JPS5692407A - Radiation thickness measuring device - Google Patents

Radiation thickness measuring device

Info

Publication number
JPS5692407A
JPS5692407A JP16815979A JP16815979A JPS5692407A JP S5692407 A JPS5692407 A JP S5692407A JP 16815979 A JP16815979 A JP 16815979A JP 16815979 A JP16815979 A JP 16815979A JP S5692407 A JPS5692407 A JP S5692407A
Authority
JP
Japan
Prior art keywords
detector
plate thickness
processing circuit
operation processing
outputs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16815979A
Other languages
Japanese (ja)
Inventor
Tatsuo Tsujii
Takaaki Okino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16815979A priority Critical patent/JPS5692407A/en
Publication of JPS5692407A publication Critical patent/JPS5692407A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

PURPOSE: To perform high-precision measurement, by inserting a wedge reference piece into the reference radiation beam from one direction and by storing outputs for the thickness at prescribed points successively to generate a measuring line and by comparing this line and the object to be measured with each other to perform measurement.
CONSTITUTION: Measuring beam 1a and reference beam 1b are detected by radiation detector 2a and radiation detector 2b respectively. When correction signal (a) is applied to operation processing circuit 4, operation processing circuit 4 operates servo mechanism 7 so that the thickness of wedge reference piece 6 becomes the zero position. After the output of detector 2b is stored, a prescribed plate thickness part of wedge reference piece 6 is inserted into the reference radiation beam. The output of detector 2b at this time is stored in operation processing circuit 4. Outputs of detector 2b for the prescribed plate thickness are stored successively to obtain a detection line. In measurement of the plate thickness of the object to be measured, the plate thickness is set to plate thickness setting equipment 5, and the deviation of outputs of detector 2a and 2b is obtained.
COPYRIGHT: (C)1981,JPO&Japio
JP16815979A 1979-12-26 1979-12-26 Radiation thickness measuring device Pending JPS5692407A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16815979A JPS5692407A (en) 1979-12-26 1979-12-26 Radiation thickness measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16815979A JPS5692407A (en) 1979-12-26 1979-12-26 Radiation thickness measuring device

Publications (1)

Publication Number Publication Date
JPS5692407A true JPS5692407A (en) 1981-07-27

Family

ID=15862898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16815979A Pending JPS5692407A (en) 1979-12-26 1979-12-26 Radiation thickness measuring device

Country Status (1)

Country Link
JP (1) JPS5692407A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499664A (en) * 1978-01-24 1979-08-06 Toshiba Corp Plate thickness measuring apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499664A (en) * 1978-01-24 1979-08-06 Toshiba Corp Plate thickness measuring apparatus

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