CN104779190A - High-efficiency transporting mechanism and wafer transporting device - Google Patents

High-efficiency transporting mechanism and wafer transporting device Download PDF

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Publication number
CN104779190A
CN104779190A CN201410017891.1A CN201410017891A CN104779190A CN 104779190 A CN104779190 A CN 104779190A CN 201410017891 A CN201410017891 A CN 201410017891A CN 104779190 A CN104779190 A CN 104779190A
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CN
China
Prior art keywords
connecting gear
deflecting roller
inner fovea
wafer
fovea part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410017891.1A
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Chinese (zh)
Inventor
郑玉宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peking University Founder Group Co Ltd
Shenzhen Founder Microelectronics Co Ltd
Original Assignee
Peking University Founder Group Co Ltd
Shenzhen Founder Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peking University Founder Group Co Ltd, Shenzhen Founder Microelectronics Co Ltd filed Critical Peking University Founder Group Co Ltd
Priority to CN201410017891.1A priority Critical patent/CN104779190A/en
Publication of CN104779190A publication Critical patent/CN104779190A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

Abstract

The present invention discloses a high-efficiency transporting mechanism and a wafer transporting device, and relates to the technical field of semiconductors. Through adding a steering wheel, the first part of a conveyor belt is provided with a concave part; when the transporting mechanism works, a cross beam of an H-shaped surface of a wafer case can be placed in the concave part, and the area of the contact region between the first part of the conveyor belt and wafers is enlarged, so that the efficiency and safety of taking and transporting the wafers are improved, and the rate of broken wafers is lowered.

