JPS57115835A - Packaging method for semiconductor device - Google Patents

Packaging method for semiconductor device

Info

Publication number
JPS57115835A
JPS57115835A JP196181A JP196181A JPS57115835A JP S57115835 A JPS57115835 A JP S57115835A JP 196181 A JP196181 A JP 196181A JP 196181 A JP196181 A JP 196181A JP S57115835 A JPS57115835 A JP S57115835A
Authority
JP
Japan
Prior art keywords
resin
resistor
molds
metal mold
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP196181A
Other languages
Japanese (ja)
Inventor
Teruo Muroya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP196181A priority Critical patent/JPS57115835A/en
Publication of JPS57115835A publication Critical patent/JPS57115835A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76167—Presence, absence of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B29C2945/76257—Mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76595—Velocity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76658—Injection unit
    • B29C2945/76678—Injection unit injection piston
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76658—Injection unit
    • B29C2945/76692—Injection unit drive means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To realize a constant speed potting process regardless of the position a metal mold assumes in a metal mold lineup by a method wherein switching circuits are incorporated in the transfer molds and control the flow of resin into the said molds. CONSTITUTION:A constant current power source, resistors R0, R1, R2, R3, R4, and R5, and switches turned off and on responding to the conditions of resin in metal molds, constitute a monitoring system. With a metal mold 1 filled with resin, the circuit including the resistor R1 closes, thereby reducing to a 1/2 the current through the resistor R0. With metal molds 1-3 are filled with resin, the circuits including the resistors R1-R3 close, reducing to a 1/4 the current through the resistor R0. With a controlling unit operating on the current received through the resistor R0 contained in a transfer mold forming machine or externally connected thereto, constant speed potting can be effected lasting until the last metal mold is filled up with resin.
JP196181A 1981-01-10 1981-01-10 Packaging method for semiconductor device Pending JPS57115835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP196181A JPS57115835A (en) 1981-01-10 1981-01-10 Packaging method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP196181A JPS57115835A (en) 1981-01-10 1981-01-10 Packaging method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57115835A true JPS57115835A (en) 1982-07-19

Family

ID=11516179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP196181A Pending JPS57115835A (en) 1981-01-10 1981-01-10 Packaging method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57115835A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2244873A1 (en) * 2008-02-19 2010-11-03 Husky Injection Molding Systems S.A. A method for controlling fill speed in a molding system
WO2021257228A1 (en) * 2020-06-15 2021-12-23 iMFLUX Inc. Method of detecting and compensating for a non-operational mold cavity in an injection molding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2244873A1 (en) * 2008-02-19 2010-11-03 Husky Injection Molding Systems S.A. A method for controlling fill speed in a molding system
EP2244873A4 (en) * 2008-02-19 2011-10-12 Husky Injection Molding A method for controlling fill speed in a molding system
WO2021257228A1 (en) * 2020-06-15 2021-12-23 iMFLUX Inc. Method of detecting and compensating for a non-operational mold cavity in an injection molding apparatus
US11718008B2 (en) 2020-06-15 2023-08-08 iMFLUX Inc. Method of injection molding with down cavity detection
US12090697B2 (en) 2020-06-15 2024-09-17 iMFLUX Inc. Method of injection molding with down cavity detection

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