titled sputtering device, by forming a hollow groove having nearly a V-shaped section in front of a ferromagnetic target and forming the bottom part of the hollow groove with a magnetic or electrical insulator to cause a large leakage magnetic flux between the hollow grooves. CONSTITUTION:The magnetic field of a magnetic field generator 2 which functions through the back side of a target 1 leaks out in a comparatively large amount into a hollow groove owing to a magnetic or electrical insulator 5 of alumina, etc. which is provided between the grooves 3 of the target 1. Accordingly the plasma density can be increased more than a conventional type in which the hollow groove is merely formed in front of the target, and as a result the sputtering speed can be increased. Furthermore the thickness of the target is increased at the bottom part 4 of the groove 3 to increase the time during which the part 4 is consumed and thus to increase the durability. A member 5 is not consumed in the case of the DC sputtering process and is never intermixed as an impurity.
JP3121481A 1981-03-06 1981-03-06 High-speed dc sputtering device of ferromagnetic matter Granted JPS57145984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3121481A JPS57145984A (en) 1981-03-06 1981-03-06 High-speed dc sputtering device of ferromagnetic matter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3121481A JPS57145984A (en) 1981-03-06 1981-03-06 High-speed dc sputtering device of ferromagnetic matter

Publications (2)

Publication Number Publication Date
JPS57145984A true JPS57145984A (en) 1982-09-09
JPS6328986B2 JPS6328986B2 (en) 1988-06-10

Family

ID=12325176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3121481A Granted JPS57145984A (en) 1981-03-06 1981-03-06 High-speed dc sputtering device of ferromagnetic matter

Country Status (1)

Country Link
JP (1) JPS57145984A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211211A (en) * 1983-05-17 1984-11-30 Ulvac Corp High speed sputtering target of ferromagnetic material
EP0394692A2 (en) * 1989-04-26 1990-10-31 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Process and apparatus for coating a substrate in a plasma
WO1999034029A1 (en) * 1997-12-26 1999-07-08 Japan Energy Corporation Magnetic body sputtering target

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250598U (en) * 1988-09-30 1990-04-09

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS563902A (en) * 1979-06-23 1981-01-16 Fumio Usui Light emitting tube

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS563902A (en) * 1979-06-23 1981-01-16 Fumio Usui Light emitting tube

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211211A (en) * 1983-05-17 1984-11-30 Ulvac Corp High speed sputtering target of ferromagnetic material
EP0394692A2 (en) * 1989-04-26 1990-10-31 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Process and apparatus for coating a substrate in a plasma
WO1999034029A1 (en) * 1997-12-26 1999-07-08 Japan Energy Corporation Magnetic body sputtering target

Also Published As

Publication number Publication date
JPS6328986B2 (en) 1988-06-10

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