JPS565361A - Bonding of glass - Google Patents

Bonding of glass

Info

Publication number
JPS565361A
JPS565361A JP7878279A JP7878279A JPS565361A JP S565361 A JPS565361 A JP S565361A JP 7878279 A JP7878279 A JP 7878279A JP 7878279 A JP7878279 A JP 7878279A JP S565361 A JPS565361 A JP S565361A
Authority
JP
Japan
Prior art keywords
bonded
parts
bonding
glass
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7878279A
Other languages
Japanese (ja)
Inventor
Eizo Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7878279A priority Critical patent/JPS565361A/en
Publication of JPS565361A publication Critical patent/JPS565361A/en
Pending legal-status Critical Current

Links

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PURPOSE: To perform the bonding of glass over a wide range by arranging plural sealing metals in parallel between the bonding portions of parts to be bonded and then heating them by a resistance heating method.
CONSTITUTION: Parts to be bonded, e.g., glass, ceramics, etc., are exactly bonded at their bonding portions, for example, in case where the cylindrical parts 7 and 8 to be bonded, made of semirigid glass material, are bonded, the sealing metal wires 4 and 5 of a glass sealing alloy material, e.g., Kovar alloy, etc., are provided in a semicircular form for matching the bonding portions, where the inside wires 4 and the outside wires 5 are eccentrically arranged at the same level and their common terminals 6 are integrally connected with each other. Then, the sealing metal assembly 1 thus obtained is interposed between the bonding portions of the parts 7 and 8 to be bonded, a current is flowed from the power source 13 through the current controller 11 and the switch 12, and the parts 7 and 8 are pressed by a given pressing force. After the bonding operation, they are gradually cooled and the metal wires 4 and 5 projecting from the bonded portions are cut off.
COPYRIGHT: (C)1981,JPO&Japio
JP7878279A 1979-06-22 1979-06-22 Bonding of glass Pending JPS565361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7878279A JPS565361A (en) 1979-06-22 1979-06-22 Bonding of glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7878279A JPS565361A (en) 1979-06-22 1979-06-22 Bonding of glass

Publications (1)

Publication Number Publication Date
JPS565361A true JPS565361A (en) 1981-01-20

Family

ID=13671451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7878279A Pending JPS565361A (en) 1979-06-22 1979-06-22 Bonding of glass

Country Status (1)

Country Link
JP (1) JPS565361A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130904A (en) * 1981-02-06 1982-08-13 Toyo Terumii Kk Formed preparation with good permanence

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130904A (en) * 1981-02-06 1982-08-13 Toyo Terumii Kk Formed preparation with good permanence
JPS5819641B2 (en) * 1981-02-06 1983-04-19 東洋テルミ−株式会社 Durable drug moldings

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