JPS5711339A - Formation of metallic image - Google Patents
Formation of metallic imageInfo
- Publication number
- JPS5711339A JPS5711339A JP8509980A JP8509980A JPS5711339A JP S5711339 A JPS5711339 A JP S5711339A JP 8509980 A JP8509980 A JP 8509980A JP 8509980 A JP8509980 A JP 8509980A JP S5711339 A JPS5711339 A JP S5711339A
- Authority
- JP
- Japan
- Prior art keywords
- metallic
- soln
- bonds
- compound
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To easily form a correct metallic image in a high yield by coating the surface layer of a substrate with a material contg. a compound having >= M-M bonds (M is a specified metallic atom) in the molecule and applyig a photochemical reaction. CONSTITUTION:A compound having >=1 M-M bonds (each M is Si, Ge or Sn and Ms and M may be different from each other) such as hexaphenyldisilane, tetrabromo-1,2-diphenylgermane or hexaphenylditin is dissolved in an org. solvent, and the soln. is applied to the surface of a substrate such as an insulating plate of epoxy resin. In order to enhance the appliability and adhesion, the soln. may be mixed with a polymer. The resulting film is then irradiated with ultraviolet rays having <=300nm wavelengths or electron beams to conduct exposure, and it is brought into contact with a soln. of metallic salt of gold, silver, platinum or the like to deposit the metal on the exposed part. The M-M bonds are cut by the light and reduce the metallic salt. Thus, a metallic image of high accuracy for forming a micropattern or through holes for a circuit, etc. by electroless plating is formed.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8509980A JPS5711339A (en) | 1980-06-25 | 1980-06-25 | Formation of metallic image |
EP81104764A EP0043480B1 (en) | 1980-06-25 | 1981-06-22 | Process for forming metallic images |
DE8181104764T DE3169660D1 (en) | 1980-06-25 | 1981-06-22 | Process for forming metallic images |
US06/277,049 US4347304A (en) | 1980-06-25 | 1981-06-24 | Process for forming metallic image |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8509980A JPS5711339A (en) | 1980-06-25 | 1980-06-25 | Formation of metallic image |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5711339A true JPS5711339A (en) | 1982-01-21 |
JPH0211893B2 JPH0211893B2 (en) | 1990-03-16 |
Family
ID=13849157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8509980A Granted JPS5711339A (en) | 1980-06-25 | 1980-06-25 | Formation of metallic image |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5711339A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5955192A (en) * | 1996-11-20 | 1999-09-21 | Shin-Etsu Chemical Co., Ltd. | Conductive circuit board and method for making |
JP2000129211A (en) * | 1998-10-22 | 2000-05-09 | Shin Etsu Chem Co Ltd | Film-forming polysilane composition for metallic pattern and method for forming metallic pattern |
WO2002077321A1 (en) * | 2001-03-26 | 2002-10-03 | Nippon Paint Co.,Ltd. | Method for forming metal pattern |
-
1980
- 1980-06-25 JP JP8509980A patent/JPS5711339A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5955192A (en) * | 1996-11-20 | 1999-09-21 | Shin-Etsu Chemical Co., Ltd. | Conductive circuit board and method for making |
JP2000129211A (en) * | 1998-10-22 | 2000-05-09 | Shin Etsu Chem Co Ltd | Film-forming polysilane composition for metallic pattern and method for forming metallic pattern |
WO2002077321A1 (en) * | 2001-03-26 | 2002-10-03 | Nippon Paint Co.,Ltd. | Method for forming metal pattern |
Also Published As
Publication number | Publication date |
---|---|
JPH0211893B2 (en) | 1990-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0182193B1 (en) | A method of depositing a copper pattern on a substrate | |
US3767398A (en) | Solid photoresist comprising a polyene and a polythiol | |
JP2643099B2 (en) | Method of attaching conductive metal to substrate | |
EP0029901A1 (en) | Lithographic resist composition for use in a method of forming a film on a substrate | |
US4328298A (en) | Process for manufacturing lithography masks | |
US4426442A (en) | Method of producing metal images or patterns on and/or below the surface of a substrate comprising a semiconducting light-sensitive compound | |
JPS60206085A (en) | Method of producing printed circuit board | |
EP0259727A3 (en) | Process for obtaining heat-resistant structural layers based on epoxy resins | |
JPS5711339A (en) | Formation of metallic image | |
EP0098472B1 (en) | Method for decreasing plated metal defects by treating a metallic surface | |
EP0425437A2 (en) | Method for making metallic patterns | |
US4255481A (en) | Mask for selectively transmitting therethrough a desired light radiant energy | |
US4282314A (en) | Mask for selectively transmitting therethrough a desired light radiant energy | |
JPS619592A (en) | Electrocast mandrel, manufacture and electrocast process thereby | |
US4361641A (en) | Electrolytic surface modulation | |
US4052272A (en) | Method of depositing metal conducting patterns on large area surfaces | |
JPS5541721A (en) | Carrier tape for semiconductor device | |
JPS57130032A (en) | Formation for metallic image | |
JPS57169240A (en) | Manufacture of mask for x-ray exposure | |
JPS5711340A (en) | Formation of metallic image | |
JPS5594491A (en) | Forming method for thick minute metal pattern | |
FR2343266A1 (en) | Optical integrated circuit component using Langmuir film - as planar waveguide or photolacquer in mfg. microcircuits (NL 5.9.77) | |
JPS56114323A (en) | Method for electron beam lighography | |
JPH01122112A (en) | Manufacture of pattern coil | |
Bodrykh et al. | Photochemical Activation of Polyamide Films for Chemical Deposition of Copper |