JPS57107863A - Manufacture of thermal head - Google Patents

Manufacture of thermal head

Info

Publication number
JPS57107863A
JPS57107863A JP55185833A JP18583380A JPS57107863A JP S57107863 A JPS57107863 A JP S57107863A JP 55185833 A JP55185833 A JP 55185833A JP 18583380 A JP18583380 A JP 18583380A JP S57107863 A JPS57107863 A JP S57107863A
Authority
JP
Japan
Prior art keywords
burning
glazed layer
thick film
film circuit
heating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55185833A
Other languages
Japanese (ja)
Other versions
JPS6048338B2 (en
Inventor
Tamio Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55185833A priority Critical patent/JPS6048338B2/en
Publication of JPS57107863A publication Critical patent/JPS57107863A/en
Publication of JPS6048338B2 publication Critical patent/JPS6048338B2/en
Expired legal-status Critical Current

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Abstract

PURPOSE: To conduct surely and easily the connection of a heating resistor with a driving circuit part without damaging a glazed layer by forming the glazed layer and a thick film circuit on separate substrates beforehand and by bonding later the substrates to each other with glass or the like.
CONSTITUTION: The first substrate 11 whereon the glazed layer 11 is formed by printing and burning and the second substrate 12 whereon the thick film circuit 12 is formed by printing and burning are formed separately. Then, the tapered end surfaces of the first and second substrates 11 and 12 are placed opposite to each other and glass paste is printed on the part of an aperture between the end surfaces and burnt. Since the temperature of burning of the glass 13 is lower than the temperature of burning and the softening point of the glazed layer 11 and further the temperature of burning of the thick film circuit 12, no damages are caused in the glazed layer 11 and the thick film circuit 12. Next, the heating resistor 14 is formed on the glazed layer 11 and further a conductor pattern 15 connecting the heating resistor 14 with the driving circuit part 3 is formed.
COPYRIGHT: (C)1982,JPO&Japio
JP55185833A 1980-12-26 1980-12-26 Thermal head manufacturing method Expired JPS6048338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55185833A JPS6048338B2 (en) 1980-12-26 1980-12-26 Thermal head manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185833A JPS6048338B2 (en) 1980-12-26 1980-12-26 Thermal head manufacturing method

Publications (2)

Publication Number Publication Date
JPS57107863A true JPS57107863A (en) 1982-07-05
JPS6048338B2 JPS6048338B2 (en) 1985-10-26

Family

ID=16177671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185833A Expired JPS6048338B2 (en) 1980-12-26 1980-12-26 Thermal head manufacturing method

Country Status (1)

Country Link
JP (1) JPS6048338B2 (en)

Also Published As

Publication number Publication date
JPS6048338B2 (en) 1985-10-26

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