JPS57111352A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS57111352A JPS57111352A JP18763680A JP18763680A JPS57111352A JP S57111352 A JPS57111352 A JP S57111352A JP 18763680 A JP18763680 A JP 18763680A JP 18763680 A JP18763680 A JP 18763680A JP S57111352 A JPS57111352 A JP S57111352A
- Authority
- JP
- Japan
- Prior art keywords
- acid anhydride
- anhydride group
- arom
- carboxyl
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 3
- 125000004018 acid anhydride group Chemical group 0.000 abstract 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 3
- 229930003836 cresol Natural products 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 2
- 150000008065 acid anhydrides Chemical group 0.000 abstract 2
- 125000005442 diisocyanate group Chemical group 0.000 abstract 2
- 150000003951 lactams Chemical class 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- 239000004962 Polyamide-imide Substances 0.000 abstract 1
- 125000002723 alicyclic group Chemical group 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 239000000806 elastomer Substances 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
PURPOSE: The titled composition with excellent flexibility and miscibility with another resin, prepd. by the reaction of an arom, diisocyanate, a lactam, an acid anhydride group-contg. polycarboxylic acid, and a specified compd. in the presence of a cresol solvent.
CONSTITUTION: A composition comprising a cresol solvent-soluble polyamideimide resin obtd. by the reaction of an arom. diisocyanate, a lactam in an amt. of 20W90eq.% based on the total isocyanate group, an acid anhydride group- contg. polycarboxylic acid, and a compd. of the formula (wherein X is carboxyl or acid anhydride group; Y is carboxyl, acid anhydride group, OH or NH2; R is arom., alipth., alicyclic or heterocyclic residue) in an amt. of 1W20eq.% based on the total carboxyl group and acid anhydride group in the presence of a cresol solvent, and an elastomer or an intermediate thereof. A coat excellent in heat, Freon and wear resistance and having adequate flexibility is obtd. from said composition.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18763680A JPS57111352A (en) | 1980-12-29 | 1980-12-29 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18763680A JPS57111352A (en) | 1980-12-29 | 1980-12-29 | Heat-resistant resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57111352A true JPS57111352A (en) | 1982-07-10 |
Family
ID=16209574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18763680A Pending JPS57111352A (en) | 1980-12-29 | 1980-12-29 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57111352A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120000696A1 (en) * | 2009-03-16 | 2012-01-05 | Sun Chemical B.V. | Liquid coverlays for flexible printed circuit boards |
| US20120222889A1 (en) * | 2009-10-29 | 2012-09-06 | Sun Chemical B.V. | Polyamideimide adhesives for printed circuit boards |
-
1980
- 1980-12-29 JP JP18763680A patent/JPS57111352A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120000696A1 (en) * | 2009-03-16 | 2012-01-05 | Sun Chemical B.V. | Liquid coverlays for flexible printed circuit boards |
| US20120222889A1 (en) * | 2009-10-29 | 2012-09-06 | Sun Chemical B.V. | Polyamideimide adhesives for printed circuit boards |
| US9668360B2 (en) * | 2009-10-29 | 2017-05-30 | Sun Chemical Corporation | Polyamideimide adhesives for printed circuit boards |
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