JPS5645040A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS5645040A
JPS5645040A JP12064579A JP12064579A JPS5645040A JP S5645040 A JPS5645040 A JP S5645040A JP 12064579 A JP12064579 A JP 12064579A JP 12064579 A JP12064579 A JP 12064579A JP S5645040 A JPS5645040 A JP S5645040A
Authority
JP
Japan
Prior art keywords
heat
heating
pellet
lead
heating portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12064579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6248893B2 (enExample
Inventor
Michio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12064579A priority Critical patent/JPS5645040A/ja
Publication of JPS5645040A publication Critical patent/JPS5645040A/ja
Publication of JPS6248893B2 publication Critical patent/JPS6248893B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP12064579A 1979-09-21 1979-09-21 Wire bonding apparatus Granted JPS5645040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12064579A JPS5645040A (en) 1979-09-21 1979-09-21 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12064579A JPS5645040A (en) 1979-09-21 1979-09-21 Wire bonding apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61219581A Division JPS62162339A (ja) 1986-09-19 1986-09-19 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5645040A true JPS5645040A (en) 1981-04-24
JPS6248893B2 JPS6248893B2 (enExample) 1987-10-16

Family

ID=14791343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12064579A Granted JPS5645040A (en) 1979-09-21 1979-09-21 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5645040A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618937A (ja) * 1984-06-25 1986-01-16 Shinkawa Ltd ボンダ−用加熱装置
US4975050A (en) * 1988-07-04 1990-12-04 Kabushiki Kaisha Shinkawa Workpiece heating and feeding device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013554U (enExample) * 1973-06-05 1975-02-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013554U (enExample) * 1973-06-05 1975-02-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618937A (ja) * 1984-06-25 1986-01-16 Shinkawa Ltd ボンダ−用加熱装置
US4975050A (en) * 1988-07-04 1990-12-04 Kabushiki Kaisha Shinkawa Workpiece heating and feeding device

Also Published As

Publication number Publication date
JPS6248893B2 (enExample) 1987-10-16

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