JPS5625024B2 - - Google Patents

Info

Publication number
JPS5625024B2
JPS5625024B2 JP15734176A JP15734176A JPS5625024B2 JP S5625024 B2 JPS5625024 B2 JP S5625024B2 JP 15734176 A JP15734176 A JP 15734176A JP 15734176 A JP15734176 A JP 15734176A JP S5625024 B2 JPS5625024 B2 JP S5625024B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15734176A
Other languages
Japanese (ja)
Other versions
JPS5382170A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15734176A priority Critical patent/JPS5382170A/ja
Priority to US05/862,271 priority patent/US4137628A/en
Publication of JPS5382170A publication Critical patent/JPS5382170A/ja
Publication of JPS5625024B2 publication Critical patent/JPS5625024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49787—Obtaining plural composite product pieces from preassembled workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP15734176A 1976-12-28 1976-12-28 Method of producing coupled type ic ceramic package Granted JPS5382170A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15734176A JPS5382170A (en) 1976-12-28 1976-12-28 Method of producing coupled type ic ceramic package
US05/862,271 US4137628A (en) 1976-12-28 1977-12-19 Method of manufacturing connection-type ceramic packages for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15734176A JPS5382170A (en) 1976-12-28 1976-12-28 Method of producing coupled type ic ceramic package

Publications (2)

Publication Number Publication Date
JPS5382170A JPS5382170A (en) 1978-07-20
JPS5625024B2 true JPS5625024B2 (enExample) 1981-06-10

Family

ID=15647559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15734176A Granted JPS5382170A (en) 1976-12-28 1976-12-28 Method of producing coupled type ic ceramic package

Country Status (2)

Country Link
US (1) US4137628A (enExample)
JP (1) JPS5382170A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820160B2 (ja) * 1978-06-17 1983-04-21 日本碍子株式会社 メタライズ層を備えたセラミツクス体
JPS55133597A (en) * 1979-04-06 1980-10-17 Hitachi Ltd Multilayer circuit board
GB2052497B (en) * 1979-06-25 1983-06-29 Ucb Sa 6 - amino - spiro - (penam - 2,4' - piperidine) - 3 - carboxylic acid derivatives
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
US4710332A (en) * 1982-04-15 1987-12-01 Rockwell International Corporation Process of injection molding a laser mirror substrate
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
DE3439718A1 (de) * 1984-10-30 1986-04-30 Isola Werke AG, 5160 Düren Verfahren zur herstellung von gedruckten schaltungen mit mehr als vier leitungsebenen
JPH0783068B2 (ja) * 1985-07-01 1995-09-06 日本電気株式会社 半導体装置用パツケ−ジの製造方法
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
JPH03123010A (ja) * 1989-10-05 1991-05-24 Murata Mfg Co Ltd 積層電子部品の製造方法
US5345038A (en) * 1991-07-29 1994-09-06 Kyocera America, Inc. Multi-layer ceramic packages
JP2976717B2 (ja) * 1992-09-29 1999-11-10 株式会社村田製作所 積層セラミック電子部品の製造方法
US6194085B1 (en) 1997-09-27 2001-02-27 International Business Machines Corporation Optical color tracer identifier in metal paste that bleed to greensheet
US6002951A (en) * 1997-11-12 1999-12-14 International Business Machines Corporation Multi-layer ceramic substrate having high TC superconductor circuitry
JP4421910B2 (ja) * 2004-01-29 2010-02-24 日本碍子株式会社 熱処理用トレー及びそれを用いたセラミック製品の製造方法
KR100763837B1 (ko) * 2006-07-18 2007-10-05 삼성전기주식회사 인쇄회로기판 제조방법
KR20090056004A (ko) * 2007-11-29 2009-06-03 삼성전자주식회사 이미지형성체 제조방법, 상기 방법에 의해 제조된이미지형성체 및 이를 구비하는 이미지형성장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631489A (enExample) * 1962-04-27
US3235939A (en) * 1962-09-06 1966-02-22 Aerovox Corp Process for manufacturing multilayer ceramic capacitors
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3613228A (en) * 1969-07-02 1971-10-19 Ibm Manufacture of multielement magnetic head assemblies
UST888004I4 (en) 1970-09-01 1971-07-20 Defensive publication
US3815187A (en) * 1972-07-12 1974-06-11 Union Carbide Corp Process for making ceramic capacitors
US3926746A (en) * 1973-10-04 1975-12-16 Minnesota Mining & Mfg Electrical interconnection for metallized ceramic arrays
JPS51132460A (en) * 1975-05-14 1976-11-17 Hitachi Ltd Method of manufacturing ceramic wiring substrate

Also Published As

Publication number Publication date
JPS5382170A (en) 1978-07-20
US4137628A (en) 1979-02-06

Similar Documents

Publication Publication Date Title
FI771913A7 (enExample)
JPS5625024B2 (enExample)
FI760880A7 (enExample)
FR2373306B1 (enExample)
FI761049A7 (enExample)
DK297277A (enExample)
FR2360934B2 (enExample)
JPS5613553Y2 (enExample)
JPS533002B2 (enExample)
FR2364790B3 (enExample)
JPS5618542B2 (enExample)
JPS52119943U (enExample)
FI771362A7 (enExample)
FR2348372B1 (enExample)
FI761134A7 (enExample)
JPS5245865U (enExample)
JPS5329139U (enExample)
FI770918A7 (enExample)
JPS5319633U (enExample)
JPS5632715Y2 (enExample)
JPS5638761B2 (enExample)
JPS52170113U (enExample)
JPS5357209U (enExample)
JPS53113589U (enExample)
JPS5319718U (enExample)