FR2267639B1 - - Google Patents

Info

Publication number
FR2267639B1
FR2267639B1 FR7507771A FR7507771A FR2267639B1 FR 2267639 B1 FR2267639 B1 FR 2267639B1 FR 7507771 A FR7507771 A FR 7507771A FR 7507771 A FR7507771 A FR 7507771A FR 2267639 B1 FR2267639 B1 FR 2267639B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7507771A
Other languages
French (fr)
Other versions
FR2267639A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2267639A1 publication Critical patent/FR2267639A1/fr
Application granted granted Critical
Publication of FR2267639B1 publication Critical patent/FR2267639B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W70/60—
    • H10W70/05—
    • H10W70/611—
    • H10W70/69—
    • H10W70/698—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
FR7507771A 1974-04-15 1975-03-06 Expired FR2267639B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US461078A US3918148A (en) 1974-04-15 1974-04-15 Integrated circuit chip carrier and method for forming the same

Publications (2)

Publication Number Publication Date
FR2267639A1 FR2267639A1 (enExample) 1975-11-07
FR2267639B1 true FR2267639B1 (enExample) 1977-04-15

Family

ID=23831131

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7507771A Expired FR2267639B1 (enExample) 1974-04-15 1975-03-06

Country Status (7)

Country Link
US (1) US3918148A (enExample)
JP (1) JPS56945B2 (enExample)
CA (1) CA1026469A (enExample)
DE (1) DE2510757C2 (enExample)
FR (1) FR2267639B1 (enExample)
GB (1) GB1457866A (enExample)
IT (1) IT1033222B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045594A (en) * 1975-12-31 1977-08-30 Ibm Corporation Planar insulation of conductive patterns by chemical vapor deposition and sputtering
US4129904A (en) * 1977-11-14 1978-12-19 Pansini Andrew L Swimming pool cleaner
DE2755480A1 (de) * 1977-12-13 1979-06-21 Siemens Ag Verfahren zur herstellung einer integrierten halbleiterschaltung
JPS5571091A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Multilayer circuit board
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
EP0154431B1 (en) * 1984-02-17 1989-08-16 AT&T Corp. Integrated circuit chip assembly
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
GB2253308B (en) * 1986-09-26 1993-01-20 Gen Electric Co Plc Semiconductor circuit arrangements
US5041943A (en) * 1989-11-06 1991-08-20 Allied-Signal Inc. Hermetically sealed printed circuit board
FR2666173A1 (fr) * 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
US5455202A (en) * 1993-01-19 1995-10-03 Hughes Aircraft Company Method of making a microelectric device using an alternate substrate
US6143396A (en) * 1997-05-01 2000-11-07 Texas Instruments Incorporated System and method for reinforcing a bond pad
US6085413A (en) * 1998-02-02 2000-07-11 Ford Motor Company Multilayer electrical interconnection device and method of making same
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
US7214566B1 (en) 2000-06-16 2007-05-08 Micron Technology, Inc. Semiconductor device package and method
JP5173160B2 (ja) * 2006-07-14 2013-03-27 新光電気工業株式会社 多層配線基板及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631489A (enExample) * 1962-04-27
US3264402A (en) * 1962-09-24 1966-08-02 North American Aviation Inc Multilayer printed-wiring boards
US3424629A (en) * 1965-12-13 1969-01-28 Ibm High capacity epitaxial apparatus and method
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US3813773A (en) * 1972-09-05 1974-06-04 Bunker Ramo Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure

Also Published As

Publication number Publication date
DE2510757C2 (de) 1983-08-25
GB1457866A (en) 1976-12-08
FR2267639A1 (enExample) 1975-11-07
US3918148A (en) 1975-11-11
IT1033222B (it) 1979-07-10
JPS56945B2 (enExample) 1981-01-10
CA1026469A (en) 1978-02-14
JPS50137484A (enExample) 1975-10-31
DE2510757A1 (de) 1975-10-23

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Legal Events

Date Code Title Description
ST Notification of lapse