JPS56500604A - - Google Patents

Info

Publication number
JPS56500604A
JPS56500604A JP50093480A JP50093480A JPS56500604A JP S56500604 A JPS56500604 A JP S56500604A JP 50093480 A JP50093480 A JP 50093480A JP 50093480 A JP50093480 A JP 50093480A JP S56500604 A JPS56500604 A JP S56500604A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50093480A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56500604A publication Critical patent/JPS56500604A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
JP50093480A 1979-06-05 1980-05-08 Pending JPS56500604A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH5195/79A CH647908A5 (de) 1979-06-05 1979-06-05 Verfahren und anordnung zum kontaktieren der leiterbahnen von leiterplatten mit kontaktstiften.

Publications (1)

Publication Number Publication Date
JPS56500604A true JPS56500604A (ja) 1981-05-07

Family

ID=4289522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50093480A Pending JPS56500604A (ja) 1979-06-05 1980-05-08

Country Status (8)

Country Link
US (1) US4431891A (ja)
EP (1) EP0030233B1 (ja)
JP (1) JPS56500604A (ja)
AT (1) AT364405B (ja)
CH (1) CH647908A5 (ja)
DE (1) DE3062703D1 (ja)
IT (1) IT1131203B (ja)
WO (1) WO1980002662A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3419125A1 (de) * 1984-05-23 1985-11-28 Danfoss A/S, Nordborg Verfahren zum anloeten einer metallelektrode an einem elektrisch leitenden siliziumkarbid-keramikelement und nach dem verfahren hergestelltes siliziumkarbid-keramikelement
US4795870A (en) * 1985-06-18 1989-01-03 Metcal, Inc. Conductive member having integrated self-regulating heaters
SE451974B (sv) * 1985-08-22 1987-11-09 Tetra Pak Ab Sett och anordning for induktionsforsegling av termoplastbelagt forpackningsmaterial innefattande atminstone ett skikt av metallfolie
US4685608A (en) * 1985-10-29 1987-08-11 Rca Corporation Soldering apparatus
US4727236A (en) * 1986-05-27 1988-02-23 The United States Of America As Represented By The Department Of Energy Combination induction plasma tube and current concentrator for introducing a sample into a plasma
US4789767A (en) * 1987-06-08 1988-12-06 Metcal, Inc. Autoregulating multi contact induction heater
US5093545A (en) * 1988-09-09 1992-03-03 Metcal, Inc. Method, system and composition for soldering by induction heating
US4987283A (en) * 1988-12-21 1991-01-22 Amp Incorporated Methods of terminating and sealing electrical conductor means
US4983804A (en) * 1989-12-21 1991-01-08 At&T Bell Laboratories Localized soldering by inductive heating
DE4118935A1 (de) * 1991-06-08 1992-12-10 Bosch Gmbh Robert Elektrisches geraet mit wenigstens einem kontaktstift und einer leiterbahnfolie
DE4123987A1 (de) * 1991-07-19 1993-01-21 Allen Bradley Gmbh Verfahren und vorrichtung zum elektrisch-leitenden verbinden von an einer leiterplatte angeordneten leiterbahnen im smt-verfahren (surface mount technologie) mit den anschlussdraehten von an der leiterplatte anordbaren bauteilen
US5816482A (en) * 1996-04-26 1998-10-06 The Whitaker Corporation Method and apparatus for attaching balls to a substrate
US6229124B1 (en) * 1998-10-10 2001-05-08 TRUCCO HORACIO ANDRéS Inductive self-soldering printed circuit board
JP2000260815A (ja) * 1999-03-10 2000-09-22 Mitsubishi Electric Corp バンプの溶融方法および溶融装置、ならびに半導体装置の製造方法
ATE524265T1 (de) * 2008-03-20 2011-09-15 Komax Holding Ag Löteinrichtung zum verbinden von solarzellen
US20100038358A1 (en) * 2008-03-20 2010-02-18 Dingle Brad M Inductive soldering device
US8912472B1 (en) * 2010-07-19 2014-12-16 Barnes Group Inc. Induction heating of springs
US8701966B2 (en) 2012-01-24 2014-04-22 Apple Inc. Induction bonding
EP2838123B1 (de) * 2013-08-14 2016-03-16 Komax Holding AG Löteinrichtung zum Verbinden von Solarzellen
DE102019122213A1 (de) * 2019-08-19 2021-02-25 Heliatek Gmbh Verfahren zur elektrisch leitenden Kontaktierung eines mindestens eine Schutzschicht aufweisenden optoelektronischen Bauelements und optoelektronisches Bauelement mit einer solchen Kontaktierung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525336A (en) * 1943-06-30 1950-10-10 Rca Corp Method for simultaneously induction heating a plurality of elements
US2777041A (en) * 1953-05-21 1957-01-08 Lindberg Eng Co High frequency heat treating apparatus
US3070683A (en) * 1960-01-27 1962-12-25 Joseph J Moro-Lin Cementing of semiconductor device components
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
US3619540A (en) * 1970-08-10 1971-11-09 Park Ohio Industries Inc Heating zone dual inductor
US3659069A (en) * 1970-12-07 1972-04-25 Park Ohio Industries Inc Inductor for heating an elongated workpiece having a varied profile
DE2257003A1 (de) * 1972-11-21 1974-05-22 Bosch Fernsehanlagen Vorrichtung zum kontaktieren von leiterbahnen auf druckplatten mit massivkontaktelementen
DE2739418C2 (de) * 1977-09-01 1985-11-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen einer Kontaktverbindung eines lackisolierten Drahtes mit einem Kontaktteil eines elektrischen Bauteiles durch Weichlöten sowie Vorrichtung zur Ausübung des Verfahrens
DE2916349C2 (de) * 1979-04-23 1983-06-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen einer oder mehrerer Kontaktverbindungen zwischen einem lackisolierten Draht und einem oder mehreren Kontaktteilen eines elektrischen Bauteiles

Also Published As

Publication number Publication date
AT364405B (de) 1981-10-27
IT1131203B (it) 1986-06-18
IT8022434A0 (it) 1980-05-30
CH647908A5 (de) 1985-02-15
WO1980002662A1 (fr) 1980-12-11
ATA452979A (de) 1981-03-15
DE3062703D1 (en) 1983-05-19
EP0030233B1 (de) 1983-04-13
US4431891A (en) 1984-02-14
EP0030233A1 (de) 1981-06-17

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