JPS57121247A - Wafer attaching jig - Google Patents

Wafer attaching jig

Info

Publication number
JPS57121247A
JPS57121247A JP755281A JP755281A JPS57121247A JP S57121247 A JPS57121247 A JP S57121247A JP 755281 A JP755281 A JP 755281A JP 755281 A JP755281 A JP 755281A JP S57121247 A JPS57121247 A JP S57121247A
Authority
JP
Japan
Prior art keywords
wafer
region
correspondence
attaching jig
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP755281A
Other languages
Japanese (ja)
Inventor
Yoshinori Horiguchi
Kenji Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP755281A priority Critical patent/JPS57121247A/en
Publication of JPS57121247A publication Critical patent/JPS57121247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent curvature in a wafer by a method wherein a sunken region is provided on a surface which contacts with a wafer while the region in correspondence with the circumference of the wafer and the region in correspondence with the center of the wafer are left unsunken. CONSTITUTION:A wafer attaching jig 10 is made nearly cylindrical, and on an end surface 10a which gives a pressure on a wafer 11, a sunken region 10d is fromed while a ring of a projected region 10b is frormed in a region in correspondence with the circumference of the wafer 11 and a point of a projected region 10c is formed in a region in correspondence with the central region of the wafer. And solid wax 13 placed on a wafer proecssing table 12 is melted, and the wafer 11 to be divided is placed on it and is left alone for 2-3min, and subsequently the wafer attaching jig 10 is removed after solidification of wax 13. By this method because the back plane of the wafer is pressed by the wafer attaching jig 10 at the circumference and at the center, the occurrence of concave and convex curvature in the wafer 11 is eliminated.
JP755281A 1981-01-21 1981-01-21 Wafer attaching jig Pending JPS57121247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP755281A JPS57121247A (en) 1981-01-21 1981-01-21 Wafer attaching jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP755281A JPS57121247A (en) 1981-01-21 1981-01-21 Wafer attaching jig

Publications (1)

Publication Number Publication Date
JPS57121247A true JPS57121247A (en) 1982-07-28

Family

ID=11668951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP755281A Pending JPS57121247A (en) 1981-01-21 1981-01-21 Wafer attaching jig

Country Status (1)

Country Link
JP (1) JPS57121247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103978405A (en) * 2014-05-05 2014-08-13 深圳市大族激光科技股份有限公司 Mirror surface protection method and grinding device of workpiece
CN110695844A (en) * 2019-11-04 2020-01-17 苏州爱彼光电材料有限公司 Substrate sheet clamp for double-sided polishing machine and polishing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103978405A (en) * 2014-05-05 2014-08-13 深圳市大族激光科技股份有限公司 Mirror surface protection method and grinding device of workpiece
CN110695844A (en) * 2019-11-04 2020-01-17 苏州爱彼光电材料有限公司 Substrate sheet clamp for double-sided polishing machine and polishing method thereof

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