JPS5687336A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS5687336A
JPS5687336A JP16526179A JP16526179A JPS5687336A JP S5687336 A JPS5687336 A JP S5687336A JP 16526179 A JP16526179 A JP 16526179A JP 16526179 A JP16526179 A JP 16526179A JP S5687336 A JPS5687336 A JP S5687336A
Authority
JP
Japan
Prior art keywords
sample
bonding
vacuum
vacuum pressure
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16526179A
Other languages
Japanese (ja)
Inventor
Kiyoshi Chokai
Yuichi Hasegawa
Sakio Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Fujitsu Ltd
Original Assignee
Shinkawa Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Fujitsu Ltd filed Critical Shinkawa Ltd
Priority to JP16526179A priority Critical patent/JPS5687336A/en
Publication of JPS5687336A publication Critical patent/JPS5687336A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a sample from being unstabilized in fixation by sticking of foreign matters to the sample or deformation thereof by detecting a vacuum pressure produced at the absorption of the sample by means of a vacuum switch. CONSTITUTION:The sample 1 is separated from a carrier 2 on raising a sample fixing stand 8 and at the same time, the vacuum pressure of a vacuum supply source 10 starts an increase to make the sample be fixed on the fixing stand 8. The vacuum switch 12 detects the vacuum pressure in this state and moves a bonding tool 6 to a bonding position unless an abnormality is found. On the contrary, if the vacuum switch 12 detects the vacuum pressure being lowered or an abnormal condition, an abnormal signal from the switch causes a wire bonding control circuit 13 to be operated to give an order signal to the bonding tool to stop the work. Whereby the bonding is discontinued to be carried out leaving the sample unstabilized, and a defective bonding is excluded.
JP16526179A 1979-12-18 1979-12-18 Wire bonding method Pending JPS5687336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16526179A JPS5687336A (en) 1979-12-18 1979-12-18 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16526179A JPS5687336A (en) 1979-12-18 1979-12-18 Wire bonding method

Publications (1)

Publication Number Publication Date
JPS5687336A true JPS5687336A (en) 1981-07-15

Family

ID=15808958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16526179A Pending JPS5687336A (en) 1979-12-18 1979-12-18 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS5687336A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683654A (en) * 1982-04-13 1987-08-04 U.S. Philips Corporation Method of and device for sensing the presence or absence of an article at the end of a vacuum pick-up means

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4683654A (en) * 1982-04-13 1987-08-04 U.S. Philips Corporation Method of and device for sensing the presence or absence of an article at the end of a vacuum pick-up means

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