CN109852329A - A kind of mutual inductor insulation polyamide special type injection molding material and preparation method thereof - Google Patents
A kind of mutual inductor insulation polyamide special type injection molding material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a kind of mutual inductor insulation polyamide special type injection molding materials and preparation method thereof, the insulation polyamide special type injection molding material is by mass percentage, including following components: aliphatic dimeric dibasic acid 45%-55%, aliphatic dicarboxylic acid 5%-20%, aliphatic diamine 35%-50%, 0.01%-0.1% antioxidant stabilizer, acid catalyst 0.01%-0.1%, nanometer piezoelectric ceramics 2%-15%.The features such as mutual inductor of the present invention insulation polyamide special type injection molding material, not only dielectric strength with higher, excellent insulation performance, and surface hardness are high, and heat-resisting weather-proof wearability is good, and practicability is high.
Description
Technical field
The present invention relates to a kind of mutual inductor insulation polyamide special type injection molding materials and preparation method thereof, belong to extraordinary injection molding material
Adhesive field.
Background technique
Mutual inductor is also known as instrument transformer, is the general designation of current transformer and voltage transformer.High voltage can be become
Low-voltage, high current become low current, for measuring or protecting system.Its function mainly by high voltage or high current in proportion
It is transformed into normal low voltage (100V) or standard small electric current (5A or 1A, refer both to rated value), to realize that measuring instrumentss, protection are set
Standby and automatic control equipment standardization, miniaturization.Simultaneously mutual inductor may further be used to separate high-voltage system, with guarantee the person and
The safety of equipment.Therefore the material of manufacture mutual inductor is particularly important, and 35kv or less the cast-type mutual inductor overwhelming majority uses at present
Be epoxy resin or other resin mixed material moulding by casting, moisture-proof, Water-proof and oil-proof, dust-proof function are excellent, wet-heat resisting
It is also very excellent with anti-aging property, but its bottleneck long there are pouring technology complexity, production cycle, therefore utilize other materials
Substitution epoxy resin encapsulated also becomes a kind of trend of mutual inductor production.
Polyamide special type injection molding material is a kind of widely used hotmelt, be by two or more monomer by
The multiple copolymer that certain proportion polycondensation reaction obtains.Polyamide special type injection molding material has adhesive strength high, and thermal stability is good, resistance to
Dielectric behavior is good, to timber, metal, ceramics, fabric, paper and phenolic resin etc. all with good adhesive property, and with
Its excellent comprehensive performance is referred to as high-grade special injection molding material.Note is had the advantage that using the injection molding of polyamide special type injection molding material
Blow pressure is low, will not damage encapsulation responsive type component;Simplification of flowsheet several seconds to a few minutes rapid curing, improves production
Power;No chemical reaction: use simple one-component material, process, cleaning, cycle time short;Excellent material property, flame retardant property
It is good, flexible and miniaturization product design, processability, beautify product appearance;Waterproof, moisture-proof, electrical isolation, buffer, resistance toization
Learn corrosivity, resistance to gasoline, solvent, oil, ethyl alcohol, acid, caustic corrosion;It is authenticated by UL94 V-0, height temperature stability heat-resisting is followed
Ring, cold resistance, temperature tolerance (- 40 DEG C to 150 DEG C) by force, are free of any noxious material, meet RoHS instruction, recoverable, drop
Low total production cost has eliminated the carrier box that must be used in dosing technology, without being heating and curing, energy conservation, and in PCB encapsulation,
Compared to dosing technology, the usage amount of encapsulating material is substantially reduced, using aluminum mold, die cost can be reduced etc..
Summary of the invention
The present invention is in view of the shortcomings of the prior art, provide the insulation polyamide special type injection molding material and its system of a kind of mutual inductor
Preparation Method replaces epoxide-resin glue to encapsulate mutual inductor, epoxide-resin glue is no less than in terms of insulation using such extraordinary injection molding material,
Cost of labor is low, and material can be repeated several times utilization, no waste and pollution, and technique is more advanced, there is biggish application prospect.
The technical scheme to solve the above technical problems is that
A kind of mutual inductor insulation polyamide special type injection molding material and preparation method thereof, which presses quality
Percentages, including following components: aliphatic dimeric dibasic acid 45%-55%, aliphatic dicarboxylic acid 5%-20%, aliphatic diamine 35%-
50%, 0.01%-0.1% antioxidant stabilizer, acid catalyst 0.01%-0.1%, nanometer piezoelectric ceramics 2%-15%.
On the basis of above-mentioned technical proposal, this programme can also do following improvement.
