JPS57122550A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57122550A
JPS57122550A JP56007843A JP784381A JPS57122550A JP S57122550 A JPS57122550 A JP S57122550A JP 56007843 A JP56007843 A JP 56007843A JP 784381 A JP784381 A JP 784381A JP S57122550 A JPS57122550 A JP S57122550A
Authority
JP
Japan
Prior art keywords
conductors
pellets
module
soldered
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56007843A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161702B2 (https=
Inventor
Satoshi Mikami
Masami Fujii
Akira Nishi
Kenji Iimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56007843A priority Critical patent/JPS57122550A/ja
Publication of JPS57122550A publication Critical patent/JPS57122550A/ja
Publication of JPS6161702B2 publication Critical patent/JPS6161702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56007843A 1981-01-23 1981-01-23 Semiconductor device Granted JPS57122550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56007843A JPS57122550A (en) 1981-01-23 1981-01-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56007843A JPS57122550A (en) 1981-01-23 1981-01-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57122550A true JPS57122550A (en) 1982-07-30
JPS6161702B2 JPS6161702B2 (https=) 1986-12-26

Family

ID=11676887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56007843A Granted JPS57122550A (en) 1981-01-23 1981-01-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57122550A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939059A (ja) * 1982-08-27 1984-03-03 Hitachi Ltd 半導体装置
JPS5954168U (ja) * 1982-09-30 1984-04-09 三菱電機株式会社 ア−ク溶接機の電力制御器
JPS61139054A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141514A (https=) * 1974-10-07 1976-04-07 Nippon Musical Instruments Mfg

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141514A (https=) * 1974-10-07 1976-04-07 Nippon Musical Instruments Mfg

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939059A (ja) * 1982-08-27 1984-03-03 Hitachi Ltd 半導体装置
JPS5954168U (ja) * 1982-09-30 1984-04-09 三菱電機株式会社 ア−ク溶接機の電力制御器
JPS61139054A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPS6161702B2 (https=) 1986-12-26

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