Description

A kind of connecting gear of high transmission efficiency and wafer pass sheet equipment
Technical field
The present invention relates to technical field of semiconductors, particularly a kind of connecting gear of high transmission efficiency and wafer pass sheet equipment.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer; Various circuit component structure can be manufactured on silicon, and become the IC product having certain electric sexual function.Wafer fabrication is melting many crystal silicons, planting into seed crystal in melting in liquid again, then it slowly being pulled out, to form columned monocrystalline silicon crystal bar, because silicon crystal bar is that the seed crystal determined by a high preferred orientation generates gradually in the silicon raw material of molten state, this process is called " long brilliant ".Silicon crystal bar, again after segment, barreling, section, chamfering, polishing, laser incising, packaging, namely becomes the base stock of IC works---and silicon wafer, Here it is " wafer ".
In the manufacturing process of wafer, need repeatedly to transmit, so it is then abnormal important to pass sheet equipment, passing sheet equipment is mainly divided into crawler belt to follow two kinds, manipulator to pass sheet mode, crawler belt pass sheet due to its pass sheet simple, maintenance is easily widely used, with the chip detection (CP in semiconductor production, Chip Prober) test citing, CP test is the link of a yield test in semiconductor rear section operation, also be that a wafer is at Foundry (FAB, Foundry) last procedure of carrying out of factory face, the biography sheet efficiency improving this procedure is extremely important with reducing fragment rate for a FAB factory, before carrying out CP test, need wafer from wafer casket box (i.e. Cassette, with reference to Fig. 1, take up a kind of special container of wafer, be widely used in each FAB factory of the whole world, it is divided into " H face " and " U face ", inside is provided with some draw-in grooves 103 placed for wafer, require that wafer frontside is towards U face 101, the back side is towards H face, object is in order to avoid dust stains, more convenient fastness of getting sheet and wafer casket box, wherein, crossbeam 102 is had in the middle of H face, similar H, therefore cry in " H face ", the similar U in U face, therefore cry in " U face ") middle taking-up.
The connecting gear of conventional CP tester table, as shown in Figure 2, described connecting gear 104 comprises conveyer belt 105 and 2 delivery wheels 106, described conveyer belt 105 is set around on described 2 delivery wheels, described conveyer belt comprises: the Part I 105-1 being located at top, be located at Part II 105-2 and the side direction part (not shown) of below, described side direction part is for connecting Part I 105-1 and Part II 105-2, described Part I 105-1 is used for contacting with wafer 108, described delivery wheel is fixed on the first bracing frame 107, with reference to Fig. 3, " 1. " in figure is wafer and conveyer belt contact area, in order to dodge the crossbeam in H face in wafer casket box, cause the conveyer belt length contacting wafer long no more than brilliant radius of a circle, this design defect causes being easy to cause wafer to get sheet failure, the generation of fragment can be caused time serious, even sometimes because wafer tilt causes the conveyer belt contacting wafer to only have a single-point, this can have a strong impact on efficiency and fail safe that wafer is sent out wafer casket box.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is: how to improve biography sheet efficiency and fail safe that wafer gets sheet, and reduce fragment rate.
(2) technical scheme
For solving the problems of the technologies described above, the invention provides a kind of connecting gear, described connecting gear comprises: conveyer belt and 2 delivery wheels, described conveyer belt is set around on described 2 delivery wheels, described conveyer belt comprises Part I, Part II and the side direction part for being connected Part I and Part II, described Part I is used for and waits that transmitting thing contacts, described connecting gear also comprises: n deflecting roller, a described n deflecting roller comprises: 2 the first deflecting rollers, x the second deflecting roller and n-2-x the 3rd deflecting roller, described Part I is provided with inner fovea part, described 2 the first deflecting rollers are located at the two ends lower surface of described inner fovea part respectively, described x the second deflecting roller is located at the upper base surface of described inner fovea part, described n-2-x the 3rd deflecting roller is positioned at the below of described second deflecting roller, and be located at the upper surface of described Part II, described n be not less than 4 integer, described x be not less than 1 integer, n-x >=3.
Wherein, described conveyer belt is crawler belt, and described delivery wheel and deflecting roller are gear, and the engaging tooth on described gear and described crawler belt adapts.
Wherein, at least one gear in described delivery wheel or deflecting roller is travelling gear.
Wherein, when described second deflecting roller is 1, described inner fovea part is " V " shape.
Wherein, when described second deflecting roller is 2, described inner fovea part is " U " shape.
The invention also discloses a kind of wafer and pass sheet equipment, described equipment comprises: wafer casket box and the connecting gear described at least 2, described at least 2 connecting gears are set in parallel, on described wafer casket box, the crossbeam in H face is arranged in the inner fovea part of described connecting gear, and described wafer casket box can reciprocate along the indent direction of inner fovea part on described connecting gear.
Wherein, when on described connecting gear, the second deflecting roller is 1, T>=T 0, described T is two lateral extents of described inner fovea part is W 0the distance of plane residing for residing plane to described inner fovea part two ends, described W 0for the width of described crossbeam, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box.
Wherein, when on described connecting gear, the second deflecting roller is 2, W>=W 0and T>=T 0, described W is the distance at described inner fovea part two ends, described W 0for the width of described crossbeam, described T is the degree of depth of described inner fovea part, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box.
Wherein, described equipment also comprises: the first bracing frame, described first bracing frame be used for fixing described at least 2 connecting gears.
Wherein, described equipment also comprises: position transducer and the second bracing frame for fixing described position transducer, described position transducer is arranged along the indent direction of inner fovea part on described connecting gear, and described position transducer is towards described wafer casket box.
(3) beneficial effect
The present invention is by increasing deflecting roller, the Part I of conveyer belt is made to be provided with inner fovea part, when connecting gear works, on described wafer casket box, the crossbeam in H face can be placed in described inner fovea part, add the contact area area between the Part I of conveyer belt and wafer, thus improve biography sheet efficiency and the fail safe that wafer gets sheet, and reduce fragment rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of wafer casket box;
Fig. 2 is the structural representation of existing connecting gear;
Fig. 3 is the vertical view of the transfer structure shown in Fig. 2;
Fig. 4 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 1st kind of embodiment;
Fig. 5 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 2nd kind of embodiment;
Fig. 6 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 3rd kind of embodiment;
Fig. 7 be the present invention the 1st or 2 kinds of embodiments connecting gear on the structural representation of inner fovea part;
Fig. 8 is the structural representation of the wafer transfer equipment adopting the connecting gear shown in Fig. 5;
