JPS5013554U - - Google Patents
Info
- Publication number
- JPS5013554U JPS5013554U JP1973066398U JP6639873U JPS5013554U JP S5013554 U JPS5013554 U JP S5013554U JP 1973066398 U JP1973066398 U JP 1973066398U JP 6639873 U JP6639873 U JP 6639873U JP S5013554 U JPS5013554 U JP S5013554U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973066398U JPS5013554U (enExample) | 1973-06-05 | 1973-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973066398U JPS5013554U (enExample) | 1973-06-05 | 1973-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5013554U true JPS5013554U (enExample) | 1975-02-13 |
Family
ID=28231537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973066398U Pending JPS5013554U (enExample) | 1973-06-05 | 1973-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5013554U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645040A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Wire bonding apparatus |
| JPS6324830U (enExample) * | 1986-07-31 | 1988-02-18 |
-
1973
- 1973-06-05 JP JP1973066398U patent/JPS5013554U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645040A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Wire bonding apparatus |
| JPS6324830U (enExample) * | 1986-07-31 | 1988-02-18 |