JPS57117254A - Master slice substrate - Google Patents

Master slice substrate

Info

Publication number
JPS57117254A
JPS57117254A JP430881A JP430881A JPS57117254A JP S57117254 A JPS57117254 A JP S57117254A JP 430881 A JP430881 A JP 430881A JP 430881 A JP430881 A JP 430881A JP S57117254 A JPS57117254 A JP S57117254A
Authority
JP
Japan
Prior art keywords
wiring
unit
region
master slice
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP430881A
Other languages
Japanese (ja)
Inventor
Masao Kakimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP430881A priority Critical patent/JPS57117254A/en
Publication of JPS57117254A publication Critical patent/JPS57117254A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the area of wiring region, chip size and the number of through-holes, by making the positions of terminals of two adjacent cells interposed with each other. CONSTITUTION:A unit cell 2 consists of a element region 4 and a wiring region 3, and terminal 6a1-6a5 and 6a'1-6a'5 in the cell are provided also in the wiring region 3, not only in the element region 4. The terminal 6a'1-6a'5 of a unit cell 2a and the terminals 6b'1-6b'5 of a unit cell 2b are provided in a common wiring region 3, interposing each other. The connection wiring 10 and 11 for the unit cells 2a and 2b, the connecting wiring 9 for unit 2a and 2c, the connection wiring 12 for a unit 2b and 2d are performed only in the wiring layer of the direction X.
JP430881A 1981-01-14 1981-01-14 Master slice substrate Pending JPS57117254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP430881A JPS57117254A (en) 1981-01-14 1981-01-14 Master slice substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP430881A JPS57117254A (en) 1981-01-14 1981-01-14 Master slice substrate

Publications (1)

Publication Number Publication Date
JPS57117254A true JPS57117254A (en) 1982-07-21

Family

ID=11580858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP430881A Pending JPS57117254A (en) 1981-01-14 1981-01-14 Master slice substrate

Country Status (1)

Country Link
JP (1) JPS57117254A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432085A (en) * 1977-08-16 1979-03-09 Mitsubishi Electric Corp Semiconductor intergrated circuit
JPS56118350A (en) * 1980-02-21 1981-09-17 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432085A (en) * 1977-08-16 1979-03-09 Mitsubishi Electric Corp Semiconductor intergrated circuit
JPS56118350A (en) * 1980-02-21 1981-09-17 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device

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