JPS57123275A - Adhesive for chip mold mainly for non-rigid plastics foam - Google Patents
Adhesive for chip mold mainly for non-rigid plastics foamInfo
- Publication number
- JPS57123275A JPS57123275A JP915381A JP915381A JPS57123275A JP S57123275 A JPS57123275 A JP S57123275A JP 915381 A JP915381 A JP 915381A JP 915381 A JP915381 A JP 915381A JP S57123275 A JPS57123275 A JP S57123275A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- urethane prepolymer
- polymethylene polyphenyl
- polyphenyl isocyanate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
PURPOSE: To provide the titled adhesive which makes it possible to widely vary the physical properties of chip products by changing the amounts of components to be mixed, by mixing a specified urethane prepolymer with polymethylene polyphenyl isocyanate.
CONSTITUTION: An adhesive for chip is obtd. by mixing a urethane prepolymer and, if necessary, a solvent with polymethylene polyphenyl isocyanate, said urethane prepolymer being prepd. by reacting tolylene diisocyanate with a polyol to such an extent that the content of free NCO group becomes 15% or lower. The purpose of this invention can be achieved by controlling the amounts of said polymethylene polyphenyl isocyanate and said urethane prepolymer according to physical properties required for final chip molded articles. When hardness and shock-absorbing properties are particularly required, the adhesive contg. an excess amount of said polymethylene polyphenyl isocyanate is used. When elongation and resilience are particularly required, the adhesive contg. an excess amount of said urethane prepolymer is used.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP915381A JPS57123275A (en) | 1981-01-24 | 1981-01-24 | Adhesive for chip mold mainly for non-rigid plastics foam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP915381A JPS57123275A (en) | 1981-01-24 | 1981-01-24 | Adhesive for chip mold mainly for non-rigid plastics foam |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57123275A true JPS57123275A (en) | 1982-07-31 |
JPS6329718B2 JPS6329718B2 (en) | 1988-06-15 |
Family
ID=11712666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP915381A Granted JPS57123275A (en) | 1981-01-24 | 1981-01-24 | Adhesive for chip mold mainly for non-rigid plastics foam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57123275A (en) |
-
1981
- 1981-01-24 JP JP915381A patent/JPS57123275A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6329718B2 (en) | 1988-06-15 |
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