JPS57145349A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS57145349A
JPS57145349A JP3086181A JP3086181A JPS57145349A JP S57145349 A JPS57145349 A JP S57145349A JP 3086181 A JP3086181 A JP 3086181A JP 3086181 A JP3086181 A JP 3086181A JP S57145349 A JPS57145349 A JP S57145349A
Authority
JP
Japan
Prior art keywords
small piece
tips
piece
small
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3086181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242389B2 (enrdf_load_stackoverflow
Inventor
Shoichi Ogura
Hiroshi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3086181A priority Critical patent/JPS57145349A/ja
Publication of JPS57145349A publication Critical patent/JPS57145349A/ja
Publication of JPS6242389B2 publication Critical patent/JPS6242389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839Assembly of a flat lead with an insulating support, e.g. for TAB

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP3086181A 1981-03-04 1981-03-04 Lead frame Granted JPS57145349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3086181A JPS57145349A (en) 1981-03-04 1981-03-04 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3086181A JPS57145349A (en) 1981-03-04 1981-03-04 Lead frame

Publications (2)

Publication Number Publication Date
JPS57145349A true JPS57145349A (en) 1982-09-08
JPS6242389B2 JPS6242389B2 (enrdf_load_stackoverflow) 1987-09-08

Family

ID=12315500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3086181A Granted JPS57145349A (en) 1981-03-04 1981-03-04 Lead frame

Country Status (1)

Country Link
JP (1) JPS57145349A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633583A (en) * 1981-09-29 1987-01-06 Sumitomo Metal Mining Company Limited Method of making a lead frame for integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633583A (en) * 1981-09-29 1987-01-06 Sumitomo Metal Mining Company Limited Method of making a lead frame for integrated circuits

Also Published As

Publication number Publication date
JPS6242389B2 (enrdf_load_stackoverflow) 1987-09-08

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