JPS57117244A - Method of producing extremely thin semiconductor chip - Google Patents
Method of producing extremely thin semiconductor chipInfo
- Publication number
- JPS57117244A JPS57117244A JP19044581A JP19044581A JPS57117244A JP S57117244 A JPS57117244 A JP S57117244A JP 19044581 A JP19044581 A JP 19044581A JP 19044581 A JP19044581 A JP 19044581A JP S57117244 A JPS57117244 A JP S57117244A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- extremely thin
- thin semiconductor
- producing extremely
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30612—Etching of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803044947 DE3044947A1 (de) | 1980-11-28 | 1980-11-28 | Verfahren zur herstellung sehr duenner halbleiterchips |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57117244A true JPS57117244A (en) | 1982-07-21 |
Family
ID=6117863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19044581A Pending JPS57117244A (en) | 1980-11-28 | 1981-11-27 | Method of producing extremely thin semiconductor chip |
Country Status (3)
Country | Link |
---|---|
US (1) | US4389280A (ja) |
JP (1) | JPS57117244A (ja) |
DE (1) | DE3044947A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624741A (en) * | 1985-12-13 | 1986-11-25 | Xerox Corporation | Method of fabricating electro-mechanical modulator arrays |
US6042736A (en) * | 1997-11-17 | 2000-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for preparing samples for microscopic examination |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB852003A (en) * | 1958-06-10 | 1960-10-19 | Siemens Edison Swan Ltd | Improvements relating to the production of wafers of semi-conductor material |
DE1964546A1 (de) * | 1968-12-25 | 1970-07-23 | Hitachi Ltd | Verfahren zur Herstellung von Halbleitervorrichtungen |
US3623219A (en) * | 1969-10-22 | 1971-11-30 | Rca Corp | Method for isolating semiconductor devices from a wafer of semiconducting material |
GB1487201A (en) * | 1974-12-20 | 1977-09-28 | Lucas Electrical Ltd | Method of manufacturing semi-conductor devices |
-
1980
- 1980-11-28 DE DE19803044947 patent/DE3044947A1/de not_active Withdrawn
-
1981
- 1981-11-27 US US06/325,316 patent/US4389280A/en not_active Expired - Fee Related
- 1981-11-27 JP JP19044581A patent/JPS57117244A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3044947A1 (de) | 1982-07-01 |
US4389280A (en) | 1983-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57113267A (en) | Method of producing semiconductor device | |
JPS5749235A (en) | Method of producing semiconductor device | |
JPS5734367A (en) | Method of producing semiconductor device | |
JPS57115871A (en) | Method of producing semiconductor device | |
JPS57133678A (en) | Method of producing semiconductor device | |
DE3168424D1 (en) | Method for production of semiconductor devices | |
JPS57115862A (en) | Method of producing semiconductor memory device | |
JPS5749247A (en) | Semiconductor wafer and method of producing same | |
JPS56131965A (en) | Method of producing semiconductor device | |
JPS56152272A (en) | Method of manufacturing semiconductor device | |
JPS56140671A (en) | Method of manufacturing semiconductor device | |
JPS5743413A (en) | Semiconductor element and method of producing same | |
DE3380615D1 (en) | Method of producing semiconductor device | |
JPS57169245A (en) | Method of producing semiconductor device | |
JPS56144545A (en) | Method of manufacturing semiconductor device | |
JPS5731180A (en) | Method of producing semiconductor device | |
JPS56144543A (en) | Method of manufacturing semiconductor device | |
JPS56140668A (en) | Method of manufacturing semiconductor device | |
GB8819232D0 (en) | Method of producing semiconductor device | |
JPS5759323A (en) | Method of producing semiconductor device | |
JPS56114352A (en) | Method of manufacturing semiconductor device | |
JPS57141925A (en) | Method of producing semiconductor device | |
JPS57109377A (en) | Method of producing semiconductor device | |
JPS5749236A (en) | Method of producing semiconductor device | |
JPS5791555A (en) | Semiconductor element and method of producing same |