CN107383786A - The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof - Google Patents
The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof Download PDFInfo
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- CN107383786A CN107383786A CN201710745433.3A CN201710745433A CN107383786A CN 107383786 A CN107383786 A CN 107383786A CN 201710745433 A CN201710745433 A CN 201710745433A CN 107383786 A CN107383786 A CN 107383786A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention discloses a kind of resistor high temperature of resistance to subzero temperature encapsulating material and application thereof, the encapsulating material is made up of the raw material composition of following parts by weight：10 15 parts of epoxy resin, 25 parts of curing agent, 19 parts of toughener, 2 10 parts of accelerator, 5 12 parts of organic siliconresin, 25 parts, No. 08 17 parts of resin of titanium dioxide, 60 80 parts of silicon powder, 35 parts of pigment；After all raw materials are measured according to formula, pour into the container of ball mill, crushed, stirred by the porcelain ball in container, stir 35 hours, be well mixed, blowing is packed, and finished product is dry powder.The present invention has following excellent properties：300 DEG C ~ 400 DEG C of high temperature resistant, it is non-discolouring, be not carbonized；Resistance to 55 DEG C of subzero temperature, is not cracked, moistureproof, fire-retardant and good insulation preformance, high pressure resistant 3000 volts, and ac resistance presses more than 2000 volts, ageing-resistant, good toughness, can for a long time, back and forth use, and cost is low, environmental protection production, is easy to store and transport.
Description
Technical field
The present invention relates to electronic elements package field of material technology, is encapsulated more particularly, to resistor with the high temperature of resistance to subzero temperature
Material and application thereof.
Background technology
Encapsulating material is the vest of the electronic components such as resistor, and its reliability and stability to electronic component all rises
Very important effect；And resistor is a current limiting element, its mainly in the form of sheets, it is cylindric.Existing encapsulating material exist with
Lower deficiency：
（1）Resistance to elevated temperatures is poor, and easy to change, carbonization during more than 200 DEG C of high temperature, the encapsulated layer for making to be formed on resistor loses protection
Effect；Resistance to negative-temperature performance is poor, is easily cracked under conditions of less than -40 DEG C, so as to lose moistureproof and pressure-resistant performance；Proof voltage energy
Difference, ac resistance pressure energy power are up to 1630 volts；Insulating properties are poor, and insulaion resistance is 500 megaohms.
（2）Using the open mode of production, there is a large amount of dust to pollute environment, do not meet the requirement of environmental protection production；Production effect
Rate is low, and output capacity is low, and production cost is high.
（3）Encapsulating material finished product relies primarily on import, it is necessary to a large amount of foreign exchanges, improves the production cost of electronic component.
The content of the invention
The technical problems to be solved by the invention, which are to provide, a kind of can overcome above-mentioned insufficient resistor high with resistance to subzero temperature
Warm encapsulating material and application thereof, 300 DEG C ~ 400 DEG C of its high temperature resistant are non-discolouring, be not carbonized；Resistance to -55 DEG C of subzero temperature, is not cracked, moistureproof, resistance
Combustion and good insulation preformance, high pressure resistant 3000 volts, the ability of ac resistance pressure reaches more than 2000 volts, ageing-resistant, good toughness, can grow
Phase, reciprocal use, cost is low, environmental protection production.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：
The resistor high temperature of resistance to subzero temperature encapsulating material, is made up of the raw material composition of following parts by weight：Epoxy resin 10-15 parts, solidification
Agent 2-5 parts, toughener 1-9 parts, accelerator 2-10 parts, organic siliconresin 5-12 parts, titanium dioxide 2-5 parts, No. 08 resin 1-7 part,
Silicon powder 60-80 parts, pigment 3-5 parts；After according to above-mentioned formula, all raw materials are measured, directly pour into the container of ball mill,
Crushed, stirred by the porcelain ball in container, after 3-5 hours are stirred, is well mixed, blowing is packed, and finished product is dry powder
End.
Preferably, the encapsulating material is made up of the raw material composition of following parts by weight：10 parts of epoxy resin, 2 parts of curing agent, toughness reinforcing
2 parts of agent, 2 parts of accelerator, 5 parts of organic siliconresin, 3 parts, No. 08 1 part of resin of titanium dioxide, 80 parts of silicon powder, 3 parts of pigment.
