JPS57111353A - Polyamideimide resin composition - Google Patents

Polyamideimide resin composition

Info

Publication number
JPS57111353A
JPS57111353A JP18763780A JP18763780A JPS57111353A JP S57111353 A JPS57111353 A JP S57111353A JP 18763780 A JP18763780 A JP 18763780A JP 18763780 A JP18763780 A JP 18763780A JP S57111353 A JPS57111353 A JP S57111353A
Authority
JP
Japan
Prior art keywords
resin
composition
arom
contg
lactam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18763780A
Other languages
Japanese (ja)
Inventor
Hiroshi Nishizawa
Yuichi Osada
Yoshiyuki Mukoyama
Toichi Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP18763780A priority Critical patent/JPS57111353A/en
Publication of JPS57111353A publication Critical patent/JPS57111353A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: The titled composition with excellent flexibility comprising a resin prepd. by the reaction of a specified polyisocyanate, an arom. diisocyanate, a lactam and a specified poly-carboxylic acid in a cresol solvent, and an elastomer.
CONSTITUTION: The titled resin composition comprising a polyamideimide resin prepd. by the reaction of an isocyanurate ring-contg. polyisocyanate such as one obtd. from 4,4'-diphenylmethane diisocynte, an arom. diisocyanate such as 4,4'-diphenylethane diisocyante, a lactam such as ε-caprolactam and an acid anhydride group-contg. poly-carboxylic acid such as trimellitic acid in a cresol solvent, and an elastomer such as vulcanized rubber or an intermediate thereof such as acrylic rubber. Said composition is usable in a wide range of application because it is excellent in flexibility in addition to good heat resistance and miscible with another resin.
COPYRIGHT: (C)1982,JPO&Japio
JP18763780A 1980-12-29 1980-12-29 Polyamideimide resin composition Pending JPS57111353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18763780A JPS57111353A (en) 1980-12-29 1980-12-29 Polyamideimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18763780A JPS57111353A (en) 1980-12-29 1980-12-29 Polyamideimide resin composition

Publications (1)

Publication Number Publication Date
JPS57111353A true JPS57111353A (en) 1982-07-10

Family

ID=16209593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18763780A Pending JPS57111353A (en) 1980-12-29 1980-12-29 Polyamideimide resin composition

Country Status (1)

Country Link
JP (1) JPS57111353A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261741B1 (en) 1998-05-20 2001-07-17 Fujitsu Limited Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261741B1 (en) 1998-05-20 2001-07-17 Fujitsu Limited Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby

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