JPS57109529A - Manufacture of laminated blanking die by turret punch press - Google Patents
Manufacture of laminated blanking die by turret punch pressInfo
- Publication number
- JPS57109529A JPS57109529A JP16845080A JP16845080A JPS57109529A JP S57109529 A JPS57109529 A JP S57109529A JP 16845080 A JP16845080 A JP 16845080A JP 16845080 A JP16845080 A JP 16845080A JP S57109529 A JPS57109529 A JP S57109529A
- Authority
- JP
- Japan
- Prior art keywords
- die
- blanking
- laminated
- punch press
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Punching Or Piercing (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Abstract
PURPOSE: To manufacture a laminated blanking die of high accuracy by blanking a number of metallic plates for lamination that have blanking holes, dividing them into two, and after laminating then attaching a punch holder and a die holder to each laminate to make them an upper die and lower die respectively.
CONSTITUTION: A program tape of a drawing of required dimension and shape of a product is put in a computer 3. A metallic plate 4 for lamination is set on the table of an NC turrent punch press 5. The press 5 is operated by signals of above-mentioned program tape 2, and a number of metallic plates 6 for lamination having the same shape are blanked. The metallic plates are divided into two and laminated to form laminates 11, 12, and the laminates 11, 12, are fixed to a punch holder 14 and a die holder 15 to form an upper die and a lower die respectively. Next, a hard metallic plate 10 is blanked by the punch press 5 and fixed to the surface of the lower die to form an edge for blanking. Thus a highly accurate blanking die can be manufactured in a short time and at low cost.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16845080A JPS5842766B2 (en) | 1980-11-29 | 1980-11-29 | Manufacturing method for laminated punching molds using a tallest punch press |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16845080A JPS5842766B2 (en) | 1980-11-29 | 1980-11-29 | Manufacturing method for laminated punching molds using a tallest punch press |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57109529A true JPS57109529A (en) | 1982-07-08 |
JPS5842766B2 JPS5842766B2 (en) | 1983-09-21 |
Family
ID=15868327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16845080A Expired JPS5842766B2 (en) | 1980-11-29 | 1980-11-29 | Manufacturing method for laminated punching molds using a tallest punch press |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5842766B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925325U (en) * | 1982-07-31 | 1984-02-16 | 有限会社前田鉄工所 | Mold |
JPS59165724U (en) * | 1983-04-22 | 1984-11-07 | 株式会社東芝 | Cutting die |
JPS6066640U (en) * | 1983-10-13 | 1985-05-11 | 駿河精機株式会社 | Laminated die set |
JPS6066641U (en) * | 1983-10-13 | 1985-05-11 | 駿河精機株式会社 | Laminated structure type |
JP2003071793A (en) * | 2001-08-31 | 2003-03-12 | Kyocera Corp | Mold for ceramic perforating apparatus |
JP2011061058A (en) * | 2009-09-11 | 2011-03-24 | Molex Inc | Die for flexible printed circuit board and method of manufacturing flexible printed circuit board |
-
1980
- 1980-11-29 JP JP16845080A patent/JPS5842766B2/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925325U (en) * | 1982-07-31 | 1984-02-16 | 有限会社前田鉄工所 | Mold |
JPS59165724U (en) * | 1983-04-22 | 1984-11-07 | 株式会社東芝 | Cutting die |
JPS6066640U (en) * | 1983-10-13 | 1985-05-11 | 駿河精機株式会社 | Laminated die set |
JPS6066641U (en) * | 1983-10-13 | 1985-05-11 | 駿河精機株式会社 | Laminated structure type |
JPS6317535Y2 (en) * | 1983-10-13 | 1988-05-18 | ||
JP2003071793A (en) * | 2001-08-31 | 2003-03-12 | Kyocera Corp | Mold for ceramic perforating apparatus |
JP2011061058A (en) * | 2009-09-11 | 2011-03-24 | Molex Inc | Die for flexible printed circuit board and method of manufacturing flexible printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS5842766B2 (en) | 1983-09-21 |
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