JPS56945B2 - - Google Patents
Info
- Publication number
- JPS56945B2 JPS56945B2 JP2613475A JP2613475A JPS56945B2 JP S56945 B2 JPS56945 B2 JP S56945B2 JP 2613475 A JP2613475 A JP 2613475A JP 2613475 A JP2613475 A JP 2613475A JP S56945 B2 JPS56945 B2 JP S56945B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/60—
-
- H10W70/05—
-
- H10W70/611—
-
- H10W70/69—
-
- H10W70/698—
-
- H10W90/724—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US461078A US3918148A (en) | 1974-04-15 | 1974-04-15 | Integrated circuit chip carrier and method for forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50137484A JPS50137484A (enExample) | 1975-10-31 |
| JPS56945B2 true JPS56945B2 (enExample) | 1981-01-10 |
Family
ID=23831131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2613475A Expired JPS56945B2 (enExample) | 1974-04-15 | 1975-03-05 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3918148A (enExample) |
| JP (1) | JPS56945B2 (enExample) |
| CA (1) | CA1026469A (enExample) |
| DE (1) | DE2510757C2 (enExample) |
| FR (1) | FR2267639B1 (enExample) |
| GB (1) | GB1457866A (enExample) |
| IT (1) | IT1033222B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4045594A (en) * | 1975-12-31 | 1977-08-30 | Ibm Corporation | Planar insulation of conductive patterns by chemical vapor deposition and sputtering |
| US4129904A (en) * | 1977-11-14 | 1978-12-19 | Pansini Andrew L | Swimming pool cleaner |
| DE2755480A1 (de) * | 1977-12-13 | 1979-06-21 | Siemens Ag | Verfahren zur herstellung einer integrierten halbleiterschaltung |
| JPS5571091A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Multilayer circuit board |
| JPS60134440A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | 半導体集積回路装置 |
| EP0154431B1 (en) * | 1984-02-17 | 1989-08-16 | AT&T Corp. | Integrated circuit chip assembly |
| US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
| GB2253308B (en) * | 1986-09-26 | 1993-01-20 | Gen Electric Co Plc | Semiconductor circuit arrangements |
| US5041943A (en) * | 1989-11-06 | 1991-08-20 | Allied-Signal Inc. | Hermetically sealed printed circuit board |
| FR2666173A1 (fr) * | 1990-08-21 | 1992-02-28 | Thomson Csf | Structure hybride d'interconnexion de circuits integres et procede de fabrication. |
| US5455202A (en) * | 1993-01-19 | 1995-10-03 | Hughes Aircraft Company | Method of making a microelectric device using an alternate substrate |
| US6143396A (en) * | 1997-05-01 | 2000-11-07 | Texas Instruments Incorporated | System and method for reinforcing a bond pad |
| US6085413A (en) * | 1998-02-02 | 2000-07-11 | Ford Motor Company | Multilayer electrical interconnection device and method of making same |
| US6531945B1 (en) * | 2000-03-10 | 2003-03-11 | Micron Technology, Inc. | Integrated circuit inductor with a magnetic core |
| US7214566B1 (en) | 2000-06-16 | 2007-05-08 | Micron Technology, Inc. | Semiconductor device package and method |
| JP5173160B2 (ja) * | 2006-07-14 | 2013-03-27 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE631489A (enExample) * | 1962-04-27 | |||
| US3264402A (en) * | 1962-09-24 | 1966-08-02 | North American Aviation Inc | Multilayer printed-wiring boards |
| US3424629A (en) * | 1965-12-13 | 1969-01-28 | Ibm | High capacity epitaxial apparatus and method |
| US3741880A (en) * | 1969-10-25 | 1973-06-26 | Nippon Electric Co | Method of forming electrical connections in a semiconductor integrated circuit |
| US3726002A (en) * | 1971-08-27 | 1973-04-10 | Ibm | Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate |
| US3813773A (en) * | 1972-09-05 | 1974-06-04 | Bunker Ramo | Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure |
-
1974
- 1974-04-15 US US461078A patent/US3918148A/en not_active Expired - Lifetime
-
1975
- 1975-02-27 IT IT20691/75A patent/IT1033222B/it active
- 1975-03-05 JP JP2613475A patent/JPS56945B2/ja not_active Expired
- 1975-03-06 FR FR7507771A patent/FR2267639B1/fr not_active Expired
- 1975-03-12 DE DE2510757A patent/DE2510757C2/de not_active Expired
- 1975-03-21 CA CA223,173A patent/CA1026469A/en not_active Expired
- 1975-04-02 GB GB1354575A patent/GB1457866A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2510757C2 (de) | 1983-08-25 |
| GB1457866A (en) | 1976-12-08 |
| FR2267639A1 (enExample) | 1975-11-07 |
| US3918148A (en) | 1975-11-11 |
| IT1033222B (it) | 1979-07-10 |
| CA1026469A (en) | 1978-02-14 |
| JPS50137484A (enExample) | 1975-10-31 |
| FR2267639B1 (enExample) | 1977-04-15 |
| DE2510757A1 (de) | 1975-10-23 |