Fig. 9 is the vertical view of the equipment shown in Fig. 8;
Figure 10 is the structural representation of the wafer transfer equipment adopting the connecting gear shown in Fig. 6.
Wherein, 101: the U face of wafer casket box; 102: the H face crossbeam of wafer casket box; 103: the draw-in groove placed for wafer; 104: existing connecting gear; 105: conveyer belt; 105-1: the Part I of conveyer belt; 105-2: the Part II of conveyer belt; 106: delivery wheel; 107: the first bracing frames; 108: wafer; 109: position transducer; 110: the second bracing frames; 1: the Part I of conveyer belt; 2: the Part II of conveyer belt; 3: delivery wheel; 4: inner fovea part; 5: the first deflecting rollers; 6: the second deflecting rollers; 7: the three deflecting rollers; 8: the first bracing frames; 9: position transducer; 10: the second bracing frames; 11: wafer.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
The invention discloses a kind of connecting gear of high transmission efficiency, with reference to Fig. 4 ~ 6, described connecting gear comprises: conveyer belt and 2 delivery wheels 3, described conveyer belt is set around on described 2 delivery wheels, described conveyer belt comprises Part I 1, Part II 2 and the side direction part for being connected Part I 1 and Part II 2, described Part I 1 for wait that transmitting thing contacts, described connecting gear also comprises: n deflecting roller, a described n deflecting roller comprises: 2 the first deflecting rollers 5, x the second deflecting roller 6 and n-2-x the 3rd deflecting roller 7, described Part I 1 is provided with inner fovea part 4, described 2 the first deflecting rollers 5 are located at the two ends lower surface of described inner fovea part 4 respectively, described x the second deflecting roller 6 is located at the upper base surface of described inner fovea part 4, described n-2-x the 3rd deflecting roller 7 is positioned at the below of described second deflecting roller 6, and be located at the upper surface of described Part II 2, described n be not less than 4 integer, described x be not less than 1 integer, n-x >=3.
Preferably, described conveyer belt is crawler belt, and described delivery wheel and deflecting roller are gear; engaging tooth on described gear and described crawler belt adapts; but do not limit protection scope of the present invention, described conveyer belt can also be belt, and correspondingly described delivery wheel and deflecting roller are running roller.
For guaranteeing to realize transmission, preferably, at least one gear in described delivery wheel or deflecting roller is travelling gear.
Embodiment 1
Fig. 4 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 1st kind of embodiment; With reference to Fig. 1, in the present embodiment, described x is 1 and n is 4, and now, described inner fovea part 4 is " V " shape.
Embodiment 2
Fig. 5 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 2nd kind of embodiment; With reference to Fig. 2, in the present embodiment, described x is 1 and n is 5, and now, described inner fovea part 4 is also " V " shape.
Embodiment 3
Fig. 6 is the structural representation of the connecting gear of the high transmission efficiency of the present invention's the 3rd kind of embodiment; With reference to Fig. 3, in the present embodiment, described x is 2 and n is 6, and now, described inner fovea part 4 is " U " shape.
Connecting gear of the present invention is not limited to the structure of above-described embodiment 1 ~ 3; on its basis; increase delivery wheel or deflecting roller, or the position of delivery wheel or deflecting roller is adjusted slightly, but do not affect scheme of the invention process and all drop in protection scope of the present invention.
The invention also discloses a kind of wafer and pass sheet equipment, described equipment comprises: wafer casket box and the connecting gear described at least 2, described at least 2 connecting gears are set in parallel, on described wafer casket box, the crossbeam in H face is arranged in the inner fovea part of described connecting gear, and described wafer casket box can reciprocate along the indent direction of inner fovea part on described connecting gear.
Embodiment 4
With connecting gear be below the structure of embodiment 2 for example is to illustrate the present invention, but do not limit protection scope of the present invention.Fig. 8 is the structural representation of the wafer transfer equipment adopting the connecting gear shown in Fig. 5; Fig. 9 is the vertical view of the equipment shown in Fig. 8; Due to when transmitting wafer, needing to allow between wafer casket box and connecting gear and carrying out relative movement, in order to ensure that the wafer in wafer casket box in all draw-in grooves all can be transmitted smoothly, preferably, with reference to Fig. 7, when on described connecting gear, the second deflecting roller 6 is 1, T>=T 0, described T is two lateral extents of described inner fovea part 4 is W 0the distance of plane residing for residing plane to described inner fovea part 4 two ends, described W 0for the width of described crossbeam, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box (not shown).
With reference to Fig. 8 ~ 9, the operation principle of the equipment of the present embodiment for: the wafer being arranged in extreme lower position loaded in described wafer casket box is contacted with described conveyer belt Part I (" 1. " and " 2. " that contact area is Fig. 9), the crossbeam of described wafer fuse-box is placed among described inner fovea part 4, the transmission of wafer is realized by conveyer belt, clearly can find out from Fig. 9, in the present embodiment the Part I 1 of conveyer belt and the contact area of wafer 11 than the Part I 105-1 of conveyer belt in Fig. 3 and the contact area of wafer 108 larger, and from physical principle, frictional force is directly proportional to contact area size, the scheme of the present embodiment significantly improves the frictional force between conveyer belt and wafer, improve biography sheet efficiency and fail safe that wafer gets sheet, and reduce fragment rate.
Embodiment 5
Because brilliant diameter of a circle and beam width are certain value; and inner fovea part can make described inner fovea part two ends apart from excessive for " V " shape; thus the contact area of described conveyer belt Part I and wafer is diminished; in order to increase contact area further; with connecting gear be below the structure of embodiment 3 for example is to illustrate the present invention, but do not limit protection scope of the present invention.
Due to when transmitting wafer, needing to allow between wafer casket box and connecting gear and carrying out relative movement, in order to ensure that the wafer in wafer casket box in all draw-in grooves all can be transmitted smoothly, preferably, with reference to Figure 10, when on described connecting gear, the second deflecting roller 6 is 2, W>=W 0and T>=T 0, described W is the distance at described inner fovea part 4 two ends, described W 0for the width of described crossbeam, described T is the degree of depth of described inner fovea part 4, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box.
The vertical view of the present embodiment is substantially identical with Fig. 9, and the operation principle of the equipment of the present embodiment is substantially identical with the operation principle of embodiment 4, so repeat no more.
For ease of fixing described connecting gear, on the basis of embodiment 4 or 5, preferably, described equipment also comprises: the first bracing frame 8, and described first bracing frame 8 is at least 2 connecting gears described in fixing.
For ease of controlling the direction of motion of described wafer fuse-box, on the basis of embodiment 4 or 5, preferably, described equipment also comprises: position transducer 9 and the second bracing frame 10 for fixing described position transducer 9, described position transducer 9 is arranged along the indent direction of inner fovea part 4 on described connecting gear, and described position transducer 9 is towards described wafer casket box.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (10)

