JPS57145349A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS57145349A JPS57145349A JP3086181A JP3086181A JPS57145349A JP S57145349 A JPS57145349 A JP S57145349A JP 3086181 A JP3086181 A JP 3086181A JP 3086181 A JP3086181 A JP 3086181A JP S57145349 A JPS57145349 A JP S57145349A
- Authority
- JP
- Japan
- Prior art keywords
- small piece
- tips
- piece
- small
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004080 punching Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3086181A JPS57145349A (en) | 1981-03-04 | 1981-03-04 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3086181A JPS57145349A (en) | 1981-03-04 | 1981-03-04 | Lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57145349A true JPS57145349A (en) | 1982-09-08 |
JPS6242389B2 JPS6242389B2 (enrdf_load_stackoverflow) | 1987-09-08 |
Family
ID=12315500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3086181A Granted JPS57145349A (en) | 1981-03-04 | 1981-03-04 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57145349A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4633583A (en) * | 1981-09-29 | 1987-01-06 | Sumitomo Metal Mining Company Limited | Method of making a lead frame for integrated circuits |
-
1981
- 1981-03-04 JP JP3086181A patent/JPS57145349A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4633583A (en) * | 1981-09-29 | 1987-01-06 | Sumitomo Metal Mining Company Limited | Method of making a lead frame for integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
JPS6242389B2 (enrdf_load_stackoverflow) | 1987-09-08 |
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