JPS5638829A - Feeding and discharging mechanism for machining device of semiconductor mold package frame - Google Patents

Feeding and discharging mechanism for machining device of semiconductor mold package frame

Info

Publication number
JPS5638829A
JPS5638829A JP11445779A JP11445779A JPS5638829A JP S5638829 A JPS5638829 A JP S5638829A JP 11445779 A JP11445779 A JP 11445779A JP 11445779 A JP11445779 A JP 11445779A JP S5638829 A JPS5638829 A JP S5638829A
Authority
JP
Japan
Prior art keywords
frame
distance
work
feeding
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11445779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6129145B2 (enExample
Inventor
Kenji Nakazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamada Manufacturing Co Ltd
Original Assignee
Yamada Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamada Seisakusho KK filed Critical Yamada Seisakusho KK
Priority to JP11445779A priority Critical patent/JPS5638829A/ja
Publication of JPS5638829A publication Critical patent/JPS5638829A/ja
Publication of JPS6129145B2 publication Critical patent/JPS6129145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP11445779A 1979-09-06 1979-09-06 Feeding and discharging mechanism for machining device of semiconductor mold package frame Granted JPS5638829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11445779A JPS5638829A (en) 1979-09-06 1979-09-06 Feeding and discharging mechanism for machining device of semiconductor mold package frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11445779A JPS5638829A (en) 1979-09-06 1979-09-06 Feeding and discharging mechanism for machining device of semiconductor mold package frame

Publications (2)

Publication Number Publication Date
JPS5638829A true JPS5638829A (en) 1981-04-14
JPS6129145B2 JPS6129145B2 (enExample) 1986-07-04

Family

ID=14638202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11445779A Granted JPS5638829A (en) 1979-09-06 1979-09-06 Feeding and discharging mechanism for machining device of semiconductor mold package frame

Country Status (1)

Country Link
JP (1) JPS5638829A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01182692A (ja) * 1988-01-12 1989-07-20 Maruei Kogyo Kk 管継手
JPH029396U (enExample) * 1988-06-30 1990-01-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01182692A (ja) * 1988-01-12 1989-07-20 Maruei Kogyo Kk 管継手
JPH029396U (enExample) * 1988-06-30 1990-01-22

Also Published As

Publication number Publication date
JPS6129145B2 (enExample) 1986-07-04

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