JPS57121265A - Pressure welding method of strip for lead frame - Google Patents

Pressure welding method of strip for lead frame

Info

Publication number
JPS57121265A
JPS57121265A JP598581A JP598581A JPS57121265A JP S57121265 A JPS57121265 A JP S57121265A JP 598581 A JP598581 A JP 598581A JP 598581 A JP598581 A JP 598581A JP S57121265 A JPS57121265 A JP S57121265A
Authority
JP
Japan
Prior art keywords
strip
pressing
laminate
pressed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP598581A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0134717B2 (enrdf_load_stackoverflow
Inventor
Teruo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP598581A priority Critical patent/JPS57121265A/ja
Publication of JPS57121265A publication Critical patent/JPS57121265A/ja
Publication of JPH0134717B2 publication Critical patent/JPH0134717B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP598581A 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame Granted JPS57121265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP598581A JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP598581A JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Publications (2)

Publication Number Publication Date
JPS57121265A true JPS57121265A (en) 1982-07-28
JPH0134717B2 JPH0134717B2 (enrdf_load_stackoverflow) 1989-07-20

Family

ID=11626094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP598581A Granted JPS57121265A (en) 1981-01-20 1981-01-20 Pressure welding method of strip for lead frame

Country Status (1)

Country Link
JP (1) JPS57121265A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193256A (ja) * 1983-04-18 1984-11-01 Daido Steel Co Ltd アルミニウム・クラツド金属帯片の残留歪低減方法
JPS60120544A (ja) * 1983-12-02 1985-06-28 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
JPH02109357A (ja) * 1988-10-18 1990-04-23 Sumitomo Special Metals Co Ltd プラスチックモールド用クラッド板の製造方法
CN102249022A (zh) * 2011-07-08 2011-11-23 浙江中烟工业有限责任公司 卷烟包装机中铝箔纸压烟徽装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075554A (enrdf_load_stackoverflow) * 1973-11-08 1975-06-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075554A (enrdf_load_stackoverflow) * 1973-11-08 1975-06-20

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193256A (ja) * 1983-04-18 1984-11-01 Daido Steel Co Ltd アルミニウム・クラツド金属帯片の残留歪低減方法
JPS60120544A (ja) * 1983-12-02 1985-06-28 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
JPH02109357A (ja) * 1988-10-18 1990-04-23 Sumitomo Special Metals Co Ltd プラスチックモールド用クラッド板の製造方法
CN102249022A (zh) * 2011-07-08 2011-11-23 浙江中烟工业有限责任公司 卷烟包装机中铝箔纸压烟徽装置

Also Published As

Publication number Publication date
JPH0134717B2 (enrdf_load_stackoverflow) 1989-07-20

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