JPS566445A - Bonding head - Google Patents

Bonding head

Info

Publication number
JPS566445A
JPS566445A JP8233379A JP8233379A JPS566445A JP S566445 A JPS566445 A JP S566445A JP 8233379 A JP8233379 A JP 8233379A JP 8233379 A JP8233379 A JP 8233379A JP S566445 A JPS566445 A JP S566445A
Authority
JP
Japan
Prior art keywords
bonding
support blocks
metal frame
semiconductor elements
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8233379A
Other languages
Japanese (ja)
Inventor
Takaharu Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8233379A priority Critical patent/JPS566445A/en
Publication of JPS566445A publication Critical patent/JPS566445A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To accomplish higher speed of the bonding work by sucking and conveying plural semiconductor elements simultaneously for pressure welding to the bonding from the tray which houses the semiconductor chips at a pitch space the same as that of the metal frame. CONSTITUTION:A bearing block 17 is mounted at the tip of the bonding arm 15. The support blocks 19 of -shaped vertically movable are successively arranged at the same space with the bonding pad of the metal frame. The support blocks are arranged to be elastically pressed with the pressure adjusting screw and a spring (not illustrated). The pipe 24 and the adsorption spindle 25 are connected to the communication hole (not illustrated) through which the support blocks run and the heating block 26 incorporating the heater and the thermocouples is fastened on the spindles 25. This enables simultaneous bonding of plural parts such as semiconductor elements thereby making the bonding work highly efficient.
JP8233379A 1979-06-26 1979-06-26 Bonding head Pending JPS566445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8233379A JPS566445A (en) 1979-06-26 1979-06-26 Bonding head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8233379A JPS566445A (en) 1979-06-26 1979-06-26 Bonding head

Publications (1)

Publication Number Publication Date
JPS566445A true JPS566445A (en) 1981-01-23

Family

ID=13771625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8233379A Pending JPS566445A (en) 1979-06-26 1979-06-26 Bonding head

Country Status (1)

Country Link
JP (1) JPS566445A (en)

Similar Documents

Publication Publication Date Title
ES8502900A1 (en) Flexible manufacturing device for work pieces.
JPS566445A (en) Bonding head
IT8424068A0 (en) APPARATUS FOR ORIENTING A TOOL SUPPORT DEVICE, IN PARTICULAR AN ANGLE MILLING HEAD, TO THE FREE (LOWER) END OF A MILLING SPINDLE SLIDE.
JPS531376A (en) Device for detachably attaching tool to working machine
EP0267969A1 (en) Wire cut electric discharge machine having electrically conductive work support bed
ES8405660A1 (en) Indexing table for holding a workpiece during processing.
JPS5748408A (en) Chuck for fitting tool to machine tool
JPS5337974A (en) Scroll compensating chuck including center
JPS5527002A (en) Jig apparatus for adhesive work
JPS57149135A (en) Automatic chip discharge device for machine tool
JPS5737842A (en) Device for gang bonding
JPH0693472B2 (en) Wire bonding equipment
JPS5514545A (en) Shaping unit for magnetic head
ES2014376A6 (en) Centreless circular grinding machine.
JPS5264097A (en) Wire cut electrical discharge machining apparatus
JPS5330871A (en) Production of semiconductor device
JPS57128936A (en) Semiconductor pellet mounter
JPS55162238A (en) Semiconductor pellet fitting device
GB981609A (en) Improvements in or relating to workpiece feed mechanisms
JPS5710941A (en) Supplying method for semiconductor element
JPS56162847A (en) Mounting method for bonding wire
SU823081A1 (en) Apparatus for lapping part spherical surfaces
SU1673390A1 (en) Multiple-station automatic machine
JPS5784143A (en) Controlling mechanism of bonder for z axial motion
FR2340802A1 (en) Grinding machine for test pieces - has workpiece carrier arranged below horizontal parting disc spindle with sub frame mounted electrical drive