Further, the aliphatic dimeric dibasic acid is the aliphatic dimeric dibasic acid that carbon atom number is 18.
Further, it is by the vegetable oil such as soybean oil, cottonseed oil, rapeseed oil that the carbon atom number, which is 18 aliphatic dimeric dibasic acids,
Unsaturated fatty acid be polymerized.
Further, the carbon atom number is in 18 aliphatic dimeric dibasic acids, and dimer acids account for aliphatic dimeric dibasic acid gross mass
80%-90%。
Further, the aliphatic dicarboxylic acid is the aliphatic dicarboxylic acid that carbon atom number is 6-12, it is preferable that binary
Carboxylic acid is one of adipic acid, pimelic acid, azelaic acid, decanedioic acid and ten binary diacid or any several mixture.
Further, the aliphatic diamine is that carbon atom number is 2-8 aliphatic diamine or is 2-8 rouge by carbon atom number
The derivative that fat race diamine is derived.
Further, the aliphatic diamine is the aliphatic diamine that carbon atom number is 2-12, is hexamethylene diamine, the third two
One of amine, butanediamine, pentanediamine or 2 methyl pentamethylenediamine or any several mixture.Preferably, the aliphatic two
First amine is one of ethylenediamine, butanediamine, pentanediamine, hexamethylene diamine or any several mixture.It is highly preferred that the fat
Race's diamine is ethylenediamine.
Further, the acid catalyst is one of phosphoric acid, hypophosphorous acid, phosphorous acid or benzoic acid, isobutyric acid or appoints
It anticipates several mixtures.
The two of the technology of the present invention method, as follows:
A kind of preparation method of mutual inductor insulation polyamide special type injection molding material, comprising the following steps:
(1) aliphatic dimeric dibasic acid 45%-55%, aliphatic dicarboxylic acid 5%-20%, aliphatic diamine 35%- are added into reaction flask
50%, 0.01%-0.1% antioxidant stabilizer, acid catalyst 0.01%-0.1%, nanometer piezoelectric ceramics 2%-15%, the above percentage are equal
It is calculated with accounting for the mass percent of mutual inductor insulation polyamide special type injection molding material gross mass.
(2) the quality percentage for accounting for mutual inductor insulation polyamide special type injection molding material gross mass is added into constant pressure titration funnel
Aliphatic diamine than 40%-55% is then passed through nitrogen into reaction flask, and stirring heating reaches 130 DEG C to reaction temperature,
Start that aliphatic diamine is added dropwise into reaction flask, time for adding is in 40-60min.
After (3) 140 DEG C add aliphatic diamine, 240 DEG C are to slowly warm up to, insulation reaction 1h is then vacuumized
Decompression keeps vacuum degree < 100Pa, keeps reaction 3-5h, and final molten product is mutual inductor insulation polyamide special type injection molding
Material.
It is 30-50KV/ that mutual inductor, which is made, with insulation polyamide special type injection molding material dielectric strength in preparation method through the invention
Mm, preferably 35-45KV/mm, high temperature melt viscosity (220 DEG C) 2000-8000mPas, preferably 3000-7000 mPas are soft
80-200 DEG C of point of change, preferably 100-200 DEG C.
Compared with prior art, advantages of the present invention is as follows:
Excellent insulating property, it is high that polyamide special type injection molding material is made in dielectric strength than before.
Adhesive strength is high, and the receipts of colloid itself are reduced after traditional polyamide special type injection molding material addition nanometer piezoelectric ceramic powder
Shrinkage improves adhesive strength.
Heat-resisting, weather-proof, wearability, toughness are high, extend the service life of mutual inductor.Nanometer piezoelectric ceramic powder is infused in addition to improving
Outside the insulation characterisitic of plastic substrate, itself mechanical strength and heat resistance with higher, wearability, therefore improve matrix
Weather-proof, wearability.Due to being dispersed in polyamide special type injection molding material matrix for nanometer piezoelectric ceramics uniform particle, when matrix by
To when impact, microcrack is generated between particle and matrix, the matrix between particle also generates plastic deformation, absorbs impact energy and reaches
The effect of toughening.It can be allowed to molten without extraordinary injection molding material machine or extraordinary injection molding expects pipe, extraordinary injection molding spray gun, conventional injection molding material machine
Change, it is convenient to use.
Specific embodiment
Material requested of the present invention is commercially available in addition to specified otherwise.
Below with reference to the inventive embodiments, complete, clearly description is carried out to the technical solution in the inventive embodiments.It is aobvious
So, described embodiment is only section Example of the invention, rather than whole embodiments.Based on embodiment in the present invention,
Those of ordinary skill in the art obtain every other embodiment not making under creative work premise, belong to this hair
Bright protection scope.
