JPS55145758A - Polyamideimide resin composition - Google Patents

Polyamideimide resin composition

Info

Publication number
JPS55145758A
JPS55145758A JP5273779A JP5273779A JPS55145758A JP S55145758 A JPS55145758 A JP S55145758A JP 5273779 A JP5273779 A JP 5273779A JP 5273779 A JP5273779 A JP 5273779A JP S55145758 A JPS55145758 A JP S55145758A
Authority
JP
Japan
Prior art keywords
polyamideimide resin
solvent
resin composition
lactam
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5273779A
Other languages
Japanese (ja)
Inventor
Toichi Sakata
Yoshiyuki Mukoyama
Yuichi Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP5273779A priority Critical patent/JPS55145758A/en
Publication of JPS55145758A publication Critical patent/JPS55145758A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a polyamideimide resin composition having good quick setting property and good flexibility by adding a polyamideimide resin synthesized in an N-methylpyrolidone solvent to polyisocyanate contg. an isocyanurate ring and a lactam-modified polyamideimide resin.
CONSTITUTION: A polyamideimide resin composition containing a polyamide resin (A), obtained from the reaction of poyisocyanate contg. an isocyanurate ring (a), an aromatic diisocyante (b), a lactam (c), and a polycarboxylic acid (d) having an acid anhydride group in a solvent of cresol series, and a polyamide resin (B) synthesized in a solvent of N-methylpyrrolidone series. The compound (a) used is prefrably the one obtained from 4, 4'-diphenylmethane diisocyanate, for example, containing 10W70% residual isocyanate groups, and also the preferred amount of the compound (a) used is 1W30 equivalent % of the total isocyanate equivalent.
COPYRIGHT: (C)1980,JPO&Japio
JP5273779A 1979-04-28 1979-04-28 Polyamideimide resin composition Pending JPS55145758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5273779A JPS55145758A (en) 1979-04-28 1979-04-28 Polyamideimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5273779A JPS55145758A (en) 1979-04-28 1979-04-28 Polyamideimide resin composition

Publications (1)

Publication Number Publication Date
JPS55145758A true JPS55145758A (en) 1980-11-13

Family

ID=12923232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5273779A Pending JPS55145758A (en) 1979-04-28 1979-04-28 Polyamideimide resin composition

Country Status (1)

Country Link
JP (1) JPS55145758A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3212864A1 (en) 1981-04-06 1982-10-28 Hitachi Chemical Co., Ltd., Tokyo HEAT RESISTANT RESIN AND METHOD FOR THE PRODUCTION THEREOF
US4614782A (en) * 1981-04-08 1986-09-30 Hitachi Chemical Company, Ltd. Heat resistant resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3212864A1 (en) 1981-04-06 1982-10-28 Hitachi Chemical Co., Ltd., Tokyo HEAT RESISTANT RESIN AND METHOD FOR THE PRODUCTION THEREOF
DE3249497C2 (en) * 1981-04-06 1987-01-15 Hitachi Chemical Co., Ltd., Tokio/Tokyo, Jp
US4614782A (en) * 1981-04-08 1986-09-30 Hitachi Chemical Company, Ltd. Heat resistant resin composition

Similar Documents

Publication Publication Date Title
JPS5698221A (en) Curable resin composition
DK142886D0 (en) RESPONSIBLE POLYURETHAN BASES AND APPLICATIONS FOR THE PREPARATION OF COATINGS
ZA953592B (en) Isocyanates masked using hydroxyaromatic compounds.
EP0379131A3 (en) Thermosetting resin composition
JPS55145758A (en) Polyamideimide resin composition
GB1060159A (en) Polyisocyanate-based lacquer mixtures
JPS5624445A (en) Polyamide-imide resin soluble in cresol-based solvent
JPS5695920A (en) Polyamide-imide resin composition
JPS56136813A (en) Preparation of polyamide-imide resin soluble in cresol type solvent
JPS5624444A (en) Polyamide-imide resin composition
JPS55137161A (en) Polyamide-imide resin composition
JPS55145759A (en) Cresole-soluble polyamideimide resin composition
JPS5695919A (en) Preparation of polyamide-imide resin
JPS5751716A (en) Production of polyamide-imide resin soluble in cresol solvent
JPS5575417A (en) Production of polyamideimide resin soluble in cresol type solvent
JPS5590527A (en) Polyamideimide resin composition
JPS55125170A (en) Polyamideimide-coated insulated wire
JPS5641218A (en) Preparation of cresol-soluble polyamide-imide resin
JPS55149347A (en) Polyamide-imide resin composition
JPS55144051A (en) Cresol-soluble polyamide-imide resin composition
JPS5614518A (en) Production of polyamideimide resin
JPS5650934A (en) Heat-resistant prepreg
JPS57170918A (en) Heat-resistant resin composition
JPS5728128A (en) Heat-resistant composition
JPS57167345A (en) Heat-resistant resin composition