JPS5691427A - Device for processing semiconductor substrate - Google Patents

Device for processing semiconductor substrate

Info

Publication number
JPS5691427A
JPS5691427A JP17011779A JP17011779A JPS5691427A JP S5691427 A JPS5691427 A JP S5691427A JP 17011779 A JP17011779 A JP 17011779A JP 17011779 A JP17011779 A JP 17011779A JP S5691427 A JPS5691427 A JP S5691427A
Authority
JP
Japan
Prior art keywords
containers
conveying
substrates
conveying means
moving means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17011779A
Other languages
Japanese (ja)
Inventor
Masatoshi Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17011779A priority Critical patent/JPS5691427A/en
Publication of JPS5691427A publication Critical patent/JPS5691427A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To reduce the frequency of changing a substrate container by providing the first conveying menas and moving means on one side of conveying mechanisms having processing means to process semiconductor substrates and providing the second conveying means and moving means on the other side. CONSTITUTION:Plural first containers 1a are provided on the first conveying means 12a and semiconductor substrates 2 are transferred to the second containers 1b at the same time by the first moving means 21a. Next, a substrate supplying stage 4 is lowered by a feed screw 11a and substrates are conveyed one by one to the second conveying means consisting of a conveyer belt 8, and processing such as resist coating, etc., is applied to the substrates. On the opposite side of the second conveying means, a substrate receiving means with the third containers and the second moving means which transfers substrates at the same time to the fourth containers provided on the third conveying means are provided symmetrically to the above- mentioned construction. By so doing, the frequency of changing the containers is reduced and processing efficiency is improved.
JP17011779A 1979-12-25 1979-12-25 Device for processing semiconductor substrate Pending JPS5691427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17011779A JPS5691427A (en) 1979-12-25 1979-12-25 Device for processing semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17011779A JPS5691427A (en) 1979-12-25 1979-12-25 Device for processing semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5691427A true JPS5691427A (en) 1981-07-24

Family

ID=15898948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17011779A Pending JPS5691427A (en) 1979-12-25 1979-12-25 Device for processing semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5691427A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120654U (en) * 1982-02-10 1983-08-17 日本電気ホームエレクトロニクス株式会社 Wafer transfer device
FR2531938A1 (en) * 1982-08-20 1984-02-24 Crismatec Pusher-lifter for thin wafers stored in rows in a collective container.
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
CN104779190A (en) * 2014-01-15 2015-07-15 北大方正集团有限公司 High-efficiency transporting mechanism and wafer transporting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336478A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Automatic lead-out device for wafer from cartridge

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336478A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Automatic lead-out device for wafer from cartridge

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120654U (en) * 1982-02-10 1983-08-17 日本電気ホームエレクトロニクス株式会社 Wafer transfer device
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
FR2531938A1 (en) * 1982-08-20 1984-02-24 Crismatec Pusher-lifter for thin wafers stored in rows in a collective container.
CN104779190A (en) * 2014-01-15 2015-07-15 北大方正集团有限公司 High-efficiency transporting mechanism and wafer transporting device

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