1. the connecting gear of a high transmission efficiency, it is characterized in that, described connecting gear comprises: conveyer belt and 2 delivery wheels, described conveyer belt is set around on described 2 delivery wheels, described conveyer belt comprises Part I, Part II and the side direction part for being connected Part I and Part II, described Part I is used for and waits that transmitting thing contacts, described connecting gear also comprises: n deflecting roller, a described n deflecting roller comprises: 2 the first deflecting rollers, x the second deflecting roller and n-2-x the 3rd deflecting roller, described Part I is provided with inner fovea part, described 2 the first deflecting rollers are located at the two ends lower surface of described inner fovea part respectively, described x the second deflecting roller is located at the upper base surface of described inner fovea part, described n-2-x the 3rd deflecting roller is positioned at the below of described second deflecting roller, and be located at the upper surface of described Part II, described n be not less than 4 integer, described x be not less than 1 integer, n-x >=3.
2. connecting gear as claimed in claim 1, it is characterized in that, described conveyer belt is crawler belt, and described delivery wheel and deflecting roller are gear, and the engaging tooth on described gear and described crawler belt adapts.
3. connecting gear as claimed in claim 2, is characterized in that, at least one gear in described delivery wheel or deflecting roller is travelling gear.
4. connecting gear as claimed in claim 1, it is characterized in that, when described second deflecting roller is 1, described inner fovea part is " V " shape.
5. connecting gear as claimed in claim 1, it is characterized in that, when described second deflecting roller is 2, described inner fovea part is " U " shape.
6. a wafer passes sheet equipment, it is characterized in that, described equipment comprises: wafer casket box and the connecting gear according to any one of at least 2 Claims 1 to 5, described at least 2 connecting gears are set in parallel, on described wafer casket box, the crossbeam in H face is arranged in the inner fovea part of described connecting gear, and described wafer casket box can reciprocate along the indent direction of inner fovea part on described connecting gear.
7. equipment as claimed in claim 6, is characterized in that, when on described connecting gear, the second deflecting roller is 1, and T>=T 0, described T is two lateral extents of described inner fovea part is W 0the distance of plane residing for residing plane to described inner fovea part two ends, described W 0for the width of described crossbeam, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box.
8. equipment as claimed in claim 6, is characterized in that, when on described connecting gear, the second deflecting roller is 2, and W>=W 0and T>=T 0, described W is the distance at described inner fovea part two ends, described W 0for the width of described crossbeam, described T is the degree of depth of described inner fovea part, described T 0for described crossbeam to the first draw-in groove lower surface between distance, described first draw-in groove is first draw-in groove along direction from top to bottom on described wafer casket box.
9. the equipment according to any one of claim 6 ~ 8, is characterized in that, described equipment also comprises: the first bracing frame, described first bracing frame be used for fixing described at least 2 connecting gears.
10. the equipment according to any one of claim 6 ~ 8, it is characterized in that, described equipment also comprises: position transducer and the second bracing frame for fixing described position transducer, described position transducer is arranged along the indent direction of inner fovea part on described connecting gear, and described position transducer is towards described wafer casket box.
CN201410017891.1A 2014-01-15 2014-01-15 High-efficiency transporting mechanism and wafer transporting device Pending CN104779190A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111474831A (en) * 2020-04-20 2020-07-31 深圳市华星光电半导体显示技术有限公司 Heating device and substrate heating method
WO2022193338A1 (en) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 Wafer transfer system

