JPS5674946A - Microwave circuit substrate - Google Patents
Microwave circuit substrateInfo
- Publication number
- JPS5674946A JPS5674946A JP15152379A JP15152379A JPS5674946A JP S5674946 A JPS5674946 A JP S5674946A JP 15152379 A JP15152379 A JP 15152379A JP 15152379 A JP15152379 A JP 15152379A JP S5674946 A JPS5674946 A JP S5674946A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- microwave circuit
- volume
- circuit substrate
- factor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waveguides (AREA)
Abstract
PURPOSE:To eliminate a floating volume and realize satisfactory impedance matching over a wide band by changing the dielectric factor of microwave circuit substrate. CONSTITUTION:A microwave circuit substrate 7 has conductive films 8, 8' on the front/back surface and routes 3, 4 connected by ribbons 15, 15'. The both sides of the substrate have dielectric factors epsilon1, epsilon2 respectively and the other parts have an intermediate value between epsilon1 and epsilon2. A volume CT per unit area SO is worked out by height a and height b of the substrate and a distance X from the end of the substrate 1. Route impedance ZO represents a prearranged relationship between an overall dielectric factor epsilonT and a propagation factor of electric wave inside the substrate 7. If a conductive film 8 is formed using this relationship, the route of the substrate 7 shows a condition where the floating volume does not exist, so that it is possible to connect the conductive films 3 and 4 with the floating volume being set at ''0''. For this reason, a satisfactory impedance matching can be obtained over a wide range and a smooth signal propagation realized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15152379A JPS5674946A (en) | 1979-11-22 | 1979-11-22 | Microwave circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15152379A JPS5674946A (en) | 1979-11-22 | 1979-11-22 | Microwave circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5674946A true JPS5674946A (en) | 1981-06-20 |
Family
ID=15520369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15152379A Pending JPS5674946A (en) | 1979-11-22 | 1979-11-22 | Microwave circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5674946A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60134483A (en) * | 1983-12-22 | 1985-07-17 | Nec Corp | Semiconductor device |
US5173666A (en) * | 1992-03-27 | 1992-12-22 | The United States Of America As Represented By The Secretary Of The Army | Microstrip-to-inverted-microstrip transition |
FR2900501A1 (en) * | 2006-04-26 | 2007-11-02 | Commissariat Energie Atomique | HYPERFREQUENCY OPERATING SILICON INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME |
-
1979
- 1979-11-22 JP JP15152379A patent/JPS5674946A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60134483A (en) * | 1983-12-22 | 1985-07-17 | Nec Corp | Semiconductor device |
JPH0116029B2 (en) * | 1983-12-22 | 1989-03-22 | Nippon Electric Co | |
US5173666A (en) * | 1992-03-27 | 1992-12-22 | The United States Of America As Represented By The Secretary Of The Army | Microstrip-to-inverted-microstrip transition |
FR2900501A1 (en) * | 2006-04-26 | 2007-11-02 | Commissariat Energie Atomique | HYPERFREQUENCY OPERATING SILICON INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME |
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