JPS5711793A - Solder for aluminium - Google Patents

Solder for aluminium

Info

Publication number
JPS5711793A
JPS5711793A JP8762780A JP8762780A JPS5711793A JP S5711793 A JPS5711793 A JP S5711793A JP 8762780 A JP8762780 A JP 8762780A JP 8762780 A JP8762780 A JP 8762780A JP S5711793 A JPS5711793 A JP S5711793A
Authority
JP
Japan
Prior art keywords
solder
aluminium
blending
plumbing
balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8762780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235876B2 (enExample
Inventor
Isataka Araki
Kenji Sato
Michio Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainichi Nippon Cables Ltd
Original Assignee
Dainichi Nippon Cables Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainichi Nippon Cables Ltd filed Critical Dainichi Nippon Cables Ltd
Priority to JP8762780A priority Critical patent/JPS5711793A/ja
Publication of JPS5711793A publication Critical patent/JPS5711793A/ja
Publication of JPS6235876B2 publication Critical patent/JPS6235876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP8762780A 1980-06-26 1980-06-26 Solder for aluminium Granted JPS5711793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8762780A JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8762780A JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Publications (2)

Publication Number Publication Date
JPS5711793A true JPS5711793A (en) 1982-01-21
JPS6235876B2 JPS6235876B2 (enExample) 1987-08-04

Family

ID=13920209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8762780A Granted JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Country Status (1)

Country Link
JP (1) JPS5711793A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189096A (ja) * 1983-04-08 1984-10-26 Senjiyu Kinzoku Kogyo Kk 半田合金
CN1067929C (zh) * 1994-10-11 2001-07-04 株式会社日立制作所 用于将电子元件连接在有机基底上的无铅焊料及其应用
US6503338B1 (en) 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP2003002427A (ja) * 2001-06-18 2003-01-08 Tokyo Autom Mach Works Ltd 物品供給装置
US6853077B2 (en) 2001-10-01 2005-02-08 Matsushita Electric Industrial Co., Ltd. Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same
CN100453246C (zh) * 2006-07-13 2009-01-21 昆山成利焊锡制造有限公司 无铅软钎焊料
CN102152022A (zh) * 2011-04-18 2011-08-17 宁波喜汉锡焊料有限公司 一种高抗氧耐蚀SnZn基无铅钎料

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06219089A (ja) * 1993-02-15 1994-08-09 Hiroshi Sano 紙挟み装置
US6361626B1 (en) * 2000-10-24 2002-03-26 Fujitsu Limited Solder alloy and soldered bond

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255927U (enExample) * 1975-10-13 1977-04-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255927U (enExample) * 1975-10-13 1977-04-22

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189096A (ja) * 1983-04-08 1984-10-26 Senjiyu Kinzoku Kogyo Kk 半田合金
CN1067929C (zh) * 1994-10-11 2001-07-04 株式会社日立制作所 用于将电子元件连接在有机基底上的无铅焊料及其应用
US6503338B1 (en) 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP2003002427A (ja) * 2001-06-18 2003-01-08 Tokyo Autom Mach Works Ltd 物品供給装置
US6853077B2 (en) 2001-10-01 2005-02-08 Matsushita Electric Industrial Co., Ltd. Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same
CN100453246C (zh) * 2006-07-13 2009-01-21 昆山成利焊锡制造有限公司 无铅软钎焊料
CN102152022A (zh) * 2011-04-18 2011-08-17 宁波喜汉锡焊料有限公司 一种高抗氧耐蚀SnZn基无铅钎料

Also Published As

Publication number Publication date
JPS6235876B2 (enExample) 1987-08-04

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