JPS5686714A - Curing method of molded article - Google Patents
Curing method of molded articleInfo
- Publication number
- JPS5686714A JPS5686714A JP16270079A JP16270079A JPS5686714A JP S5686714 A JPS5686714 A JP S5686714A JP 16270079 A JP16270079 A JP 16270079A JP 16270079 A JP16270079 A JP 16270079A JP S5686714 A JPS5686714 A JP S5686714A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- curing
- molded article
- transition point
- glass transition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To reduce a thermosetting time of a thermoplastic resin molded article by a method wherein an initial heating is performed for the thermoplastic resin molded article under a lower temperature than a transision point of glass and the final heating is performed under an approximately equal temperature to the transition point of glass.
CONSTITUTION: When an article molded from a thermoplastic resin compound is heated to be cured, the molded article is heated under a temperature lower than the glass transition point after the setting of the molded article, and then, the temperature is gradually raised and at a stage of a setting completion, it is heated under a temperature approximately equal to the glass transition point after a setting. A glass transition point of the molded article wherein a curing is not finished, rises, in general, as the curing advances, and at a stage when a curing is completed, it reaches a constant high glass transition point. And further, the speed of a curing reaction generally increases as a temperature increases, however, when a curing temperature exceeds sharply a glass transition point at that stage, a stress relaxation speed becomes small and an apparent curing speed becomes small, reversely. Owing to the aforementioned reason, a heating as aforementioned is performed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16270079A JPS5686714A (en) | 1979-12-17 | 1979-12-17 | Curing method of molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16270079A JPS5686714A (en) | 1979-12-17 | 1979-12-17 | Curing method of molded article |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5686714A true JPS5686714A (en) | 1981-07-14 |
Family
ID=15759633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16270079A Pending JPS5686714A (en) | 1979-12-17 | 1979-12-17 | Curing method of molded article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5686714A (en) |
-
1979
- 1979-12-17 JP JP16270079A patent/JPS5686714A/en active Pending
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