Preferably, the encapsulating material is made up of the raw material composition of following parts by weight：15 parts of epoxy resin, 5 parts of curing agent, toughness reinforcing
7 parts of agent, 7 parts of accelerator, 10 parts of organic siliconresin, 4 parts, No. 08 6 parts of resin of titanium dioxide, 60 parts of silicon powder, 4.5 parts of pigment.
Preferably, the encapsulating material is made up of the raw material composition of following parts by weight：13 parts of epoxy resin, 3 parts of curing agent, toughness reinforcing
5 parts of agent, 4 parts of accelerator, 7 parts of organic siliconresin, 3.5 parts, No. 08 4 parts of resin of titanium dioxide, 70 parts of silicon powder, 4 parts of pigment.
The curing agent is divided into two kinds of solid kind and liquid type, and wherein liquid type curing agent includes 650 epoxy resin cures
Agent, 505 resin enhancers；Solid kind curing agent includes powdered dicyandiamide, imidazoles；Respectively in liquid type curing agent, solid
Choose any one kind of them in class curing agent, then mixed with hard resin, and require to be matched according to user, form curing agent.
The hard resin is that the one or several kinds in solid epoxy, No. 08 resin, organic siliconresin are mixed
Close adjustment reaction and formed.
The resistor high temperature of resistance to subzero temperature encapsulating material, it is wire-wound resistor in -55 DEG C ~ 400 DEG C levels, oxidation film resistance, high-power
Wire-wound resistor, thermistor, the encapsulation applications in piezo-resistance.
A kind of resistor encapsulates feed liquid with the high temperature of resistance to subzero temperature, its be by resistor with the high temperature of resistance to subzero temperature encapsulating material and solvent by
100：30 weight is formed than being mixed；The ratio of the solvent is acetone：Toluene=2：1.
Resistor encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, and the application method is dip-coating, and resistor is being encapsulated
Dip-coating, natural air drying are carried out in feed liquid；Subsequently into curing oven, encapsulated layer is finally formed on a resistor.
Resistor encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, and the application method is spraying, will using spraying equipment
Encapsulating material liquid phase is to spraying on resistor, and then air dry cure, finally forms encapsulated layer on a resistor.
Resistor encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, and the application method is roller coating, by cylindrical resistor
Rotated a circle in hopper is encapsulated, then air dry cure, finally forms encapsulated layer on a resistor.
Compared with the prior art the present invention, has the advantages that：
The present invention is applied to resistor such as wire-wound resistor, oxidation film resistance, high-power wire-wound resistor, thermistor, pressure-sensitive
Encapsulating material on resistance etc., finished product are dry powder, and it disclosure satisfy that every technical requirements of resistor.Encapsulating material of the present invention it is each
Technical performance index has met and exceeded national sector standard, disclosure satisfy that the different needs of various users, can for a long time, it is past
Multiple to use, every electricity function index keeps stable.Because the present invention has reached the quality standard of import encapsulating material, thus can be with
Import substitutes, a large amount of foreign exchanges are saved, and then reduce the production cost of electronic component.
Encapsulating material of the present invention has resistance to subzero temperature, high temperature resistant, high pressure resistant, toughness, fire-retardant, moistureproof and insulating properties, Yi Jicheng
The advantages that this low, environmentally friendly production, its good insulation preformance, excellent electrical property can be kept；Extremely strong adhesive force, intensity is high, is not easy
Cracking；Excellent working characteristics, it is easily operated；Color is extremely stable, non-discolouring；After continuous use, remain to keep stable shape
State；Powdered finished product has excellent shelf-stable, is easy to transport.
The present invention can reach the following performance indications：Resistance to -55 DEG C of subzero temperature, 300 DEG C ~ 400 DEG C of high temperature resistant；Highest insulate
Resistance can reach 1500 megaohms, and proof voltage is up to 3000 volts, and the ability of ac resistance pressure reaches more than 2000 volts, considerably beyond friendship
Flow the national sector standard of 1500 volts of voltage.Especially heat-resisting ability of the invention brings up to 400 DEG C by original 200 DEG C,
It is and non-discolouring, be not carbonized at a high temperature of 200 DEG C ~ 400 DEG C；Resistance to subzero temperature ability brings up to -55 DEG C by original -40 DEG C, bag
Sealing is not cracked under the conditions of -40 DEG C ~ -55 DEG C of subzero temperature, keeps electric property stable.
