JPS57121076A - Hot-melt type adhesive - Google Patents

Hot-melt type adhesive

Info

Publication number
JPS57121076A
JPS57121076A JP869181A JP869181A JPS57121076A JP S57121076 A JPS57121076 A JP S57121076A JP 869181 A JP869181 A JP 869181A JP 869181 A JP869181 A JP 869181A JP S57121076 A JPS57121076 A JP S57121076A
Authority
JP
Japan
Prior art keywords
component
vinyl acetate
resin
way
acetate copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP869181A
Other languages
Japanese (ja)
Other versions
JPS6354033B2 (en
Inventor
Yutaka Hibino
Tetsuharu Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP869181A priority Critical patent/JPS57121076A/en
Publication of JPS57121076A publication Critical patent/JPS57121076A/en
Publication of JPS6354033B2 publication Critical patent/JPS6354033B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The titled adhesive bonding various kinds of metals and plastics in almightly way, having improved impact resistance at low temperature, obtained by blending a specific polymaide resin with a specified ethylene-vinyl acetate copolymer and an ionomer resin in a specific ratio.
CONSTITUTION: (A) A polyamide resin having an amine value of 3W30 obtained by reacting a dimer acid as a dibasic acid component with a diamine is blended with (B) an ethylene-vinyl acetate copolymer (preferably a vinyl acetate content of ≤45wt%) having a hydrolysis ratio of 50W90wt% and (C) and ionomer resin in such a way that a weight ratio of component A to B is (10:90)W(60:40), and the amount of the component C is 5W30pts.wt. based on 100pts.wt. total amounts of the components A and B, to give the desired adhesive. Preferably the component B is hydrolyzed, and 0.1W5.0wt% unsaturated carboxylic acid is grafted onto the component B.
EFFECT: Having improved high-temperature adhesiveness.
COPYRIGHT: (C)1982,JPO&Japio
JP869181A 1981-01-22 1981-01-22 Hot-melt type adhesive Granted JPS57121076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP869181A JPS57121076A (en) 1981-01-22 1981-01-22 Hot-melt type adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP869181A JPS57121076A (en) 1981-01-22 1981-01-22 Hot-melt type adhesive

Publications (2)

Publication Number Publication Date
JPS57121076A true JPS57121076A (en) 1982-07-28
JPS6354033B2 JPS6354033B2 (en) 1988-10-26

Family

ID=11699939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP869181A Granted JPS57121076A (en) 1981-01-22 1981-01-22 Hot-melt type adhesive

Country Status (1)

Country Link
JP (1) JPS57121076A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020023674A (en) * 2018-07-25 2020-02-13 サンスター技研株式会社 Hot-melt adhesive for structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020023674A (en) * 2018-07-25 2020-02-13 サンスター技研株式会社 Hot-melt adhesive for structure

Also Published As

Publication number Publication date
JPS6354033B2 (en) 1988-10-26

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