JPS568453A - Polyamide-imide resin composition - Google Patents
Polyamide-imide resin compositionInfo
- Publication number
- JPS568453A JPS568453A JP8433579A JP8433579A JPS568453A JP S568453 A JPS568453 A JP S568453A JP 8433579 A JP8433579 A JP 8433579A JP 8433579 A JP8433579 A JP 8433579A JP S568453 A JPS568453 A JP S568453A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- imide resin
- acid
- contg
- temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Abstract
PURPOSE: To provide titled compsn. having excellent wear resistance, Freon resistance and softening resistance, consisting of a specified polyamide-imide resin and a polyester resin having hydroxyl gp.
CONSTITUTION: (a) 1W30 equivalent % (based on the amount of total isocyanate equivalents) of an isocyanurate ring-contg. polyisocyanate having a residual isocyanate content of 10W70%, is reacted with (b) 30W80 equivalent % (base on the amount of total isocyanate equivalents) of a lactam such as ε-caprolactam and (c) an arom. diisocyanate such as tolylene diisocyanate in cresol solvent at a temp of 160W190°C for 1W3hr. Then (d) a polycarboxylic acid having acid anhydride gp. is added to the reaction mixt. in such a proportion as to give a ratio of carboxyl gp. and acid anhydride gp. to isocyanate gp. of 1.5W0.7. Further, the reaction is continued at a temp of 200W220°C for 10W20hr to produce a polyamide-imide resin (A). Then (B) 1W300wt% of a hydroxyl gp.-contg. polyester resin drived from terephthalic acid and/or isophthalic acid, is blended with the above (A).
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8433579A JPS568453A (en) | 1979-07-02 | 1979-07-02 | Polyamide-imide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8433579A JPS568453A (en) | 1979-07-02 | 1979-07-02 | Polyamide-imide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS568453A true JPS568453A (en) | 1981-01-28 |
JPS575416B2 JPS575416B2 (en) | 1982-01-30 |
Family
ID=13827629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8433579A Granted JPS568453A (en) | 1979-07-02 | 1979-07-02 | Polyamide-imide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS568453A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503723A1 (en) * | 1981-04-08 | 1982-10-15 | Hitachi Chemical Co Ltd | HEAT RESISTANT RESIN COMPOSITION AND ISOLATED WIRES THEREOF |
JP2010205542A (en) * | 2009-03-03 | 2010-09-16 | Furukawa Electric Co Ltd:The | Multilayer insulated wire |
-
1979
- 1979-07-02 JP JP8433579A patent/JPS568453A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503723A1 (en) * | 1981-04-08 | 1982-10-15 | Hitachi Chemical Co Ltd | HEAT RESISTANT RESIN COMPOSITION AND ISOLATED WIRES THEREOF |
JP2010205542A (en) * | 2009-03-03 | 2010-09-16 | Furukawa Electric Co Ltd:The | Multilayer insulated wire |
Also Published As
Publication number | Publication date |
---|---|
JPS575416B2 (en) | 1982-01-30 |
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