Simple production process of the present invention, easily operated, equipment investment is few, and production efficiency is high, and production cost is low, output capacity
Height, remarkable in economical benefits.Workshop uses the closed mode of production, and ball mill is provided with dust cover, thus can be by blowing when
Caused a small amount of dust carries out Seal treatment, and will not leak pollution environment, reach the requirement of environmental protection production.
Embodiment
The present invention is described in further detail with reference to three specific embodiments：
Embodiment 1
The resistor high temperature of resistance to subzero temperature encapsulating material, is made up of the raw material composition of following parts by weight：10 parts of epoxy resin, curing agent 2
Part, 2 parts of toughener, 2 parts of accelerator, 5 parts of organic siliconresin, 3 parts, No. 08 1 part of resin of titanium dioxide, 80 parts of silicon powder, pigment 3
Part.
After all raw materials are measured according to above-mentioned formula, directly pour into the container of ball mill, entered by the porcelain ball in container
Row crushes, stirring, after 3-5 hours are stirred, is well mixed, blowing is packed；Finished product is dry powder.
Embodiment 2
The resistor high temperature of resistance to subzero temperature encapsulating material, is made up of the raw material composition of following parts by weight：15 parts of epoxy resin, curing agent 5
Part, 7 parts of toughener, 7 parts of accelerator, 10 parts of organic siliconresin, 4 parts, No. 08 6 parts of resin of titanium dioxide, 60 parts of silicon powder, pigment
4.5 part.
After all raw materials are measured according to above-mentioned formula, directly pour into the container of ball mill, entered by the porcelain ball in container
Row crushes, stirring, after 3-5 hours are stirred, is well mixed, blowing is packed；Finished product is dry powder.
Embodiment 3
The resistor high temperature of resistance to subzero temperature encapsulating material, is made up of the raw material composition of following parts by weight：13 parts of epoxy resin, curing agent 3
Part, 5 parts of toughener, 4 parts of accelerator, 7 parts of organic siliconresin, 3.5 parts, No. 08 4 parts of resin of titanium dioxide, 70 parts of silicon powder, pigment 4
Part.
After all raw materials are measured according to above-mentioned formula, directly pour into the container of ball mill, entered by the porcelain ball in container
Row crushes, stirring, after 3-5 hours are stirred, is well mixed, blowing is packed；Finished product is dry powder.
Curing agent is divided into two kinds of solid kind and liquid type, wherein liquid type curing agent include 650 epoxy curing agents,
505 resin enhancers；Solid kind curing agent includes powdered dicyandiamide, imidazoles.It is solid in liquid type curing agent, solid kind respectively
Choose any one kind of them in agent, then mixed with hard resin, and require that carrying out proportioning forms curing agent according to user.
Hard resin is that the one or several kinds in solid epoxy, No. 08 resin, organic siliconresin etc. are mixed
What adjustment was reacted and formed.
The resistor high temperature of resistance to subzero temperature encapsulating material, it is wire-wound resistor in -55 DEG C ~ 400 DEG C levels, oxidation film resistance, high-power
Encapsulation applications on the resistors such as wire-wound resistor, thermistor, piezo-resistance.- 55 DEG C ~ 400 DEG C levels are that resistor can be normal
The environment temperature used.
Resistor prepared by the present invention is dry powder with the high temperature of resistance to subzero temperature encapsulating material, and color choosing is carried out by user's requirement
Select, its finished product is in chrome green color., it is necessary to which resistor is made encapsulates feed liquid with the high temperature of resistance to subzero temperature when specifically used.The resistor is with resistance to
Subzero temperature high temperature encapsulating feed liquid is by 100 by resistor encapsulating material and solvent：30 weight is formed than being mixed；This is molten
The ratio of agent is acetone：Toluene=2：1, the ratio of above-mentioned solvent is weight ratio.
