JPS5639555B2 - - Google Patents

Info

Publication number
JPS5639555B2
JPS5639555B2 JP3522276A JP3522276A JPS5639555B2 JP S5639555 B2 JPS5639555 B2 JP S5639555B2 JP 3522276 A JP3522276 A JP 3522276A JP 3522276 A JP3522276 A JP 3522276A JP S5639555 B2 JPS5639555 B2 JP S5639555B2
Authority
JP
Japan
Prior art keywords
laser
stud
back end
light
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3522276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51126783A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS51126783A publication Critical patent/JPS51126783A/ja
Publication of JPS5639555B2 publication Critical patent/JPS5639555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02484—Sapphire or diamond heat spreaders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/02365—Fixing laser chips on mounts by clamping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP51035222A 1975-04-01 1976-04-01 Laser bolt mounting stool and laser device Granted JPS51126783A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB13203/75A GB1487010A (en) 1975-04-01 1975-04-01 Laser stud mounts

Publications (2)

Publication Number Publication Date
JPS51126783A JPS51126783A (en) 1976-11-05
JPS5639555B2 true JPS5639555B2 (US07534539-20090519-C00280.png) 1981-09-14

Family

ID=10018711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51035222A Granted JPS51126783A (en) 1975-04-01 1976-04-01 Laser bolt mounting stool and laser device

Country Status (6)

Country Link
US (1) US4097891A (US07534539-20090519-C00280.png)
JP (1) JPS51126783A (US07534539-20090519-C00280.png)
CH (1) CH593574A5 (US07534539-20090519-C00280.png)
DE (1) DE2612657A1 (US07534539-20090519-C00280.png)
FR (1) FR2306549A1 (US07534539-20090519-C00280.png)
GB (1) GB1487010A (US07534539-20090519-C00280.png)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818793B2 (ja) * 1975-08-22 1983-04-14 富士通株式会社 ヒカリハンドウタイソシノ パツケ−ジ
GB1544241A (en) * 1976-05-11 1979-04-19 Standard Telephones Cables Ltd Injection laser mount
US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
JPS53130993A (en) * 1977-04-20 1978-11-15 Nec Corp Semiconductor laser
DE2827074A1 (de) * 1977-06-21 1979-01-04 Canon Kk Aufzeichnungsgeraet
JPS622782Y2 (US07534539-20090519-C00280.png) * 1977-12-21 1987-01-22
JPS54134585A (en) * 1978-03-31 1979-10-19 Int Standard Electric Corp Injection laser mount
JPS54142988A (en) * 1978-04-28 1979-11-07 Hitachi Ltd Photo semiconductor device
US4347655A (en) * 1978-09-28 1982-09-07 Optical Information Systems, Inc. Mounting arrangement for semiconductor optoelectronic devices
US4240098A (en) * 1978-09-28 1980-12-16 Exxon Research & Engineering Co. Semiconductor optoelectronic device package
US4393393A (en) * 1979-08-13 1983-07-12 Mcdonnell Douglas Corporation Laser diode with double sided heat sink
JPS5749287A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Stem of semiconductor laser
JPS58145169A (ja) * 1982-02-23 1983-08-29 Nec Corp 光半導体装置
US4761788A (en) * 1985-10-28 1988-08-02 American Telephone And Telegraph Company Stripline mount for semiconductor lasers
US4937660A (en) * 1988-12-21 1990-06-26 At&T Bell Laboratories Silicon-based mounting structure for semiconductor optical devices
US5024966A (en) * 1988-12-21 1991-06-18 At&T Bell Laboratories Method of forming a silicon-based semiconductor optical device mount
DE10064959C2 (de) 2000-12-20 2003-01-02 Infineon Technologies Ag Koppelvorrichtung zum Anschluß eines Lichtwellenleiters an eine optische Sende- oder Empfangseinheit
US7061949B1 (en) * 2002-08-16 2006-06-13 Jds Uniphase Corporation Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1295306A (US07534539-20090519-C00280.png) * 1969-04-23 1972-11-08
JPS4915390A (US07534539-20090519-C00280.png) * 1972-05-17 1974-02-09
JPS5029284A (US07534539-20090519-C00280.png) * 1973-07-11 1975-03-25

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1127239A (fr) * 1954-07-07 1956-12-11 Benckiser Gmbh Joh A Procédé de fabrication de saucisses enveloppées de boyaux naturels minces et tendres
US3445786A (en) * 1965-02-09 1969-05-20 Philco Ford Corp Cryogenically cooled electro-optical apparatus
US3590248A (en) * 1965-04-13 1971-06-29 Massachusetts Inst Technology Laser arrays
US3585454A (en) * 1969-04-01 1971-06-15 Westinghouse Electric Corp Improved case member for a light activated semiconductor device
US3660669A (en) * 1970-04-15 1972-05-02 Motorola Inc Optical coupler made by juxtaposition of lead frame mounted sensor and light emitter
US3760297A (en) * 1972-01-20 1973-09-18 Int Standard Electric Corp Laser to optical fiber coupling
US3803511A (en) * 1972-10-18 1974-04-09 Int Standard Electric Corp Gallium arsenide laser fiber coupling
US3932184A (en) * 1973-05-29 1976-01-13 Bell Telephone Laboratories, Incorporated Fabrication of microlenses
JPS5041559A (US07534539-20090519-C00280.png) * 1973-08-02 1975-04-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1295306A (US07534539-20090519-C00280.png) * 1969-04-23 1972-11-08
JPS4915390A (US07534539-20090519-C00280.png) * 1972-05-17 1974-02-09
JPS5029284A (US07534539-20090519-C00280.png) * 1973-07-11 1975-03-25

Also Published As

Publication number Publication date
CH593574A5 (US07534539-20090519-C00280.png) 1977-12-15
FR2306549A1 (fr) 1976-10-29
JPS51126783A (en) 1976-11-05
DE2612657A1 (de) 1976-10-21
GB1487010A (en) 1977-09-28
FR2306549B1 (US07534539-20090519-C00280.png) 1982-12-10
US4097891A (en) 1978-06-27

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