JPS5712079A - Hot melt adhesive - Google Patents
Hot melt adhesiveInfo
- Publication number
- JPS5712079A JPS5712079A JP8657480A JP8657480A JPS5712079A JP S5712079 A JPS5712079 A JP S5712079A JP 8657480 A JP8657480 A JP 8657480A JP 8657480 A JP8657480 A JP 8657480A JP S5712079 A JPS5712079 A JP S5712079A
- Authority
- JP
- Japan
- Prior art keywords
- component
- salt
- adhesive
- caprolactam
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Polyamides (AREA)
Abstract
PURPOSE: The titled adhesive comprising mainly a three-component or higher copolyamide obtained by the polycondensation of a salt formed from a specific diamine component and a dicarboxylic acid component with ε-caprolactam and having a low melting point, low water absorbing properties and high adhesive properties.
CONSTITUTION: A salt is formed from a diamine component (A) comprising undecamethylenediamine and/or dodecamethylenediamine and a dicarboxylic acid component (B) represent by the formula HOOC(CH2)nCOOH, where n is 4, 7, 8, 10 or 11 (e.g. adipic acid, sebacic acid). In this reaction, at least 2 compounds of component B are used with one compound of component A, and at least 1 compound of component B with 2 compounds of component A. Subsequently, 40W 80wt% resulting salt is polycondensed with 60W20wt% ε-caprolactam to yield a three-component or higher copolyamide, which is used as a principal component in preparing the object adhesive.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8657480A JPS5712079A (en) | 1980-06-27 | 1980-06-27 | Hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8657480A JPS5712079A (en) | 1980-06-27 | 1980-06-27 | Hot melt adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5712079A true JPS5712079A (en) | 1982-01-21 |
Family
ID=13890774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8657480A Pending JPS5712079A (en) | 1980-06-27 | 1980-06-27 | Hot melt adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5712079A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286338A (en) * | 2017-07-28 | 2017-10-24 | 湖南华曙高科技有限责任公司 | A kind of selective laser sintering polyamide material and preparation method thereof |
| CN109970969A (en) * | 2019-04-10 | 2019-07-05 | 山东广垠新材料有限公司 | A kind of preparation method of ternary polymerization low melting point nylon |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994746A (en) * | 1972-09-13 | 1974-09-09 |
-
1980
- 1980-06-27 JP JP8657480A patent/JPS5712079A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994746A (en) * | 1972-09-13 | 1974-09-09 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286338A (en) * | 2017-07-28 | 2017-10-24 | 湖南华曙高科技有限责任公司 | A kind of selective laser sintering polyamide material and preparation method thereof |
| CN109970969A (en) * | 2019-04-10 | 2019-07-05 | 山东广垠新材料有限公司 | A kind of preparation method of ternary polymerization low melting point nylon |
| CN109970969B (en) * | 2019-04-10 | 2021-06-22 | 山东广垠新材料有限公司 | Preparation method of terpolymer low-melting-point nylon |
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