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Publication number Priority date Publication date Assignee Title
JPS5691427A (en) * 1979-12-25 1981-07-24 Mitsubishi Electric Corp Device for processing semiconductor substrate
US4643629A (en) * 1984-10-30 1987-02-17 Anelva Corporation Automatic loader
CN1611429A (en) * 2003-10-28 2005-05-04 显示器生产服务株式会社 System and method for conveying flat panel display
CN102420160A (en) * 2010-09-28 2012-04-18 韩美半导体株式会社 Wafer supply system
CN102431815A (en) * 2010-09-13 2012-05-02 睿纳有限责任公司 Apparatus and method for the separating and transporting of substrates
CN102807092A (en) * 2011-06-01 2012-12-05 北京北方微电子基地设备工艺研究中心有限责任公司 Solar cell conveying mechanism and solar cell conveying system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691427A (en) * 1979-12-25 1981-07-24 Mitsubishi Electric Corp Device for processing semiconductor substrate
US4643629A (en) * 1984-10-30 1987-02-17 Anelva Corporation Automatic loader
CN1611429A (en) * 2003-10-28 2005-05-04 显示器生产服务株式会社 System and method for conveying flat panel display
CN102431815A (en) * 2010-09-13 2012-05-02 睿纳有限责任公司 Apparatus and method for the separating and transporting of substrates
CN102420160A (en) * 2010-09-28 2012-04-18 韩美半导体株式会社 Wafer supply system
CN102807092A (en) * 2011-06-01 2012-12-05 北京北方微电子基地设备工艺研究中心有限责任公司 Solar cell conveying mechanism and solar cell conveying system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111474831A (en) * 2020-04-20 2020-07-31 深圳市华星光电半导体显示技术有限公司 Heating device and substrate heating method
WO2022193338A1 (en) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 Wafer transfer system

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Application publication date: 20150715