JPS562263U - - Google Patents
Info
- Publication number
- JPS562263U JPS562263U JP8315279U JP8315279U JPS562263U JP S562263 U JPS562263 U JP S562263U JP 8315279 U JP8315279 U JP 8315279U JP 8315279 U JP8315279 U JP 8315279U JP S562263 U JPS562263 U JP S562263U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315279U JPS562263U (ja) | 1979-06-18 | 1979-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8315279U JPS562263U (ja) | 1979-06-18 | 1979-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS562263U true JPS562263U (ja) | 1981-01-10 |
Family
ID=29316360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8315279U Pending JPS562263U (ja) | 1979-06-18 | 1979-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS562263U (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58203525A (ja) * | 1982-05-21 | 1983-11-28 | Kyokuto Kaihatsu Kogyo Co Ltd | 減圧弁 |
| JPH0249478A (ja) * | 1988-05-31 | 1990-02-19 | Iwasaki Electric Co Ltd | 光ファイバ用半導体発光装置 |
| JP2008032522A (ja) * | 2006-07-28 | 2008-02-14 | Nitta Ind Corp | 光ファイバを用いた触覚センサ |
| JP2009128430A (ja) * | 2007-11-20 | 2009-06-11 | Nitto Denko Corp | 光導波路デバイスの製法およびそれによって得られる光導波路デバイス、並びにそれに用いられる光導波路接続構造 |
-
1979
- 1979-06-18 JP JP8315279U patent/JPS562263U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58203525A (ja) * | 1982-05-21 | 1983-11-28 | Kyokuto Kaihatsu Kogyo Co Ltd | 減圧弁 |
| JPH0249478A (ja) * | 1988-05-31 | 1990-02-19 | Iwasaki Electric Co Ltd | 光ファイバ用半導体発光装置 |
| JP2008032522A (ja) * | 2006-07-28 | 2008-02-14 | Nitta Ind Corp | 光ファイバを用いた触覚センサ |
| JP2009128430A (ja) * | 2007-11-20 | 2009-06-11 | Nitto Denko Corp | 光導波路デバイスの製法およびそれによって得られる光導波路デバイス、並びにそれに用いられる光導波路接続構造 |
| JP4503064B2 (ja) * | 2007-11-20 | 2010-07-14 | 日東電工株式会社 | 光導波路デバイスの製法およびそれによって得られる光導波路デバイス、並びにそれに用いられる光導波路接続構造 |