JPS57141947A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57141947A
JPS57141947A JP56027381A JP2738181A JPS57141947A JP S57141947 A JPS57141947 A JP S57141947A JP 56027381 A JP56027381 A JP 56027381A JP 2738181 A JP2738181 A JP 2738181A JP S57141947 A JPS57141947 A JP S57141947A
Authority
JP
Japan
Prior art keywords
section
copper foils
narrow
lead
reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56027381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6152977B2 (cg-RX-API-DMAC10.html
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP56027381A priority Critical patent/JPS57141947A/ja
Publication of JPS57141947A publication Critical patent/JPS57141947A/ja
Publication of JPS6152977B2 publication Critical patent/JPS6152977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/453—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP56027381A 1981-02-25 1981-02-25 Manufacture of semiconductor device Granted JPS57141947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56027381A JPS57141947A (en) 1981-02-25 1981-02-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56027381A JPS57141947A (en) 1981-02-25 1981-02-25 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57141947A true JPS57141947A (en) 1982-09-02
JPS6152977B2 JPS6152977B2 (cg-RX-API-DMAC10.html) 1986-11-15

Family

ID=12219465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56027381A Granted JPS57141947A (en) 1981-02-25 1981-02-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57141947A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167281U (cg-RX-API-DMAC10.html) * 1981-04-14 1982-10-21
US6369440B1 (en) * 1998-03-12 2002-04-09 Oki Electric Industry Co, Ltd. Semiconductor substrate and manufacturing method thereof
KR100838661B1 (ko) 2006-06-23 2008-06-16 안동대학교 산학협력단 전기화학적 바이오센서용 전극 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167281U (cg-RX-API-DMAC10.html) * 1981-04-14 1982-10-21
US6369440B1 (en) * 1998-03-12 2002-04-09 Oki Electric Industry Co, Ltd. Semiconductor substrate and manufacturing method thereof
KR100838661B1 (ko) 2006-06-23 2008-06-16 안동대학교 산학협력단 전기화학적 바이오센서용 전극 제조방법

Also Published As

Publication number Publication date
JPS6152977B2 (cg-RX-API-DMAC10.html) 1986-11-15

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