JPS57123275A - Adhesive for chip mold mainly for non-rigid plastics foam - Google Patents

Adhesive for chip mold mainly for non-rigid plastics foam

Info

Publication number
JPS57123275A
JPS57123275A JP915381A JP915381A JPS57123275A JP S57123275 A JPS57123275 A JP S57123275A JP 915381 A JP915381 A JP 915381A JP 915381 A JP915381 A JP 915381A JP S57123275 A JPS57123275 A JP S57123275A
Authority
JP
Japan
Prior art keywords
adhesive
urethane prepolymer
polymethylene polyphenyl
polyphenyl isocyanate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP915381A
Other languages
Japanese (ja)
Other versions
JPS6329718B2 (en
Inventor
Nobukimi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WAKOO CHEMICAL KK
Wako Chemical Co Ltd
Original Assignee
WAKOO CHEMICAL KK
Wako Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WAKOO CHEMICAL KK, Wako Chemical Co Ltd filed Critical WAKOO CHEMICAL KK
Priority to JP915381A priority Critical patent/JPS57123275A/en
Publication of JPS57123275A publication Critical patent/JPS57123275A/en
Publication of JPS6329718B2 publication Critical patent/JPS6329718B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To provide the titled adhesive which makes it possible to widely vary the physical properties of chip products by changing the amounts of components to be mixed, by mixing a specified urethane prepolymer with polymethylene polyphenyl isocyanate.
CONSTITUTION: An adhesive for chip is obtd. by mixing a urethane prepolymer and, if necessary, a solvent with polymethylene polyphenyl isocyanate, said urethane prepolymer being prepd. by reacting tolylene diisocyanate with a polyol to such an extent that the content of free NCO group becomes 15% or lower. The purpose of this invention can be achieved by controlling the amounts of said polymethylene polyphenyl isocyanate and said urethane prepolymer according to physical properties required for final chip molded articles. When hardness and shock-absorbing properties are particularly required, the adhesive contg. an excess amount of said polymethylene polyphenyl isocyanate is used. When elongation and resilience are particularly required, the adhesive contg. an excess amount of said urethane prepolymer is used.
COPYRIGHT: (C)1982,JPO&Japio
JP915381A 1981-01-24 1981-01-24 Adhesive for chip mold mainly for non-rigid plastics foam Granted JPS57123275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP915381A JPS57123275A (en) 1981-01-24 1981-01-24 Adhesive for chip mold mainly for non-rigid plastics foam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP915381A JPS57123275A (en) 1981-01-24 1981-01-24 Adhesive for chip mold mainly for non-rigid plastics foam

Publications (2)

Publication Number Publication Date
JPS57123275A true JPS57123275A (en) 1982-07-31
JPS6329718B2 JPS6329718B2 (en) 1988-06-15

Family

ID=11712666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP915381A Granted JPS57123275A (en) 1981-01-24 1981-01-24 Adhesive for chip mold mainly for non-rigid plastics foam

Country Status (1)

Country Link
JP (1) JPS57123275A (en)

Also Published As

Publication number Publication date
JPS6329718B2 (en) 1988-06-15

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