JPS57111353A - Polyamideimide resin composition - Google Patents
Polyamideimide resin compositionInfo
- Publication number
- JPS57111353A JPS57111353A JP18763780A JP18763780A JPS57111353A JP S57111353 A JPS57111353 A JP S57111353A JP 18763780 A JP18763780 A JP 18763780A JP 18763780 A JP18763780 A JP 18763780A JP S57111353 A JPS57111353 A JP S57111353A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- composition
- arom
- contg
- lactam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: The titled composition with excellent flexibility comprising a resin prepd. by the reaction of a specified polyisocyanate, an arom. diisocyanate, a lactam and a specified poly-carboxylic acid in a cresol solvent, and an elastomer.
CONSTITUTION: The titled resin composition comprising a polyamideimide resin prepd. by the reaction of an isocyanurate ring-contg. polyisocyanate such as one obtd. from 4,4'-diphenylmethane diisocynte, an arom. diisocyanate such as 4,4'-diphenylethane diisocyante, a lactam such as ε-caprolactam and an acid anhydride group-contg. poly-carboxylic acid such as trimellitic acid in a cresol solvent, and an elastomer such as vulcanized rubber or an intermediate thereof such as acrylic rubber. Said composition is usable in a wide range of application because it is excellent in flexibility in addition to good heat resistance and miscible with another resin.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18763780A JPS57111353A (en) | 1980-12-29 | 1980-12-29 | Polyamideimide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18763780A JPS57111353A (en) | 1980-12-29 | 1980-12-29 | Polyamideimide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57111353A true JPS57111353A (en) | 1982-07-10 |
Family
ID=16209593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18763780A Pending JPS57111353A (en) | 1980-12-29 | 1980-12-29 | Polyamideimide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57111353A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6261741B1 (en) | 1998-05-20 | 2001-07-17 | Fujitsu Limited | Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby |
-
1980
- 1980-12-29 JP JP18763780A patent/JPS57111353A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6261741B1 (en) | 1998-05-20 | 2001-07-17 | Fujitsu Limited | Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby |
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