JPS5624438A - Phenolic resin molding compound - Google Patents

Phenolic resin molding compound

Info

Publication number
JPS5624438A
JPS5624438A JP9976479A JP9976479A JPS5624438A JP S5624438 A JPS5624438 A JP S5624438A JP 9976479 A JP9976479 A JP 9976479A JP 9976479 A JP9976479 A JP 9976479A JP S5624438 A JPS5624438 A JP S5624438A
Authority
JP
Japan
Prior art keywords
phenolic resin
composition
cadmium
hydroxide
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9976479A
Other languages
Japanese (ja)
Inventor
Takaaki Sakamoto
Naokatsu Fujita
Taro Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9976479A priority Critical patent/JPS5624438A/en
Publication of JPS5624438A publication Critical patent/JPS5624438A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To prepare a phenolic resin molding compound having further improved injection moldability and heat resistance without lowering the mechanical strength of the molded articles, and suitable for molding use, by adding the oxides, hydroxides, etc. of zinc and cadmium to a phenolic resin.
CONSTITUTION: A phenolic resin is compounded with 0.5W20.0wt%, based on the whole composition, of at least one compound selected from the oxide, hydroxide and basic salts of zinc, and oxide, hydroxide and basic salts of cadmium. Addition of wood flour, inorganic powder, glass fiber, etc. as reinforcing agent, fillers, etc. to the composition improves the high temperature rigidity, appearance, heat distortion temperature, etc. of the molded article. The composition can be kneaded without heat generation nor thickening, and complete mixing can be achieved, which assures the heat resistance improving effect of said compounds, and the affinity of the resin with the reinforcing agent and the filler.
COPYRIGHT: (C)1981,JPO&Japio
JP9976479A 1979-08-04 1979-08-04 Phenolic resin molding compound Pending JPS5624438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9976479A JPS5624438A (en) 1979-08-04 1979-08-04 Phenolic resin molding compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9976479A JPS5624438A (en) 1979-08-04 1979-08-04 Phenolic resin molding compound

Publications (1)

Publication Number Publication Date
JPS5624438A true JPS5624438A (en) 1981-03-09

Family

ID=14256035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9976479A Pending JPS5624438A (en) 1979-08-04 1979-08-04 Phenolic resin molding compound

Country Status (1)

Country Link
JP (1) JPS5624438A (en)

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