The application method that resistor of the present invention encapsulates feed liquid with the high temperature of resistance to subzero temperature mainly has following three kinds：
（1）Dip-coating：Resistor is subjected to dip-coating, natural air drying in feed liquid is encapsulated；Subsequently into curing oven, finally in resistance
Encapsulated layer is formed on device.The resistor includes wire-wound resistor, oxidation film resistance, high-power wire-wound resistor, thermistor, pressure-sensitive electricity
Resistance etc..
（2）Spraying：Using spraying equipment by encapsulating material liquid phase to spraying on resistor, then air dry cure, finally exists
Encapsulated layer is formed on resistor.
（3）Roller coating：It is mainly used in cylindrical resistor, cylindrical resistor is rotated a circle in hopper is encapsulated, then
Air dry cure, encapsulated layer is finally formed on a resistor.
From data in table 1, the property indices of three embodiments for example insulation voltage, insulaion resistance, dielectric constant,
Dielectric loss, linear expansion coefficient, shore hardness meet and exceed national sector standard, can meet that the quality of various users will
Ask, completely can be with import substitutes.
Required according to user, need to do degradation after resistor encapsulating, complete durability test.Degradation is as follows：Even
Continue after charging 52 days, the encapsulated layer on resistor is still non-discolouring, does not ftracture, and it is qualified to show；Even resistor was subjected to
High transient voltage, but its encapsulated layer stands intact；This is considerably beyond the national sector standard requirement of 42 days.
Various raw material compositions in inventive formulation are existing product, and its effect is as follows：
Epoxy resin：As binding agent, adhesive effect is mainly played, it can improve high pressure resistant, high temperature resistant, protection against the tide and insulating properties
Can, mechanical strength is improved, increases adhesive force.
Curing agent：It is to promote curing agent rapid curing that it, which is acted on,.
Toughener：Increase resin toughness；It can be used under alternating hot and cold intense environment, make the anti-cracking performance of resin material
Significantly improve.
Accelerator：The curing efficiency of curing agent is played a driving role, solidification temperature is effectively reduced, shortens hardening time.
Organic siliconresin：It is ageing-resistant, enhancing high temperature resistant, protection against the tide and insulating properties that it, which is acted on, makes product surface bright beautiful
See.
Titanium dioxide：Play toning, keep color vivid.
No. 08 resin：Increase bond properties and ageing-resistant performance, resistor is firmly combined with encapsulating material, it is strong to increase machinery
Degree.
Silicon powder：As filler, it is to improve mechanical strength that it, which is acted on, enhancing thermal diffusivity, ageing resistance, improves impact resistance
Property.
Pigment：For colouring, selection color is actually needed according to user.
Claims (11)
1. the resistor high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, the encapsulating material is made up of the raw material composition of following parts by weight：Ring
Oxygen tree fat 10-15 parts, curing agent 2-5 parts, toughener 1-9 parts, accelerator 2-10 parts, organic siliconresin 5-12 parts, titanium dioxide 2-5
Part, No. 08 resin 1-7 part, silicon powder 60-80 parts, pigment 3-5 parts；After according to above-mentioned formula, all raw materials are measured, directly fall
In the container for entering ball mill, crushed, stirred by the porcelain ball in container, after 3-5 hours are stirred, be well mixed, blowing enters
Row packaging, finished product is dry powder.
2. the resistor according to claim 1 high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, the encapsulating material is by following weight
The raw material composition composition of part：10 parts of epoxy resin, 2 parts of curing agent, 2 parts of toughener, 2 parts of accelerator, 5 parts of organic siliconresin, titanium
3 parts, No. 08 1 part of resin of white powder, 80 parts of silicon powder, 3 parts of pigment.
3. the resistor according to claim 1 high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, the encapsulating material is by following weight
The raw material composition composition of part：15 parts of epoxy resin, 5 parts of curing agent, 7 parts of toughener, 7 parts of accelerator, 10 parts of organic siliconresin,
4 parts, No. 08 6 parts of resin of titanium dioxide, 60 parts of silicon powder, 4.5 parts of pigment.
