JPS5674948A - Lead structure of semiconductor device - Google Patents
Lead structure of semiconductor deviceInfo
- Publication number
- JPS5674948A JPS5674948A JP15065479A JP15065479A JPS5674948A JP S5674948 A JPS5674948 A JP S5674948A JP 15065479 A JP15065479 A JP 15065479A JP 15065479 A JP15065479 A JP 15065479A JP S5674948 A JPS5674948 A JP S5674948A
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- tempo
- speed
- bonding operation
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/421—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/932—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15065479A JPS5674948A (en) | 1979-11-22 | 1979-11-22 | Lead structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15065479A JPS5674948A (en) | 1979-11-22 | 1979-11-22 | Lead structure of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5674948A true JPS5674948A (en) | 1981-06-20 |
| JPS6230498B2 JPS6230498B2 (enExample) | 1987-07-02 |
Family
ID=15501562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15065479A Granted JPS5674948A (en) | 1979-11-22 | 1979-11-22 | Lead structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5674948A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
| CN104641466A (zh) * | 2012-11-19 | 2015-05-20 | 富士电机株式会社 | 半导体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411095U (enExample) * | 1987-07-10 | 1989-01-20 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50674U (enExample) * | 1973-05-01 | 1975-01-07 | ||
| JPS5278372A (en) * | 1975-12-25 | 1977-07-01 | Nec Corp | Method of blanking of lead frame for electronic parts |
| JPS53119862U (enExample) * | 1977-02-28 | 1978-09-22 | ||
| JPS5494157U (enExample) * | 1977-12-16 | 1979-07-03 |
-
1979
- 1979-11-22 JP JP15065479A patent/JPS5674948A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50674U (enExample) * | 1973-05-01 | 1975-01-07 | ||
| JPS5278372A (en) * | 1975-12-25 | 1977-07-01 | Nec Corp | Method of blanking of lead frame for electronic parts |
| JPS53119862U (enExample) * | 1977-02-28 | 1978-09-22 | ||
| JPS5494157U (enExample) * | 1977-12-16 | 1979-07-03 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
| CN104641466A (zh) * | 2012-11-19 | 2015-05-20 | 富士电机株式会社 | 半导体装置 |
| US9728475B2 (en) | 2012-11-19 | 2017-08-08 | Fuji Electric Co., Ltd. | Lead portion of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230498B2 (enExample) | 1987-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE27931T1 (de) | Wellenloeten von intergrierten schaltungen. | |
| EP0473796A4 (en) | Semiconductor device having a plurality of chips | |
| MY123034A (en) | Semiconductor device and method of fabricating the same | |
| FR2720190B1 (fr) | Procédé de raccordement des plages de sortie d'une puce à circuit intégré, et module multipuces ainsi obtenu. | |
| JPS57199228A (en) | Wire bonding pad device | |
| JPS5674948A (en) | Lead structure of semiconductor device | |
| JPS6481330A (en) | Film carrier semiconductor device | |
| DE3574527D1 (de) | Halbleiterbauelement mit zuverlaessiger bondfleckenstruktur. | |
| JPS5389368A (en) | Production of semiconductor integrated circuit | |
| JPS5651851A (en) | Semiconductor device | |
| JPS57102063A (en) | Lead-tape | |
| JPS6412565A (en) | Semiconductor integrated circuit | |
| EP0305993A3 (en) | Power semiconductor device having electrode structures | |
| KR910003797A (ko) | 반도체장치 | |
| JPS533165A (en) | Wire bonding apparatus | |
| JPS5326667A (en) | Clamp chip of wire bonder | |
| JPS55143045A (en) | Semiconductor device | |
| JPS57109674A (en) | Thermal head | |
| JPS5412263A (en) | Semiconductor element and production of the same | |
| IE831529L (en) | Leadless chip carrier semiconductor integrated circuit¹device | |
| JPS5790954A (en) | Gold wire for bonding | |
| JPS5283173A (en) | Circuit packaging substrate | |
| JPS522282A (en) | Semiconductor device | |
| JPS56142659A (en) | Semiconductor device | |
| JPS55148449A (en) | Semiconductor device |