JPS57121076A - Hot-melt type adhesive - Google Patents
Hot-melt type adhesiveInfo
- Publication number
- JPS57121076A JPS57121076A JP869181A JP869181A JPS57121076A JP S57121076 A JPS57121076 A JP S57121076A JP 869181 A JP869181 A JP 869181A JP 869181 A JP869181 A JP 869181A JP S57121076 A JPS57121076 A JP S57121076A
- Authority
- JP
- Japan
- Prior art keywords
- component
- vinyl acetate
- resin
- way
- acetate copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The titled adhesive bonding various kinds of metals and plastics in almightly way, having improved impact resistance at low temperature, obtained by blending a specific polymaide resin with a specified ethylene-vinyl acetate copolymer and an ionomer resin in a specific ratio.
CONSTITUTION: (A) A polyamide resin having an amine value of 3W30 obtained by reacting a dimer acid as a dibasic acid component with a diamine is blended with (B) an ethylene-vinyl acetate copolymer (preferably a vinyl acetate content of ≤45wt%) having a hydrolysis ratio of 50W90wt% and (C) and ionomer resin in such a way that a weight ratio of component A to B is (10:90)W(60:40), and the amount of the component C is 5W30pts.wt. based on 100pts.wt. total amounts of the components A and B, to give the desired adhesive. Preferably the component B is hydrolyzed, and 0.1W5.0wt% unsaturated carboxylic acid is grafted onto the component B.
EFFECT: Having improved high-temperature adhesiveness.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP869181A JPS57121076A (en) | 1981-01-22 | 1981-01-22 | Hot-melt type adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP869181A JPS57121076A (en) | 1981-01-22 | 1981-01-22 | Hot-melt type adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57121076A true JPS57121076A (en) | 1982-07-28 |
JPS6354033B2 JPS6354033B2 (en) | 1988-10-26 |
Family
ID=11699939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP869181A Granted JPS57121076A (en) | 1981-01-22 | 1981-01-22 | Hot-melt type adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57121076A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020023674A (en) * | 2018-07-25 | 2020-02-13 | サンスター技研株式会社 | Hot-melt adhesive for structure |
-
1981
- 1981-01-22 JP JP869181A patent/JPS57121076A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020023674A (en) * | 2018-07-25 | 2020-02-13 | サンスター技研株式会社 | Hot-melt adhesive for structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6354033B2 (en) | 1988-10-26 |
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