JPS57105479A - Hot-melt adhesive - Google Patents

Hot-melt adhesive

Info

Publication number
JPS57105479A
JPS57105479A JP18327680A JP18327680A JPS57105479A JP S57105479 A JPS57105479 A JP S57105479A JP 18327680 A JP18327680 A JP 18327680A JP 18327680 A JP18327680 A JP 18327680A JP S57105479 A JPS57105479 A JP S57105479A
Authority
JP
Japan
Prior art keywords
butadiene
component
cyclohexylene
phenylene
acrylonitrile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18327680A
Other languages
Japanese (ja)
Other versions
JPS6360797B2 (en
Inventor
Hajime Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd filed Critical Daicel Corp
Priority to JP18327680A priority Critical patent/JPS57105479A/en
Publication of JPS57105479A publication Critical patent/JPS57105479A/en
Publication of JPS6360797B2 publication Critical patent/JPS6360797B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The titled flexible adhesive to bond firmly various kinds of materials for adhesion, comprising a copolyamide obtained by copolymerizing a specific polyamide high polymer component with a specified styrene-butadiene or acrylonitrile-butadiene copolymer component in a specific ratio.
CONSTITUTION: (A) 99W5pts.wt. polyamide high polymer component (e.g., 12 aminododecanoic acid, etc.) having one or more repeating units shown by the formulaI(n is 5W11) or formula II[X is CmH2n (m is 6W12), isophorone, phenylene, cyclohexylene; Y is ClH2l (l is 4W10), phenylene, cyclohexylene]is copolymerized with (B) 1W95pts.wt. polybutadiene component having carboxylic groups or amino groups at the both terminations and a molecular weight of 500W10,000, or styrene-butadiene or acrylonitrile-butadiene copolymer component having ≥50wt% butadiene, to give the desired adhesive.
USE: Useful for bonding a padding cloth of a dress.
COPYRIGHT: (C)1982,JPO&Japio
JP18327680A 1980-12-23 1980-12-23 Hot-melt adhesive Granted JPS57105479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18327680A JPS57105479A (en) 1980-12-23 1980-12-23 Hot-melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18327680A JPS57105479A (en) 1980-12-23 1980-12-23 Hot-melt adhesive

Publications (2)

Publication Number Publication Date
JPS57105479A true JPS57105479A (en) 1982-06-30
JPS6360797B2 JPS6360797B2 (en) 1988-11-25

Family

ID=16132817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18327680A Granted JPS57105479A (en) 1980-12-23 1980-12-23 Hot-melt adhesive

Country Status (1)

Country Link
JP (1) JPS57105479A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4946907A (en) * 1982-12-24 1990-08-07 The Secretary Of State For Defense In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Curable thermosetting prepolymerized imide resin compositions
US5087681A (en) * 1982-12-24 1992-02-11 Secretary Of State For Defence In Her Majesty's Government Of United Kingdom Composition from reacting vinylidene terminated polybutadiene/acrylonitrile and bisimide
JP2008045036A (en) * 2006-08-17 2008-02-28 Toyobo Co Ltd Polyamide resin, and composition and adhesive each using the same, adhesive sheet using the adhesive, and printed circuit board using the adhesive sheet
CN109852329A (en) * 2019-01-03 2019-06-07 山东凯恩新材料科技有限公司 A kind of mutual inductor insulation polyamide special type injection molding material and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4946907A (en) * 1982-12-24 1990-08-07 The Secretary Of State For Defense In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Curable thermosetting prepolymerized imide resin compositions
US5087681A (en) * 1982-12-24 1992-02-11 Secretary Of State For Defence In Her Majesty's Government Of United Kingdom Composition from reacting vinylidene terminated polybutadiene/acrylonitrile and bisimide
JP2008045036A (en) * 2006-08-17 2008-02-28 Toyobo Co Ltd Polyamide resin, and composition and adhesive each using the same, adhesive sheet using the adhesive, and printed circuit board using the adhesive sheet
CN109852329A (en) * 2019-01-03 2019-06-07 山东凯恩新材料科技有限公司 A kind of mutual inductor insulation polyamide special type injection molding material and preparation method thereof

Also Published As

Publication number Publication date
JPS6360797B2 (en) 1988-11-25

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