JPS5693766A - Coating resin composition - Google Patents

Coating resin composition

Info

Publication number
JPS5693766A
JPS5693766A JP17100579A JP17100579A JPS5693766A JP S5693766 A JPS5693766 A JP S5693766A JP 17100579 A JP17100579 A JP 17100579A JP 17100579 A JP17100579 A JP 17100579A JP S5693766 A JPS5693766 A JP S5693766A
Authority
JP
Japan
Prior art keywords
compound
methyl
formula
titanol
ethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17100579A
Other languages
English (en)
Other versions
JPS6346576B2 (ja
Inventor
Shiro Takeda
Minoru Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17100579A priority Critical patent/JPS5693766A/ja
Priority to US06/161,561 priority patent/US4349609A/en
Priority to EP80302103A priority patent/EP0021818B1/en
Priority to DE8080302103T priority patent/DE3065150D1/de
Publication of JPS5693766A publication Critical patent/JPS5693766A/ja
Publication of JPS6346576B2 publication Critical patent/JPS6346576B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP17100579A 1979-06-21 1979-12-28 Coating resin composition Granted JPS5693766A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP17100579A JPS5693766A (en) 1979-12-28 1979-12-28 Coating resin composition
US06/161,561 US4349609A (en) 1979-06-21 1980-06-20 Electronic device having multilayer wiring structure
EP80302103A EP0021818B1 (en) 1979-06-21 1980-06-23 Improved electronic device having multilayer wiring structure
DE8080302103T DE3065150D1 (en) 1979-06-21 1980-06-23 Improved electronic device having multilayer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17100579A JPS5693766A (en) 1979-12-28 1979-12-28 Coating resin composition

Publications (2)

Publication Number Publication Date
JPS5693766A true JPS5693766A (en) 1981-07-29
JPS6346576B2 JPS6346576B2 (ja) 1988-09-16

Family

ID=15915331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17100579A Granted JPS5693766A (en) 1979-06-21 1979-12-28 Coating resin composition

Country Status (1)

Country Link
JP (1) JPS5693766A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109565A (ja) * 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
JPS60199056A (ja) * 1984-03-23 1985-10-08 Dainippon Ink & Chem Inc 高耐熱性樹脂組成物
JPS6125141A (ja) * 1984-07-16 1986-02-04 Tokyo Denshi Kagaku Kabushiki パターン形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826822A (ja) * 1971-08-11 1973-04-09
JPS4878325A (ja) * 1972-01-28 1973-10-20
JPS4881928A (ja) * 1972-02-05 1973-11-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826822A (ja) * 1971-08-11 1973-04-09
JPS4878325A (ja) * 1972-01-28 1973-10-20
JPS4881928A (ja) * 1972-02-05 1973-11-01

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109565A (ja) * 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
JPS60199056A (ja) * 1984-03-23 1985-10-08 Dainippon Ink & Chem Inc 高耐熱性樹脂組成物
JPH0460143B2 (ja) * 1984-03-23 1992-09-25 Dainippon Inki Kagaku Kogyo Kk
JPS6125141A (ja) * 1984-07-16 1986-02-04 Tokyo Denshi Kagaku Kabushiki パターン形成方法

Also Published As

Publication number Publication date
JPS6346576B2 (ja) 1988-09-16

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