JPS55145758A - Polyamideimide resin composition - Google Patents
Polyamideimide resin compositionInfo
- Publication number
- JPS55145758A JPS55145758A JP5273779A JP5273779A JPS55145758A JP S55145758 A JPS55145758 A JP S55145758A JP 5273779 A JP5273779 A JP 5273779A JP 5273779 A JP5273779 A JP 5273779A JP S55145758 A JPS55145758 A JP S55145758A
- Authority
- JP
- Japan
- Prior art keywords
- polyamideimide resin
- solvent
- resin composition
- lactam
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a polyamideimide resin composition having good quick setting property and good flexibility by adding a polyamideimide resin synthesized in an N-methylpyrolidone solvent to polyisocyanate contg. an isocyanurate ring and a lactam-modified polyamideimide resin.
CONSTITUTION: A polyamideimide resin composition containing a polyamide resin (A), obtained from the reaction of poyisocyanate contg. an isocyanurate ring (a), an aromatic diisocyante (b), a lactam (c), and a polycarboxylic acid (d) having an acid anhydride group in a solvent of cresol series, and a polyamide resin (B) synthesized in a solvent of N-methylpyrrolidone series. The compound (a) used is prefrably the one obtained from 4, 4'-diphenylmethane diisocyanate, for example, containing 10W70% residual isocyanate groups, and also the preferred amount of the compound (a) used is 1W30 equivalent % of the total isocyanate equivalent.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5273779A JPS55145758A (en) | 1979-04-28 | 1979-04-28 | Polyamideimide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5273779A JPS55145758A (en) | 1979-04-28 | 1979-04-28 | Polyamideimide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55145758A true JPS55145758A (en) | 1980-11-13 |
Family
ID=12923232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5273779A Pending JPS55145758A (en) | 1979-04-28 | 1979-04-28 | Polyamideimide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145758A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3212864A1 (en) | 1981-04-06 | 1982-10-28 | Hitachi Chemical Co., Ltd., Tokyo | HEAT RESISTANT RESIN AND METHOD FOR THE PRODUCTION THEREOF |
US4614782A (en) * | 1981-04-08 | 1986-09-30 | Hitachi Chemical Company, Ltd. | Heat resistant resin composition |
-
1979
- 1979-04-28 JP JP5273779A patent/JPS55145758A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3212864A1 (en) | 1981-04-06 | 1982-10-28 | Hitachi Chemical Co., Ltd., Tokyo | HEAT RESISTANT RESIN AND METHOD FOR THE PRODUCTION THEREOF |
DE3249497C2 (en) * | 1981-04-06 | 1987-01-15 | Hitachi Chemical Co., Ltd., Tokio/Tokyo, Jp | |
US4614782A (en) * | 1981-04-08 | 1986-09-30 | Hitachi Chemical Company, Ltd. | Heat resistant resin composition |
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