JPS57141950A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS57141950A
JPS57141950A JP57002958A JP295882A JPS57141950A JP S57141950 A JPS57141950 A JP S57141950A JP 57002958 A JP57002958 A JP 57002958A JP 295882 A JP295882 A JP 295882A JP S57141950 A JPS57141950 A JP S57141950A
Authority
JP
Japan
Prior art keywords
substrate
elements
thin film
terminal
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57002958A
Other languages
Japanese (ja)
Inventor
Kiyohiko Oka
Takayasu Handa
Kunihiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57002958A priority Critical patent/JPS57141950A/en
Publication of JPS57141950A publication Critical patent/JPS57141950A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To miniaturize the subject hybrid integrated circuit by a method wherein a film element is provided on one of the surfaces of two insulating substrate, one of the elements is trimmed, both elements are connected using a flexible terminal, and they are faced each other between surfaces using resin. CONSTITUTION:A conductive wiring 3, consisting of a Ta thin film 2, an Au and Ni cross alloy, is provided on an alumina-ceramic substrate 1 in the desired circuit form. The Ta film 2 is a conductor to be used for functional trimming. A circuit containing thin film capacitance 4 is provided on another substrate 1' having almost same size, and conductive wirings 3 and 3' are formed on each substrate. An active element 5 is provided on each substrate and these elements are connected by a terminal 6 made of soft copper foil. Then, after the desired characteristics have been obtained for the Ta thin film 2 by performing a trimming on it using a laser beam L, the terminal 6 is bent, and the interval of the substrate is maintained uniformly through the intermediary of resin 7. According to this constitution, highly accurate elecrtical characteristics are obrained, and a miniaturized hybrid IC of high integration density can be obtained.
JP57002958A 1982-01-11 1982-01-11 Hybrid integrated circuit Pending JPS57141950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57002958A JPS57141950A (en) 1982-01-11 1982-01-11 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57002958A JPS57141950A (en) 1982-01-11 1982-01-11 Hybrid integrated circuit

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3255077A Division JPS53117739A (en) 1977-03-23 1977-03-23 Method of producing hyb ic

Publications (1)

Publication Number Publication Date
JPS57141950A true JPS57141950A (en) 1982-09-02

Family

ID=11543869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57002958A Pending JPS57141950A (en) 1982-01-11 1982-01-11 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57141950A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS475698U (en) * 1971-02-10 1972-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS475698U (en) * 1971-02-10 1972-09-19

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