Embodiment 1
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 127.5g, decanedioic acid 15g, hypophosphorous acid 2g, antioxidant 1010 5g, nanometer piezoelectric ceramic powder 25g, 100ml constant pressure drop
Add in funnel addition ethylenediamine 87.5g, it is anti-oxidation to be passed through nitrogen, stirring heat temperature raising simultaneously, when reaction temperature is 130 DEG C,
Start that ethylenediamine is added dropwise, in 40-60min, temperature is controlled within 140 DEG C for time for adding control, after completion of dropwise addition, is started slow
240 DEG C are warming up to, temperature-rise period has water to distillate, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression with vacuum pump, very
Reciprocal of duty cycle < 100Pa, the mixing speed for being maintained at constant react 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide of melting is special
Kind injection molding material is poured on tetrachloro-ethylene plate, obtains brown film, and drying is tested afterwards for 24 hours at 50 DEG C.
Embodiment 2
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 125g, azelaic acid 17.5g, hypophosphorous acid 2g, antioxidant 1010 5g, nanometer piezoelectric ceramic powder 25g, 100ml constant pressure drop
Add in funnel addition ethylenediamine 87g, is passed through that nitrogen is anti-oxidation, and heat temperature raising is opened when reaction temperature is 130 DEG C simultaneously for stirring
Begin that ethylenediamine is added dropwise, in 40-60min, temperature is controlled within 140 DEG C for time for adding control, after completion of dropwise addition, starts slowly to rise
For temperature to 240 DEG C, temperature-rise period has water to distillate, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression, vacuum with vacuum pump
< 100Pa is spent, the mixing speed for being maintained at constant reacts 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide of melting is extraordinary
Injection molding material is poured on tetrachloro-ethylene plate, obtains brown film, and drying is tested afterwards for 24 hours at 50 DEG C.
Embodiment 3
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 122.5g, pimelic acid 20g, hypophosphorous acid 2g, antioxidant 1010 5g, nanometer piezoelectric ceramic powder 25g, 100ml constant pressure drop
Add in funnel addition ethylenediamine 90g, is passed through that nitrogen is anti-oxidation, and heat temperature raising is opened when reaction temperature is 130 DEG C simultaneously for stirring
Begin that ethylenediamine is added dropwise, in 40-60min, temperature is controlled within 140 DEG C for time for adding control, after completion of dropwise addition, starts slowly to rise
For temperature to 240 DEG C, temperature-rise period has water to distillate, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression, vacuum with vacuum pump
< 100Pa is spent, the mixing speed for being maintained at constant reacts 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide of melting is extraordinary
Injection molding material is poured on tetrachloro-ethylene plate, obtains brown film, and drying is tested afterwards for 24 hours at 50 DEG C.
Embodiment 4
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 120g, decanedioic acid 16.5g, hypophosphorous acid 2g, antioxidant 1010 5g, nanometer piezoelectric ceramic powder 25g, 100ml constant pressure drop
Add in funnel addition ethylenediamine 87.5g, it is anti-oxidation to be passed through nitrogen, stirring heat temperature raising simultaneously, when reaction temperature is 130 DEG C,
Start that ethylenediamine is added dropwise, in 40-60min, temperature is controlled within 140 DEG C for time for adding control, after completion of dropwise addition, is started slow
240 DEG C are warming up to, temperature-rise period has water to distillate, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression with vacuum pump, very
Reciprocal of duty cycle < 100Pa, the mixing speed for being maintained at constant react 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide of melting is special
Kind injection molding material is poured on tetrachloro-ethylene plate, obtains brown film, and drying is tested afterwards for 24 hours at 50 DEG C.
Embodiment 5
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 117.5g, decanedioic acid 22.5g, hypophosphorous acid 2g, antioxidant 1010 5g, nanometer piezoelectric ceramic powder 25g, 100ml constant pressure
Ethylenediamine 87g is added in addition funnel, it is anti-oxidation to be passed through nitrogen, stirring heat temperature raising simultaneously, when reaction temperature is 130 DEG C,
Start that ethylenediamine is added dropwise, in 40-60min, temperature is controlled within 140 DEG C for time for adding control, after completion of dropwise addition, is started slow
240 DEG C are warming up to, temperature-rise period has water to distillate, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression with vacuum pump, very
Reciprocal of duty cycle < 100Pa, the mixing speed for being maintained at constant react 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide of melting is special
Kind injection molding material is poured on tetrachloro-ethylene plate, obtains brown film, and drying is tested afterwards for 24 hours at 50 DEG C.
