JPS5624112A - Cutting method for specific layer of filmy synthetic resin laminate - Google Patents

Cutting method for specific layer of filmy synthetic resin laminate

Info

Publication number
JPS5624112A
JPS5624112A JP9931579A JP9931579A JPS5624112A JP S5624112 A JPS5624112 A JP S5624112A JP 9931579 A JP9931579 A JP 9931579A JP 9931579 A JP9931579 A JP 9931579A JP S5624112 A JPS5624112 A JP S5624112A
Authority
JP
Japan
Prior art keywords
layer
filmy
synthetic resin
cut
coat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9931579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117595B2 (https=
Inventor
Yoshitake Oka
Tetsuo Ishihara
Masane Suzuki
Motonori Kanetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujinon Corp
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Fuji Photo Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd, Fuji Photo Optical Co Ltd filed Critical Daicel Corp
Priority to JP9931579A priority Critical patent/JPS5624112A/ja
Priority to US06/174,065 priority patent/US4323757A/en
Publication of JPS5624112A publication Critical patent/JPS5624112A/ja
Publication of JPS6117595B2 publication Critical patent/JPS6117595B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means for directional control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP9931579A 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate Granted JPS5624112A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9931579A JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate
US06/174,065 US4323757A (en) 1979-08-03 1980-07-31 Method for cutting specific layer of synthetic resin laminated film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9931579A JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate

Publications (2)

Publication Number Publication Date
JPS5624112A true JPS5624112A (en) 1981-03-07
JPS6117595B2 JPS6117595B2 (https=) 1986-05-08

Family

ID=14244197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9931579A Granted JPS5624112A (en) 1979-08-03 1979-08-03 Cutting method for specific layer of filmy synthetic resin laminate

Country Status (2)

Country Link
US (1) US4323757A (https=)
JP (1) JPS5624112A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255293A (ja) * 1984-05-31 1985-12-16 Mitsui Toatsu Chem Inc レ−ザ−光による塗膜切断方法
JPS63172636A (ja) * 1987-12-24 1988-07-16 十條製紙株式会社 紙容器に開口用切り込みを形成する方法
JP2005313475A (ja) * 2004-04-28 2005-11-10 Sumitomo Electric Ind Ltd 樹脂加工方法および樹脂加工装置
JP2011167748A (ja) * 2010-02-22 2011-09-01 Panasonic Electric Works Co Ltd 樹脂シートのカット方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4486645A (en) * 1980-07-03 1984-12-04 Armour Food Company Process for removing packaging materials from packaged products
US4553016A (en) * 1982-06-09 1985-11-12 Ube Industries, Ltd. Elongated non-metallic sheet having a metal embedded therein or attached thereon
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
US4987287A (en) * 1989-05-12 1991-01-22 Prevent-A-Crime International, Inc. Method of making a stencil for etching glass
US5151572A (en) * 1989-05-12 1992-09-29 Prevent-A-Crime International, Inc. Method of making a stencil for etching glass
DE69407620T2 (de) * 1993-12-17 1998-04-09 Minnesota Mining & Mfg Ablationsabbildung durch quasikontaktlithographie
US6191382B1 (en) 1998-04-02 2001-02-20 Avery Dennison Corporation Dynamic laser cutting apparatus
US5997985A (en) * 1998-09-10 1999-12-07 Northrop Grumman Corporation Method of forming acoustic attenuation chambers using laser processing of multi-layered polymer films
US6205160B1 (en) 1998-09-24 2001-03-20 Branson Ultrasonics Corporation Laser diode array
US20030218278A1 (en) * 2002-05-21 2003-11-27 Tait Bruce E. Method for subdividing multilayer optical film cleanly and rapidly
US6991695B2 (en) * 2002-05-21 2006-01-31 3M Innovative Properties Company Method for subdividing multilayer optical film cleanly and rapidly
US7396493B2 (en) * 2002-05-21 2008-07-08 3M Innovative Properties Company Multilayer optical film with melt zone to control delamination
WO2008041349A1 (fr) * 2006-09-27 2008-04-10 Shibaura Mechatronics Corporation Appareil de découpe de film et procédé de découpe de film
PL2658674T3 (pl) 2010-12-30 2017-08-31 3M Innovative Properties Co Przyrząd do przekształcania laserowego wykorzystujący element wsporczy z zewnętrzną warstwą ze złota; sposób przekształcania laserowego arkusza materiału przy wykorzystaniu takiego przyrządu
CN103517938A (zh) * 2011-07-26 2014-01-15 国立大学法人新泻大学 微粒的制造方法
CN107824974A (zh) * 2016-09-14 2018-03-23 3M创新有限公司 交通标志制作方法及系统
WO2020039970A1 (ja) * 2018-08-20 2020-02-27 日本ゼオン株式会社 カットフィルムの製造方法、カットフィルム、及びカットフィルム用フィルム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262122A (en) * 1963-05-01 1966-07-19 Ibm Thermoplastic memory
US3435186A (en) * 1964-02-20 1969-03-25 Ibm Selective piercing and machining of sheet material
US3629546A (en) * 1969-04-02 1971-12-21 American Can Co Air-cooled laser processing of materials
US3668028A (en) * 1970-06-10 1972-06-06 Du Pont Method of making printing masks with high energy beams
US3909582A (en) * 1971-07-19 1975-09-30 American Can Co Method of forming a line of weakness in a multilayer laminate
US3790744A (en) * 1971-07-19 1974-02-05 American Can Co Method of forming a line of weakness in a multilayer laminate
US3889272A (en) * 1974-05-30 1975-06-10 Bell Telephone Labor Inc Metal film recording media for laser writing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255293A (ja) * 1984-05-31 1985-12-16 Mitsui Toatsu Chem Inc レ−ザ−光による塗膜切断方法
JPS63172636A (ja) * 1987-12-24 1988-07-16 十條製紙株式会社 紙容器に開口用切り込みを形成する方法
JP2005313475A (ja) * 2004-04-28 2005-11-10 Sumitomo Electric Ind Ltd 樹脂加工方法および樹脂加工装置
JP2011167748A (ja) * 2010-02-22 2011-09-01 Panasonic Electric Works Co Ltd 樹脂シートのカット方法

Also Published As

Publication number Publication date
US4323757A (en) 1982-04-06
JPS6117595B2 (https=) 1986-05-08

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