4. the resistor according to claim 1 high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, the encapsulating material is by following weight
The raw material composition composition of part：13 parts of epoxy resin, 3 parts of curing agent, 5 parts of toughener, 4 parts of accelerator, 7 parts of organic siliconresin, titanium
3.5 parts, No. 08 4 parts of resin of white powder, 70 parts of silicon powder, 4 parts of pigment.
5. the resistor according to any one of claim 1 to 4 high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, it is described solid
Agent is divided into two kinds of solid kind and liquid type, and wherein liquid type curing agent includes 650 epoxy curing agents, 505 resin tooths
Agent；Solid kind curing agent includes powdered dicyandiamide, imidazoles；Respectively in liquid type curing agent, solid kind curing agent optionally
One kind, then mixed with hard resin, and require that carrying out proportioning forms curing agent according to user.
6. the resistor according to claim 5 high temperature of resistance to subzero temperature encapsulating material, it is characterized in that, the hard resin is solid
One or several kinds in epoxy resin, No. 08 resin, organic siliconresin carry out Mixed adjustment reactions and formed.
7. the resistor high temperature of the resistance to subzero temperature encapsulating material described in claim 6, wire-wound resistor, oxidation in -55 DEG C ~ 400 DEG C levels
Film resistance, high-power wire-wound resistor, thermistor, the encapsulation applications in piezo-resistance.
8. a kind of resistor encapsulates feed liquid with the high temperature of resistance to subzero temperature, it is characterized in that, it is with resistance to as the resistor described in claim 6
Subzero temperature high temperature encapsulating material, 100 are pressed with solvent：30 weight is formed than being mixed；The ratio of the solvent is acetone：
Toluene=2：1.
9. the resistor described in claim 8 encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, it is characterized in that, the application method
For dip-coating, resistor is subjected to dip-coating in feed liquid is encapsulated, natural air drying, subsequently into curing oven, on a resistor finally
Form encapsulated layer.
10. the resistor described in claim 8 encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, it is characterized in that, the user
Method is spraying, using spraying equipment by encapsulating material liquid phase to spraying on resistor, then air dry cure, on a resistor finally
Form encapsulated layer.
11. the resistor described in claim 8 encapsulates the application method of feed liquid with the high temperature of resistance to subzero temperature, it is characterized in that, the user
Method is roller coating, cylindrical resistor is rotated a circle in hopper is encapsulated, then air dry cure, finally forms bag on a resistor
Sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710745433.3A CN107383786A (en) | 2017-08-26 | 2017-08-26 | The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710745433.3A CN107383786A (en) | 2017-08-26 | 2017-08-26 | The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof |
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| Publication Number | Publication Date |
|---|---|
| CN107383786A true CN107383786A (en) | 2017-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710745433.3A Pending CN107383786A (en) | 2017-08-26 | 2017-08-26 | The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108342147A (en) * | 2018-02-26 | 2018-07-31 | 上海闰龙电子材料有限公司 | A kind of formula and preparation method thereof of thermistor isolation protective material |
| CN112724781A (en) * | 2020-12-28 | 2021-04-30 | 湖州南浔百迪电子商务有限公司 | High-temperature-resistant insulating electronic component powder coating |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337003A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Epoxy resin encapsulating material modified by organosilicon, its preparation method and its application |
| CN104559661A (en) * | 2014-12-29 | 2015-04-29 | 贝迪斯电子有限公司 | Coating used for metal film resistor encapsulating layer and preparation method thereof |
-
2017
- 2017-08-26 CN CN201710745433.3A patent/CN107383786A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337003A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Epoxy resin encapsulating material modified by organosilicon, its preparation method and its application |
| CN104559661A (en) * | 2014-12-29 | 2015-04-29 | 贝迪斯电子有限公司 | Coating used for metal film resistor encapsulating layer and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 卢少忠: "《建筑涂料工程：性能.生产.施工》", 31 August 2007, 中国建材工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108342147A (en) * | 2018-02-26 | 2018-07-31 | 上海闰龙电子材料有限公司 | A kind of formula and preparation method thereof of thermistor isolation protective material |
| CN112724781A (en) * | 2020-12-28 | 2021-04-30 | 湖州南浔百迪电子商务有限公司 | High-temperature-resistant insulating electronic component powder coating |
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Application publication date: 20171124 |