Comparative example
One equipped with mechanical agitator, thermometer, condenser pipe, nitrogen access tube 500ml four-hole boiling flask in, be added fat
Race dimeric dibasic acid 127.5g, decanedioic acid 15g, hypophosphorous acid 2g, ethylenediamine is added in antioxidant 1010 5g, 100ml constant pressure dropping funnel
87.5g, it is anti-oxidation to be passed through nitrogen, and heat temperature raising starts that ethylenediamine is added dropwise, be added dropwise when reaction temperature is 130 DEG C simultaneously for stirring
Time control controls within 140 DEG C in 40-60min, temperature, after completion of dropwise addition, starts to be to slowly warm up to 240 DEG C, heat up
Cheng Youshui is distillated, and when reaction temperature reaches 240 DEG C, is carried out vacuumizing decompression with vacuum pump, vacuum degree < 100Pa is maintained at
Constant mixing speed reacts 4h, and releasing vacuum after 4h, reaction was completed, and the polyamide special type injection molding material of melting is poured on four chloroethenes
On alkene plate, brown film is obtained, drying is tested afterwards for 24 hours at 50 DEG C.
The various performances of sample made from embodiment 1-5 are tested in accordance with the following methods.
Softening point test: it is tested according to ASTM E-28.
Melt viscosity test: it using the melt viscosity of Brookfield DV-E type rotational viscometer test sample, weighs
The 10g mutual inductor extraordinary injection molding material sample of insulation, when test, select the rotor of model S27, and temperature is controlled at 220 DEG C, and
The constantly adjustment speed of rotation, is located at test value in the 20%-90% range of linearity, records measured value after stablizing.
Tensile strength and test of elongation rate: dumbbell shape is made according to standard ASTM-D638-2003 in sample, measures material
Expect tensile property test.
Shore D hardness test: testing according to ASTM D-2240-05, measures material shore hardness D.
Softening point test: testing according to ASTM E-28, measures material softening point.
Dielectric strength test: GB/T 1408.1 is tested, and measures dielectric material intensity.
Sample made from Examples 1 to 5 and comparison example properties of sample contrast test the results are shown in Table 1.
Table 1
As shown in Table 1, mutual inductor provided in an embodiment of the present invention is obviously high with insulation its dielectric strength of polyamide special type injection molding material
In common polyamide special type injection molding material, and other performance is excellent, fully meets mutual inductor injection molding and uses.
The foregoing is merely the preferable experimental examples of the invention, not to limit the invention, all spirit in the invention
Any modifications, equivalent replacements, and improvements etc. with being done within principle, should be included within the scope of the present invention.
Claims (9)
1. a kind of mutual inductor insulation polyamide special type injection molding material, which is characterized in that mutual inductor insulation polyamide special type injection molding
Material raw material composition and each component are calculated in mass percent, including following components: aliphatic dimeric dibasic acid 45%-55%, aliphatic dicarboxyl
Sour 5%-20%, aliphatic diamine 35%-50%, 0.01%-0.1% antioxidant stabilizer, acid catalyst 0.01%-0.1%, nanometer piezoelectricity
Ceramic 2%-15%.
2. mutual inductor according to claim 1 insulation polyamide special type injection molding material, it is characterized in that, the nanometer piezoelectricity
Ceramic powder is that barium titanate, CaCu 3 Ti 4 O, inclined potassium-sodium niobate, inclined strontium barium niobate be one such or several combinations, partial size 60 ~
80nm。
3. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that aliphatic dimeric dibasic acid
For C18Aliphatic dimeric dibasic acid, the C18Aliphatic dimeric dibasic acid is by dimerized linoleic acid, dimerization oleic acid, dimerization linolenic acid, dimerization beans
One of oleic acid and dimerization elaidic acid are obtained with dimerization eleostearic acid derivative.
4. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that trimer acid accounts for fat
The 5%-10% of race's dimeric dibasic acid gross mass, dimeric dibasic acid account for the 80%-90% of aliphatic dimeric dibasic acid gross mass, and monomer acids account for aliphatic dimerization
The 5%-10% of sour gross mass.
5. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that the aliphatic two
First carboxylic acid is C6-C12Aliphatic dicarboxylic acid, such as one of adipic acid, pimelic acid, azelaic acid, decanedioic acid and ten binary diacid
Or any several mixture.
6. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that the aliphatic two
First amine is C2-C8Aliphatic diamine or by C2-C8The derivative that aliphatic diamine is derived, for example hexamethylene diamine, propane diamine, fourth
One of diamines, pentanediamine or 2 methyl pentamethylenediamine or any several mixture.
7. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that antioxidant four
[β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester, β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid
Positive octadecanol ester, 1,1,3- tri- (2- methyl -4- hydroxyl -5- tert-butyl-phenyl) butane, 2- tertiary butyl -6- methylphenol;
One of 2- (1,1- dimethyl ethyl) -6- methyl-phenol or any several mixture.
8. mutual inductor according to claim 1 insulation polyamide special type injection molding material, which is characterized in that acid catalyst is
One of phosphoric acid, hypophosphorous acid and phosphorous acid or any several mixture.
9. according to claim 1 mutual inductor with insulation polyamide special type injection molding material, which is characterized in that the method includes with
Under several steps:
(1) aliphatic dimeric dibasic acid 45%-55%, aliphatic dicarboxylic acid 5%-20%, aliphatic diamine 35%- are added into reaction flask
50%, 0.01%-0.1% antioxidant stabilizer, acid catalyst 0.01%-0.1%, nanometer piezoelectric ceramics 2%-15%, the above percentage are equal
It is calculated with accounting for the mass percent of mutual inductor insulation polyamide special type injection molding material quality;
(2) fat for accounting for the 35%-50% of mutual inductor insulation polyamide special type injection molding material mass percent is added into minim pipette
Race's diamines, is then passed through nitrogen into minim pipette, and stirring heating reaches 130 DEG C to reaction temperature, starts to be added dropwise into reaction flask
Aliphatic diamine, time for adding is in 40-60min;
It after (3) 140 DEG C add aliphatic diamine, is rapidly heated to 240 DEG C, insulation reaction 1h, then carries out vacuumizing decompression, protect
Vacuum degree < 100Pa is held, reaction 3-5h is kept, final molten product is mutual inductor insulation polyamide special type injection molding material.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57105479A (en) * | 1980-12-23 | 1982-06-30 | Daicel Chem Ind Ltd | Hot-melt adhesive |
CN102220105A (en) * | 2011-04-29 | 2011-10-19 | 烟台德邦电子材料有限公司 | Dimer acid type polyamide hot melt adhesive and preparation method thereof |
CN103087449A (en) * | 2013-01-16 | 2013-05-08 | 南昌航空大学 | Preparation method of polymer nanometer composite material with high heat conduction, high dielectric and low loss |
CN103555263A (en) * | 2013-10-30 | 2014-02-05 | 安庆市虹泰新材料有限责任公司 | Method for preparing dimer acid type copolymerized polyamide hot melt adhesive |
CN103589386A (en) * | 2013-10-29 | 2014-02-19 | 烟台德邦科技有限公司 | Biodegradable polyamide hot-melt adhesive and preparation method thereof |
CN108219737A (en) * | 2017-12-05 | 2018-06-29 | 昆山天洋热熔胶有限公司 | A kind of preparation method of copolyamide hot melt adhesive |
-
2019
- 2019-01-03 CN CN201910004060.3A patent/CN109852329A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57105479A (en) * | 1980-12-23 | 1982-06-30 | Daicel Chem Ind Ltd | Hot-melt adhesive |
CN102220105A (en) * | 2011-04-29 | 2011-10-19 | 烟台德邦电子材料有限公司 | Dimer acid type polyamide hot melt adhesive and preparation method thereof |
CN103087449A (en) * | 2013-01-16 | 2013-05-08 | 南昌航空大学 | Preparation method of polymer nanometer composite material with high heat conduction, high dielectric and low loss |
CN103589386A (en) * | 2013-10-29 | 2014-02-19 | 烟台德邦科技有限公司 | Biodegradable polyamide hot-melt adhesive and preparation method thereof |
CN103555263A (en) * | 2013-10-30 | 2014-02-05 | 安庆市虹泰新材料有限责任公司 | Method for preparing dimer acid type copolymerized polyamide hot melt adhesive |
CN108219737A (en) * | 2017-12-05 | 2018-06-29 | 昆山天洋热熔胶有限公司 | A kind of preparation method of copolyamide hot melt adhesive |
Non-Patent Citations (4)
Title |
---|
丁郁文: "聚酰胺类热熔胶", 《河北化工》 * |
山东大学压电铁电物理教研室: "《压电陶瓷及其应用》", 30 November 1974, 山东人民出版社 * |
王晓敏等: "《工程材料学》", 31 July 2017, 哈尔滨工业大学出版社 * |
胡耀斌等: "《机械工程测试技术》", 31 October 2015, 北京理工大学大学出版社 * |
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