JPS5647419A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5647419A JPS5647419A JP12387779A JP12387779A JPS5647419A JP S5647419 A JPS5647419 A JP S5647419A JP 12387779 A JP12387779 A JP 12387779A JP 12387779 A JP12387779 A JP 12387779A JP S5647419 A JPS5647419 A JP S5647419A
- Authority
- JP
- Japan
- Prior art keywords
- ratio
- fatty acid
- polyfunctional
- compound
- blending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: The titled composition providing a cured material having improved heat resistance and flexibility, obtained by blending a polyfunctional epoxy with a fatty acid polyglycidyl ester, a fatty acid, and an isocyanate compound.
CONSTITUTION: (A) A polyfunctional epoxy compound (e.g., glycidyl ester of bisphenol A, etc.) is blended with (B) a polyfunctional fatty acid (e.g., Diels-Alder adduct of linoleic acid, etc.), (C) a polyfunctional fatty acid (e.g., compound of the ingredient B before its esterification, etc.), (D) a polyfunctional isocyanate compound (e.g. tolylene diisocyanate, etc.), and preferably (E) a catalyst forming a hetero ring (e.g., trimethylamine, etc.). In blending the ingredients, preferably a ratio of (A+B)/(D+C) is 1/1.5W10 (equivalent ratio), a ratio of A/B is 20/80W 95/5 (weight ratio), a ration of B/C is 95/5W5/95wt%, and a ratio of E/(A+B+ C+D) is 0.01W10wt%.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12387779A JPS5647419A (en) | 1979-09-28 | 1979-09-28 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12387779A JPS5647419A (en) | 1979-09-28 | 1979-09-28 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5647419A true JPS5647419A (en) | 1981-04-30 |
JPS6138727B2 JPS6138727B2 (en) | 1986-08-30 |
Family
ID=14871575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12387779A Granted JPS5647419A (en) | 1979-09-28 | 1979-09-28 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5647419A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160621U (en) * | 1981-04-03 | 1982-10-08 | ||
JPS62171535A (en) * | 1986-01-24 | 1987-07-28 | Chuo Hatsujo Kogyo Kk | Manufacture of spring assembly |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297734U (en) * | 1989-01-19 | 1990-08-03 |
-
1979
- 1979-09-28 JP JP12387779A patent/JPS5647419A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160621U (en) * | 1981-04-03 | 1982-10-08 | ||
JPS6247055Y2 (en) * | 1981-04-03 | 1987-12-24 | ||
JPS62171535A (en) * | 1986-01-24 | 1987-07-28 | Chuo Hatsujo Kogyo Kk | Manufacture of spring assembly |
JPH0328609B2 (en) * | 1986-01-24 | 1991-04-19 | Chuo Hatsujo Kogyo Kk |
Also Published As
Publication number | Publication date |
---|---|
JPS6138727B2 (en) | 1986-08-30 |
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