JPS5621733A - Electrospark machining for cutting off wire - Google Patents

Electrospark machining for cutting off wire

Info

Publication number
JPS5621733A
JPS5621733A JP9531479A JP9531479A JPS5621733A JP S5621733 A JPS5621733 A JP S5621733A JP 9531479 A JP9531479 A JP 9531479A JP 9531479 A JP9531479 A JP 9531479A JP S5621733 A JPS5621733 A JP S5621733A
Authority
JP
Japan
Prior art keywords
workpiece
power supply
finer
working
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9531479A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9531479A priority Critical patent/JPS5621733A/en
Publication of JPS5621733A publication Critical patent/JPS5621733A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting

Abstract

PURPOSE:To permit sectional surface roughness of workpiece to be finer and finer by working repeatedly said sectional surface with working condition being altered gradually corresponding to the number of the repetition after the workpiece is halved. CONSTITUTION:When a workpiece 16 is halved by cut, the sectional surface 38 of the workpiece is formed with relatively large irregularties A. A power supply for reworking this irregular surface 38 should have at least a capacity value sufficient for working the whole work surface 38, and a profile line 36 according to this power supply should be set under the surface of the workpiece 16 deeper than the deepest bottom of the irregularities. According to this work, the worked surface 38 provides an extremely small swell B. By further work with finer adjustment of the power supply is provided a final desired surface roughness C of the worked surface 38 extremely efficiently and accurately.
JP9531479A 1979-07-26 1979-07-26 Electrospark machining for cutting off wire Pending JPS5621733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9531479A JPS5621733A (en) 1979-07-26 1979-07-26 Electrospark machining for cutting off wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9531479A JPS5621733A (en) 1979-07-26 1979-07-26 Electrospark machining for cutting off wire

Publications (1)

Publication Number Publication Date
JPS5621733A true JPS5621733A (en) 1981-02-28

Family

ID=14134285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9531479A Pending JPS5621733A (en) 1979-07-26 1979-07-26 Electrospark machining for cutting off wire

Country Status (1)

Country Link
JP (1) JPS5621733A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260070A (en) * 2007-04-10 2008-10-30 Sodick Co Ltd Wire-cut electro-discharge machining method
JP2013166196A (en) * 2012-02-15 2013-08-29 Fanuc Ltd Wire discharge processing machine that carry out distortion removal process
WO2016046922A1 (en) * 2014-09-24 2016-03-31 三菱電機株式会社 Wire electrical discharge machining apparatus and semiconductor wafer manufacturing method
JP2019089159A (en) * 2017-11-14 2019-06-13 ファナック株式会社 Control device of wire electric discharge machine and control method of wire electric discharge machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260070A (en) * 2007-04-10 2008-10-30 Sodick Co Ltd Wire-cut electro-discharge machining method
JP2013166196A (en) * 2012-02-15 2013-08-29 Fanuc Ltd Wire discharge processing machine that carry out distortion removal process
WO2016046922A1 (en) * 2014-09-24 2016-03-31 三菱電機株式会社 Wire electrical discharge machining apparatus and semiconductor wafer manufacturing method
US10300542B2 (en) 2014-09-24 2019-05-28 Mitsubishi Electric Corporation Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer
JP2019089159A (en) * 2017-11-14 2019-06-13 ファナック株式会社 Control device of wire electric discharge machine and control method of wire electric discharge machine
US10792745B2 (en) 2017-11-14 2020-10-06 Fanuc Corporation Controller for wire electrical discharge machine and control method of wire electrical discharge machine

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